Patents by Inventor Ming Liu

Ming Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240154749
    Abstract: This application provides a pilot signal transmission method and a related apparatus. The method includes: A first device determines a first frequency band to which a discrete RU allocated to the first device belongs; and the first device sends a first pilot signal of the first device to a second device on all pilot subcarriers included in the first frequency band. According to embodiments of this application, problems such as narrowband interference and frequency selective fading are avoided, and pilot signal transmission reliability is improved.
    Type: Application
    Filed: December 29, 2023
    Publication date: May 9, 2024
    Inventors: Yuxin LU, Chenchen LIU, Jian YU, Yunbo LI, Ming GAN
  • Publication number: 20240153257
    Abstract: A monitoring system based on a digital converter station includes a first monitoring terminal deployed at a first-level monitoring side, a second monitoring terminal deployed at a second-level monitoring side, and a third monitoring terminal deployed at a third-level monitoring side; the monitoring terminal at each level includes a communication module, a human-machine interaction module, a device status monitoring module, a device alarm management module, a video fusion processing module, and a data transmission adjustment and control module.
    Type: Application
    Filed: January 11, 2024
    Publication date: May 9, 2024
    Applicants: STATE GRID CORPORATION OF CHINA, STATE GRID ECONOMIC AND TECHNOLOGICAL RESEARCH INSTITUTE CO., LTD, NR ELECTRIC CO., LTD., XJ GROUP CORPORATION, NARI TECHNOLOGY CO., LTD, BEIJING SGITG ACCENTURE INFORMATION TECHNOLOGY CENTER CO., LTD., HUAWEI TECHNOLOGY CO., LTD
    Inventors: Wei JIN, Qing WANG, Xianshan GUO, Jun LYU, Siyuan LIU, Xiang ZHANG, Yanguo WANG, Zhanguo ZHANG, Haifeng WANG, Chong TONG, Ming LI, Wei CHENG, Ning ZHAO, Zhou CHEN, Xiaojun HOU, Hanqing ZHAO
  • Publication number: 20240154777
    Abstract: This application provides a method and an apparatus for sending a physical layer protocol data unit, and a method and an apparatus for receiving a physical layer protocol data unit. The method includes: generating a physical layer protocol data unit PPDU; and sending the PPDU on one or more discrete resource units RUs, where the discrete RU includes a plurality of subcarriers that are discrete in frequency domain. The subcarriers in the discrete RU provided in embodiments are discontiguous, and transmit power of discrete subcarriers increases, so that a transmitting device can transmit the PPDU at higher transmit power. This application is applied to a wireless local area network system supporting a next-generation Wi-Fi protocol of IEEE 802.11ax, for example, 802.11 family of protocols such as 802.11be or EHT.
    Type: Application
    Filed: January 12, 2024
    Publication date: May 9, 2024
    Inventors: Chenchen LIU, Yuxin LU, Bo GONG, Ming GAN
  • Publication number: 20240154748
    Abstract: This application provides a method for sending data in a wireless network, and a related apparatus. The method includes: A first device determines a distributed RU allocated to the first device, where the distributed RU includes data subcarriers and pilot subcarriers, all subcarriers of one distributed RU are distributed on a first frequency band, a size of the first frequency band is 20 MHz, the first frequency band includes a maximum of 18 pilot subcarriers that are disposed at an interval, a quantity of pilot subcarriers included in one distributed RU is greater than or equal to 2, and at least two pilot subcarriers included in one distributed RU are spaced by at least M pilot subcarriers; and the first device sends a physical layer protocol data unit PPDU on the distributed RU.
    Type: Application
    Filed: December 28, 2023
    Publication date: May 9, 2024
    Inventors: Yuxin LU, Chenchen LIU, Ming GAN, Yunbo LI
  • Patent number: 11975619
    Abstract: Various disclosed embodiments include illustrative controller units, direct current fast charging (DCFC) units, and methods. In an illustrative embodiment, a controller unit includes a controller and a memory configured to store computer-executable instructions. The computer-executable instructions are configured to cause the controller to determine status of a power electronics module (PEM) of a direct current fast charging (DCFC) unit, and instruct the PEM to control power quality of a three-phase alternating current (AC) grid power signal in response to the determined status being available.
