Abstract: The present disclosure provides a method for preparing a composition including mesenchymal stem cells, extracellular vesicles produced by the mesenchymal stem cells, and growth factors, the composition prepared by the method, and use of the composition for treating arthritis. The composition of the present disclosure achieves the effect of treating arthritis through various efficacy experiments.

Abstract: The present invention relates to a method for preparing a modified stem cell, including the following steps: a cell culture step: culturing stem cells in a first culture medium of a culture dish at a predetermined cell density, and removing the first culture medium after a first culture time to obtain a first cell intermediate; an activity stimulation step: preserving the first cell intermediate in a freezing container having a cell cryopreservation solution, and performing a constant temperature stimulation treatment or a variable temperature stimulation treatment for at least more than 1 day; and a product collection step: after completing the activity stimulation step, placing the freezing container in an environment at a thawing temperature for thawing, and then removing the cell cryopreservation solution to obtain the modified stem cell. The modified stem cell can release at least one or more of IL-4, IL-5, IL-13, G-CSF, Fractalkine, and EGF.

Abstract: The present disclosure provides a method for treating liver cirrhosis by using a composition including mesenchymal stem cells, extracellular vesicles produced by the mesenchymal stem cells, and growth factors. The composition of the present disclosure achieves the effect of treating liver cirrhosis through various efficacy experiments.

Abstract: A liquid-cooling device includes multiple water blocks and at least one connection tube. Each of the water blocks has a water incoming end, a water outgoing end and a water-receiving space in communication with the water incoming end and the water outgoing end. The connection tube is disposed between each two water blocks. Two ends of the connection tube are respectively connected with the water incoming end of one of the two water blocks and the water outgoing end of the other water block, whereby the water-receiving spaces of the two water blocks communicate with each other via the connection tube. The connection tube has at least one bellows section between two ends of the connection tube. The liquid-cooling device solves the problems of the conventional liquid-cooling device that when the water block is welded, thermal deformation is produced to cause tolerance and the manufacturing cost is higher.

Abstract: A semiconductor device includes a substrate, a dielectric layer disposed over the substrate, and an interconnect structure extending through the dielectric layer. The dielectric layer includes a low-k dielectric material which includes silicon carbonitride having a carbon content ranging from about 30 atomic % to about 45 atomic %. The semiconductor device further includes a thermal dissipation feature extending through the dielectric layer and disposed to be spaced apart from the interconnect structure.

Abstract: A ferroelectric memory device and a semiconductor die are provided. The ferroelectric memory device includes a gate electrode; a channel layer, overlapped with the gate electrode; source/drain contacts, in contact with separate ends of the channel layer; a ferroelectric layer, lying between the gate electrode and the channel layer; and a first insertion layer, extending in between the ferroelectric layer and the channel layer, and comprising a metal carbonitride or a metal nitride.

Abstract: Disclosed in the present invention is an optimized cell transplant. The optimized cell transplant is formed by performing gene induction and modification on a mesenchymal stem cell in the form of a small molecule and protein composition. The expression levels of CD200 gene, Galectin-9 gene and VISTA gene can be increased synchronously after cell culture. Vector virus infection and plasmid transfection are not required in the cell preparation process, so that high biological safety and great clinical application value of cells are achieved.

Abstract: A thermal inkjet printhead chip structure includes a substrate, an oxide layer formed on the substrate, at least one driver circuitry each including a source, a drain and a gate and formed on the substrate and further surrounded by the oxide layer, a dielectric layer, a buffer layer, a resistive layer and a conductive layer. The dielectric layer is formed on the driver circuitry and has openings formed therethrough to expose the source and drain. The buffer layer is formed on the dielectric layer, covering the source and drain and connected to the source and drain. The resistive layer is formed on the buffer layer and has at least one heating area. The resistive layer extends above the source and drain and is connected to the source and drain. The conductive layer is formed on the resistive layer and exposes the heating area. A manufacturing method also is provided.

Abstract: An inkjet printhead including a substrate, a plurality of heaters, multiple pairs of leads, an ink chamber layer, and a nozzle plate is provided. The substrate has a top surface and a plurality of ink channels through the substrate in the direction substantially vertical to the top surface. The heaters, the multiple pairs of leads, and the ink chamber layer are disposed on the surface of the substrate. The multiple pairs of leads are electrically coupled to the corresponding heaters respectively, and the heaters are respectively adjacent to the corresponding ink channels. The ink chamber layer has a plurality of ink chambers which respectively expose the corresponding heaters and the corresponding ink channels. The nozzle plate is disposed on the ink chamber layer and has a plurality of nozzles through the nozzle plate.

Abstract: A thermal inkjet printhead chip structure includes a substrate, an oxide layer formed on the substrate, at least one driver circuitry each including a source, a drain and a gate and formed on the substrate and further surrounded by the oxide layer, a dielectric layer, a buffer layer, a resistive layer and a conductive layer. The dielectric layer is formed on the driver circuitry and has openings formed therethrough to expose the source and drain. The buffer layer is formed on the dielectric layer, covering the source and drain and connected to the source and drain. The resistive layer is formed on the buffer layer and has at least one heating area. The resistive layer extends above the source and drain and is connected to the source and drain. The conductive layer is formed on the resistive layer and exposes the heating area. A manufacturing method also is provided.

