Patents by Inventor Ming Lu

Ming Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240154749
    Abstract: This application provides a pilot signal transmission method and a related apparatus. The method includes: A first device determines a first frequency band to which a discrete RU allocated to the first device belongs; and the first device sends a first pilot signal of the first device to a second device on all pilot subcarriers included in the first frequency band. According to embodiments of this application, problems such as narrowband interference and frequency selective fading are avoided, and pilot signal transmission reliability is improved.
    Type: Application
    Filed: December 29, 2023
    Publication date: May 9, 2024
    Inventors: Yuxin LU, Chenchen LIU, Jian YU, Yunbo LI, Ming GAN
  • Publication number: 20240154748
    Abstract: This application provides a method for sending data in a wireless network, and a related apparatus. The method includes: A first device determines a distributed RU allocated to the first device, where the distributed RU includes data subcarriers and pilot subcarriers, all subcarriers of one distributed RU are distributed on a first frequency band, a size of the first frequency band is 20 MHz, the first frequency band includes a maximum of 18 pilot subcarriers that are disposed at an interval, a quantity of pilot subcarriers included in one distributed RU is greater than or equal to 2, and at least two pilot subcarriers included in one distributed RU are spaced by at least M pilot subcarriers; and the first device sends a physical layer protocol data unit PPDU on the distributed RU.
    Type: Application
    Filed: December 28, 2023
    Publication date: May 9, 2024
    Inventors: Yuxin LU, Chenchen LIU, Ming GAN, Yunbo LI
  • Publication number: 20240154777
    Abstract: This application provides a method and an apparatus for sending a physical layer protocol data unit, and a method and an apparatus for receiving a physical layer protocol data unit. The method includes: generating a physical layer protocol data unit PPDU; and sending the PPDU on one or more discrete resource units RUs, where the discrete RU includes a plurality of subcarriers that are discrete in frequency domain. The subcarriers in the discrete RU provided in embodiments are discontiguous, and transmit power of discrete subcarriers increases, so that a transmitting device can transmit the PPDU at higher transmit power. This application is applied to a wireless local area network system supporting a next-generation Wi-Fi protocol of IEEE 802.11ax, for example, 802.11 family of protocols such as 802.11be or EHT.
    Type: Application
    Filed: January 12, 2024
    Publication date: May 9, 2024
    Inventors: Chenchen LIU, Yuxin LU, Bo GONG, Ming GAN
  • Publication number: 20240152386
    Abstract: An artificial intelligence accelerator includes an external command dispatcher, a first data access unit, a second data access unit, a global buffer, an internal command dispatcher, and a data/command switch. The external command dispatcher receives an address and access information. The external command dispatcher sends the access information to one of the first data access unit and the second data access unit, the first data access unit receives first data from a storage device according to the access information, and sends the first data to the global buffer. The second data access unit receives second data from the storage device according to the access information, and sends the second data. The data/command switch receives the address and the second data from the second data access unit, and sends the second data to one of the global buffer and the internal command dispatcher.
    Type: Application
    Filed: October 25, 2023
    Publication date: May 9, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yao-Hua CHEN, Juin-Ming LU
  • Publication number: 20240143922
    Abstract: A method of generating knowledge graph, performed by a processing device, includes: obtaining a knowledge document, performing word segmentation and part-of-speech tagging on the knowledge document to generate a number of tagged words, obtaining a number of sentences from the tagged words according to a default sentence pattern, wherein each of the sentences includes a subject, an adverb, a verb and an object, and the adverb corresponding to an adverb type, for each of the sentences, performing: using the subject as a first entity of a triple, using the object as a second entity of the triple, and using the adverb type and the verb as a relation in the triple, and forming a knowledge graph using the triple corresponding to each of the sentences.
    Type: Application
    Filed: November 14, 2022
    Publication date: May 2, 2024
    Applicant: NATIONAL CHENG KUNG UNIVERSITY
    Inventors: Wen-Hsiang LU, Chia-Ming TUNG, Ding-Jhe LIOU
  • Publication number: 20240143887
    Abstract: A method includes: receiving a design layout comprising a feature extending in a peripheral region and a central region of the design layout; determining compensation values associated with a pellicle assembly and the peripheral region according to an exposure distribution in an exposure field of a workpiece; and adjusting the design layout according to the compensation values. The modifying of the shape of the feature according to the compensation values includes: partitioning the peripheral region into compensation zones; and adjusting line widths in the compensation zones of the feature according to the compensation values associated with the respective compensation zones.