    Type: Grant
    Filed: March 13, 2023
    Date of Patent: May 7, 2024
    Assignee: Rivian IP Holdings, LLC
    Inventors: Yang Liu, Steven Schulz, Ming Li
  • Patent number: 11975216
    Abstract: A radiation treatment head can include: a radiation source and a primary collimator, wherein the radiation source is configured to emit a radioactive beam; wherein the primary collimator is provided with a plurality of primary collimation channel groups; each of the primary collimation channel groups includes at least one primary collimation channel; and the radiation source and the primary collimator are movable relative to each other, so that the beam emitted from the radiation source is permissible to pass through any one of the primary collimation channels; and wherein the beam emitted from the radiation source, after passing through primary collimation channels of different primary collimation channel groups, forms fields with different sizes of areas on a reference plane.
    Type: Grant
    Filed: April 26, 2018
    Date of Patent: May 7, 2024
    Assignee: Our United Corporation
    Inventors: Hongbin Zhao, Huiliang Wang, Ming Zhong, Haifeng Liu
  • Patent number: 11977432
    Abstract: A data processing circuit and a fault-mitigating method are provided. In the method, multiple sub-sequences are divided from sequence data. A first sub-sequence of the sub-sequences is accessed from a memory for a multiply-accumulate (MAC) operation to obtain a first computed result. The MAC operation is performed on a second sub-sequence of the sub-sequences in the memory to obtain a second computed result. The first and the second computed results are combined, where the combined result of the first and the second computed results is related to the result of the MAC operation on the sequence data directly. Accordingly, the error rate could be reduced, so as to mitigate fault.
    Type: Grant
    Filed: October 25, 2021
    Date of Patent: May 7, 2024
    Assignee: Skymizer Taiwan Inc.
    Inventors: Shu-Ming Liu, Jen-ho Kuo, Wen Li Tang, Kai-Chiang Wu
  • Patent number: 11978526
    Abstract: A data processing circuit and a fault mitigating method are provided. The method is adapted for a memory having at least one fault bit. The memory provides a block for data storage. A difference between an output of a value of a plurality of bits input to at least one computing layer in a neural network and a correct value is determined. The bits are respectively considered the at least one fault bit. A repair condition is determined based on the difference. The repair condition includes a correspondence between a position where the fault bit is located in the block and at least one non-fault bit in the memory. A value of at least one non-fault bit of the memory replaces a value of the fault bit based on the repair condition.
    Type: Grant
    Filed: March 28, 2022
    Date of Patent: May 7, 2024
    Assignee: Skymizer Taiwan Inc.
    Inventors: Shu-Ming Liu, Kai-Chiang Wu, Chien-Fa Chen, Wen Li Tang
  • Publication number: 20240145596
    Abstract: A device includes a fin extending from a semiconductor substrate; a gate stack over the fin; a first spacer on a sidewall of the gate stack; a source/drain region in the fin adjacent the first spacer; an inter-layer dielectric layer (ILD) extending over the gate stack, the first spacer, and the source/drain region, the ILD having a first portion and a second portion, wherein the second portion of the ILD is closer to the gate stack than the first portion of the ILD; a contact plug extending through the ILD and contacting the source/drain region; a second spacer on a sidewall of the contact plug; and an air gap between the first spacer and the second spacer, wherein the first portion of the ILD extends across the air gap and physically contacts the second spacer, wherein the first portion of the ILD seals the air gap.
    Type: Application
    Filed: January 2, 2024
    Publication date: May 2, 2024
    Inventors: Su-Hao Liu, Kuo-Ju Chen, Kai-Hsuan Lee, I-Hsieh Wong, Cheng-Yu Yang, Liang-Yin Chen, Huicheng Chang, Yee-Chia Yeo, Syun-Ming Jang, Meng-Han Chou
  • Publication number: 20240145697
    Abstract: A multi-layer cathode coating for positive electrode of a rechargeable electrochemical cell (or secondary cell) (such as a lithium-ion secondary battery) and a secondary battery including a cathode having a multi-layer cathode coating. Multi-layer cathode coatings containing blends of one or more cathode active materials in certain weight ratios thereof.