Abstract: An inkjet printhead including a substrate, a plurality of heaters, multiple pairs of leads, an ink chamber layer, and a nozzle plate is provided. The substrate has a top surface and a plurality of ink channels through the substrate in the direction substantially vertical to the top surface. The heaters, the multiple pairs of leads, and the ink chamber layer are disposed on the surface of the substrate. The multiple pairs of leads are electrically coupled to the corresponding heaters respectively, and the heaters are respectively adjacent to the corresponding ink channels. The ink chamber layer has a plurality of ink chambers which respectively expose the corresponding heaters and the corresponding ink channels. The nozzle plate is disposed on the ink chamber layer and has a plurality of nozzles through the nozzle plate.

Abstract: An inkjet printhead chip structure and a method of estimating the working life through the detection of any defect on the chip structure. The method includes laying a metallic layer such as a tantalum layer over the chip and then shaping the metallic layer into a protective layer circuit. A portion of the metal protective layer covers the heating elements embedded in the chip. In printing, the heating elements heat up the ink to produce jets of ink. However, a portion of the heat is transferred to the metal protective layer thereby raising its temperature. Heat on the metal protective layer combined with any strayed residual ink bubbles that impinge upon the surface of the metal protective layer causes the metal to age. Since resistance of the metal protective layer will increase proportionally to the amount of aging, a measurement of the resistance is capable of estimating how much longer a given chip is suitable for use.

Abstract: A method of manufacturing a printhead chip comprising the steps of first forming a resistive layer and a conductive layer over a substrate, wherein the resistive layer and the conductive layer act as a heater and a conductive line respectively. Thereafter, at least one insulating layer is deposited over the conductive layer and the resistive layer. Next, at least one metallic layer is deposited over the insulating layer without performing any intermediate photolithographic or etching operations, and then the metallic layer is patterned to form a contact opening. The contact opening passes through the metallic layer and the insulating layer while exposing a portion of the conductive layer. Subsequently, a metal plug is formed in the contact opening so that the metallic layer and the conductive layer are connected, thereby forming an electric circuit. Finally, a thick film is formed over the metallic layer acting as an ink channel for the printhead.

Abstract: A method of manufacturing a printhead chip comprising the steps of first forming a resistive layer and a conductive layer over a substrate, wherein the resistive layer and the conductive layer act as a heater and a conductive line respectively. Thereafter, at least one insulating layer is deposited over the conductive layer and the resistive layer. Next, at least one metallic layer is deposited over the insulating layer without performing any intermediate photolithographic or etching operations, and then the metallic layer is patterned to form a contact opening. The contact opening passes through the metallic layer and the insulating layer while exposing a portion of the conductive layer. Subsequently, a metal plug is formed in the contact opening so that the metallic layer and the conductive layer are connected, thereby forming an electric circuit. Finally, a thick film is formed over the metallic layer acting as an ink channel for the printhead.

Abstract: A method for fabricating a high-density ink-jet print head that utilizes a common high-density nozzle plate as a base for aligning a multiple of ink-jet printing modules. The high-density nozzle plate has wide body, high-density, high-resolution nozzles. The nozzle plate is fabricated using conventional electrochemical machining or laser machining techniques. The nozzle plate is able to provide not only a base for aligning each ink-jet printing module, but also the alignment necessary for the whole group of the ink-jet printing modules so that all modules are aligned properly. Therefore, the alignment operation can be carried out without the need for sophisticated alignment equipment and the alignment accuracy is high.

Abstract: A magnetoelectric apparatus for measuring the droplet frequency response at a printhead by applying a method comprising a metallic detecting plate and a magnetic ring, and a method using the foregoing apparatus to determine the maximum droplet frequency response of the printhead. When an ink drop jetted from the nozzle makes contact with the detecting plate, which is perpendicular to the nozzle plate of the printhead, a current flows through the detecting plate immediately, and is detected as a portion of an expected signal. As soon as the ink drop leaves the nozzle completely, the foregoing current no longer exists. However, the magnetic ring generates an induced current that flows in the same direction as that of the foregoing current to complement the absence thereof, wherein the induced current is also detected as another portion of the expected signal. The expected signal is then processed by a signal-processing routine for determining the maximum droplet frequency response of the inkjet printhead.

Abstract: A method for fabricating a printhead chip. A silicon substrate having a first surface and a second surface is provided. A plurality of grooves is formed in the first surface by an etching process. A plurality of ink slots are formed in each of the grooves. Overflow grooves are formed in the first surface beside the grooves. A plurality of firing chambers is formed on the second surface. Each of the firing chambers is respectively connected to each of the ink slots.

Abstract: A method of prolonging the lifetime of a thermal-bubble-ink-jet print head. A first pulse is provided to a heater of the print head for generating a first bubble to expel an ink drop. A second pulse is provided to the heater after a delay time for generating a second bubble is generated. The second pulse is not large enough to expel another ink drop.