    Type: Application
    Filed: January 5, 2024
    Publication date: May 2, 2024
    Inventors: CHI-TA LU, CHIA-HUI LIAO, YIHUNG LIN, CHI-MING TSAI
  • Publication number: 20240146288
    Abstract: A system includes a measuring device, a processing device and a signal generating device. The measuring device is configured to measure a voltage difference between a first node and a second node. The processing device is coupled between the first node and the second node. The signal generating device is configured to provide a first clock signal to the processing device to adjust the voltage difference, configured to generate the first clock signal according to a first enable signal and a second clock signal, and configured to align an edge of the first enable signal with an edge of the second clock signal. A method and a device are also disclosed herein.
    Type: Application
    Filed: January 11, 2024
    Publication date: May 2, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Tsung-Che LU, Chin-Ming FU, Chih-Hsien CHANG
  • Patent number: 11972545
    Abstract: The present disclosure provides an apparatus and method of guided neural network model for image processing. An apparatus may comprise a guidance map generator, a synthesis network and an accelerator. The guidance map generator may receive a first image as a content image and a second image as a style image, and generate a first plurality of guidance maps and a second plurality of guidance maps, respectively from the first image and the second image. The synthesis network may synthesize the first plurality of guidance maps and the second plurality of guidance maps to determine guidance information. The accelerator may generate an output image by applying the style of the second image to the first image based on the guidance information.
    Type: Grant
    Filed: September 23, 2021
    Date of Patent: April 30, 2024
    Assignee: INTEL CORPORATION
    Inventors: Anbang Yao, Ming Lu, Yikai Wang, Shandong Wang, Yurong Chen, Sungye Kim, Attila Tamas Afra
  • Patent number: 11967558
    Abstract: A wafer stack structure includes an interlayer, a first wafer, and a second wafer. The interlayer has a first surface and a second surface opposite to the first surface. The intermediate layer includes a dielectric material layer and a redistribution layer embedded in the dielectric material layer. The first wafer is disposed on the first surface of the interlayer. The second wafer is disposed on the second surface of the interlayer. The second wafer is electrically connected to the first wafer through the redistribution layer of the interlayer.
    Type: Grant
    Filed: August 9, 2021
    Date of Patent: April 23, 2024
    Assignees: Powerchip Semiconductor Manufacturing Corporation
    Inventors: Shou-Zen Chang, Chun-Lin Lu, Jium-Ming Lin
  • Publication number: 20240128150
    Abstract: A semiconductor package is provided, which includes a processor die powered by either a front-side or a backside power delivery network, a plurality of memory dies and control dies stacked over the processor die, a plurality of high-thermal-conductivity interconnects located between and/or placed side-by-side with the dies, a substrate carrying all the dies with the substrate having a first cavity allowing a liquid to pass through, and a cold plate disposed over and in direct thermal contact with the top dies with the cold plate having a second cavity configured to connect to the first cavity and allowing the liquid to flow between the first and second cavities. This semiconductor package can be configured to go beyond the traditional single-sided interconnection and cooling topologies to enable dual- or multi-sided cooling, power supply, and signaling.
    Type: Application
    Filed: September 25, 2023
    Publication date: April 18, 2024
    Inventors: HO-MING TONG, CHAO-CHUN LU
  • Publication number: 20240127408
    Abstract: Embodiments are generally directed to an adaptive deformable kernel prediction network for image de-noising. An embodiment of a method for de-noising an image by a convolutional neural network implemented on a compute engine, the image including a plurality of pixels, the method comprising: for each of the plurality of pixels of the image, generating a convolutional kernel having a plurality of kernel values for the pixel; generating a plurality of offsets for the pixel respectively corresponding to the plurality of kernel values, each of the plurality of offsets to indicate a deviation from a pixel position of the pixel; determining a plurality of deviated pixel positions based on the pixel position of the pixel and the plurality of offsets; and filtering the pixel with the convolutional kernel and pixel values of the plurality of deviated pixel positions to obtain a de-noised pixel.