    Type: Application
    Filed: October 27, 2022
    Publication date: May 2, 2024
    Applicant: SAFT AMERICA
    Inventors: Xilin Chen, Frank Cao, Carine Margez Steinway, Kamen Nechev, Shih-Chieh Liao, Chia-Ming Chang, Dar-Jen Liu
  • Publication number: 20240147673
    Abstract: A cooling device for rack servers and cooling method for rack servers are provided. The cooling device for rack servers includes an environmental temperature sensor, a humidity sensor, a coolant temperature sensor, an electronic valve, and a controller. The controller is configured to compute a dew point temperature according to an ambient temperature and an ambient humidity sensed by the environmental temperature sensor and the humidity sensor, compute a temperature difference between a outlet-liquid temperature of a coolant and the dew point temperature, and control an opening of the electronic valve according to the temperature difference to adjust a liquid flow of the coolant outputted, such that the outlet-liquid temperature dynamically changes following the adjustment of the liquid flow.
    Type: Application
    Filed: February 28, 2023
    Publication date: May 2, 2024
    Inventors: Chia-Wei CHEN, Kun-Chieh LIAO, Yueh-Ming LIU
  • Publication number: 20240147665
    Abstract: A precooling device integrated with a cooling distribution unit and a server liquid cooling system are provided. The precooling device includes a liquid cooling row, an adapter assembly, and a cooling distribution unit. The adapter assembly includes a flow joining row and a flow distribution row. The cooling distribution unit supplies a refrigerant from an interior thereof, and includes an outlet and an inlet communicating with the interior. The outlet communicates with the flow distribution row of the adapter assembly to deliver the refrigerant for heat exchange. The refrigerant being performed the heat exchange returns to the liquid cooling row through the flow joining row of the adapter assembly for precooling, and then returns from the liquid cooling row to the cooling distribution unit through the inlet. The refrigerant is precooled before returning to the cooling distribution unit.
    Type: Application
    Filed: February 28, 2023
    Publication date: May 2, 2024
    Inventors: Chia-Wei CHEN, Kun-Chieh LIAO, Yueh-Ming LIU
  • Patent number: 11973021
    Abstract: A semiconductor device includes a first metal layer, a second metal layer, and an inter-metal dielectric layer disposed between the first metal layer and the second metal layer. The inter-metal dielectric layer includes: a first dielectric layer disposed on the first metal layer and in direct contact with the first metal layer, wherein the first dielectric layer has a stress value less than 0; a second dielectric layer disposed on the first dielectric layer, wherein the second dielectric layer has a stress value greater than 0; and a third dielectric layer disposed on the second dielectric layer, wherein the third dielectric layer has a stress value less than 0. A thickness of the third dielectric layer is greater than a thickness of the second dielectric layer, and the thickness of the second dielectric layer is greater than a thickness of the first dielectric layer.
    Type: Grant
    Filed: September 17, 2021
    Date of Patent: April 30, 2024
    Assignee: Vanguard International Semiconductor Corporation
    Inventors: Kai-Chun Chen, Shih-Ming Tseng, Hsing-Chao Liu, Hsiao-Ying Yang
  • Patent number: 11973206
    Abstract: A safety device comprises a first heat dissipation part, a second heat dissipation part and a connecting part. The connecting part is arranged between the first heat dissipation part and the second heat dissipation part, and at least one heat locking hole disposed thereon. The heat locking hole of the connecting part can reduce a diffusion speed of heat of the connecting part, so that the heat is concentrated between the first heat locking hole and the second heat locking hole, and thus the connecting part can be fused in time at a high temperature.
    Type: Grant
    Filed: October 26, 2020
    Date of Patent: April 30, 2024
    Assignee: Globe (Jiangsu) Co., Ltd
    Inventors: Chuanjun Liu, Ming Luo, Huage Wang, Xian Zhuang
  • Patent number: 11974493
    Abstract: A flexible substrate has at least one bendable region. The flexible substrate includes a flexible base, a first electrode layer disposed on the base, a first insulating layer disposed on a side of the first electrode layer away from the base, and a second electrode layer disposed on a side of the first insulating layer away from the base. The first electrode layer includes at least one first detection electrode, and the second electrode layer includes at least one second detection electrode. An orthogonal projection of a first detection electrode on the base overlaps at least partially with an orthogonal projection of a second detection electrode on the base. A region where orthogonal projections of the first detection electrode and the second detection electrode on the base are located overlaps with a bendable region.
    Type: Grant
    Filed: June 4, 2020
    Date of Patent: April 30, 2024
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Hongwei Tian, Yanan Niu, Dong Li, Ming Liu, Zheng Liu
  • Patent number: 11970601
    Abstract: A thermoplastic polyolefin composition comprises: (A) a polypropylene polymer; (B) an elastomer component; (C) an additive component; and (D) a scavenger component comprising a polyacetoacetate compound having the Formula (I) defined herein and calcium carbonate. And an article is made from the thermoplastic polyolefin composition.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: April 30, 2024
    Assignee: Dow Global Technologies LLC
    Inventors: Haiying Li, Andong Liu, Shaoguang Feng, Xiuhan Yang, Jian Zou, Ming Ming, Yonghua Gong, Xuemei Zhai
  • Publication number: 20240132420
    Abstract: The present disclosure provides a joint control method for nitrogen and phosphorus emissions in farmlands, comprising: reducing nitrogen and phosphorus input during crop sowing or planting by applying composite organic material and chemical fertilizer, wherein the composite organic material comprises: 200-250 parts of edible fungi residues, 300-350 parts of charcoal and 5-10 parts of rhamnolipid; constructing a nitrogen-phosphorus retention layer by utilizing composite microbial agent in combination with 150 parts of edible fungi residues and 20 parts of straw-based hydrogel; constructing a barrier layer by utilizing composite material, and controlling downward leaching of nitrogen and phosphorus that are not absorbed by crops, wherein the composite material of the barrier layer comprises: 25-35 parts of straw-based hydrogel, 20-30 parts of edible fungi residues, 35-55 parts of bentonite and 5-10 parts of corn flour.
    Type: Application
    Filed: March 9, 2023
    Publication date: April 25, 2024
    Applicant: Shandong Academy of Agricultural Sciences Institute of Agricultural Resources and Environment
    Inventors: Yan Li, Longyun Fu, Xiuchu Liu, Yongping Jing, Luji Bo, Ming Sun, Ziwen Zhong
  • Publication number: 20240134123
    Abstract: A photonic integrated circuit structure includes a substrate, a waveguide structure and a spot size converter. The waveguide structure is disposed over a surface of the substrate and has a receiving end. The spot size converter includes a concave mirror and a curved mirror. The concave mirror and the curved mirror are opposite to each other and have a common focus. The concave mirror is arranged to reflect a parallel beam from a transmitting end such that a first reflected beam is able to converge at the common focus, and the curved mirror is arranged to reflect the first reflected beam such that a second reflected beam is directed parallel to the receiving end of the waveguide structure.
    Type: Application
    Filed: June 13, 2023
    Publication date: April 25, 2024
    Inventors: Ping Ming LIU, Hsiao Che WU
  • Publication number: 20240134852
    Abstract: An example operation may include one or more of storing an index that comprises identifiers of role-based access privileges for a plurality of users with respect to a database, receiving a database query associated with a user from a software program, identifying data records within the database that the user has permission to access based on database accessibility rights of the user stored within the index, prior to execution of the database query, loading the identified data records into the memory and filtering out other data records from the database which the user does not have permission to access, and executing the database query on the identified data records loaded from the database and returning query results from the execution to the software program.
    Type: Application
    Filed: October 20, 2022
    Publication date: April 25, 2024
    Inventors: Jia Tian Zhong, Peng Hui Jiang, Ming Lei Zhang, Ting Ting Zhan, Le Chang, Zhen Liu, Xiao Yan Tian
  • Publication number: 20240131114
    Abstract: The present disclosure relates to the field of biopharmaceuticals and provides a nerve growth factor (NGF) fusion protein and a preparation method and use thereof. The fusion protein has a general formula represented by A-B or A-L-B, wherein A is a nerve growth factor, L is a linker peptide, and B is an Fc moiety of IgG, or an analogue of the Fc moiety of IgG, or a fragment of the Fc moiety of IgG. The fusion protein of the present disclosure has the following advantages over a wild-type NGF: higher biological activity, a half-life extended more than 17 times, greatly reduced administration frequency, and significantly increased efficacy.
    Type: Application
    Filed: December 11, 2023
    Publication date: April 25, 2024
    Inventors: Qingshuang Zhang, Lei Ma, Ming Liu