    Type: Application
    Filed: November 20, 2023
    Publication date: April 18, 2024
    Applicant: Intel Corporation
    Inventors: Anbang Yao, Ming Lu, Yikai Wang, Xiaoming Chen, Junjie Huang, Tao Lv, Yuanke Luo, Yi Yang, Feng Chen, Zhiming Wang, Zhiqiao Zheng, Shandong Wang
  • Publication number: 20240128146
    Abstract: The present application discloses a semiconductor package which includes a processor die powered by either a front-side or a backside power delivery network, a plurality of memory dies and control dies stacked over the processor die, a plurality of high-thermal-conductivity (HTC) interconnects formed on, located between and/or placed side-by-side with the dies, a HTC substrate carrying all the dies, a HTC structural member, and a HTC heat spreader/heatsink with the dies and the HTC heat spreader thermally coupled to other HTC components in the semiconductor package. The semiconductor components can be configured to go beyond the traditional single-sided interconnection and cooling topologies to enable dual-or multi-sided cooling, power supply, and signaling.
    Type: Application
    Filed: September 26, 2023
    Publication date: April 18, 2024
    Inventors: HO-MING TONG, CHAO-CHUN LU
  • Publication number: 20240130022
    Abstract: This application relates to the field of lighting, and discloses an LED filament. The LED filament includes an LED chip unit, a light conversion layer, and an electrode. The light conversion layer covers the LED chip unit and part of the electrode, and a color of a light emitted by the LED filament after lighting is different from a color of the light conversion layer. This application has the characteristics of uniform light emission and good heat dissipation effect.
    Type: Application
    Filed: September 18, 2022
    Publication date: April 18, 2024
    Inventors: Tao Jiang, Lin Zhou, Ming-Bin Wang, Chih-Shan Yu, Rong-Huan Yang, Ji-Feng Xu, Heng Zhao, Jian Lu, Qi Wu
  • Publication number: 20240128208
    Abstract: A semiconductor package includes a first integrated circuit (IC) structure. The first IC structure includes: a first body having a first primary surface and a first secondary surface, the first primary surface being substantially perpendicular to the first secondary surface; and an interconnect structure. The interconnect structure includes a primary redistribution layer (RDL) over the first primary surface, the primary RDL having a second secondary surface that is aligned with the first secondary surface of the first body, wherein the first secondary surface and the second secondary surface jointly form a secondary plane. The primary RDL further comprises a first conductive element exposed through the second secondary surface of the primary RDL; and a secondary RDL over the secondary plane, wherein the secondary RDL is electrically connected to the first conductive element of the primary RDL and other conductive elements of the first body exposed through the first secondary plane.
    Type: Application
    Filed: September 21, 2023
    Publication date: April 18, 2024
    Inventors: HO-MING TONG, CHAO-CHUN LU
  • Publication number: 20240129099
    Abstract: Embodiments of this disclosure provide a communication method and device, a storage medium, and a program product. According to the communication method of this disclosure, a physical layer protocol data unit (PPDU) is transmitted or received based on a tone plan of a first bandwidth. The tone plan includes a physical resource unit (PRU), and the PRU includes discrete subcarriers. According to embodiments of this disclosure, an original nominal RU is processed to obtain a PRU including discrete subcarriers. Discretized subcarriers of the PRU may be evenly distributed on a larger bandwidth without changing subcarrier division of the original nominal RU. When it is ensured that a large PAPR is not generated in data transmission due to discrete subcarriers, a transmit end can perform communication at a high transmit power.
    Type: Application
    Filed: December 20, 2023
    Publication date: April 18, 2024
    Inventors: Chenchen LIU, Bo GONG, Jian YU, Yuxin LU, Ming GAN
  • Patent number: 11961580
    Abstract: A sense amplifier includes a first pair of transistors having gate terminals respectively coupled to a first input terminal for receiving a first input signal and to a second input terminal for receiving a second input signal, source terminals coupled to a first power supply terminal, and drain terminals. The sense amplifier also includes a second pair of transistors having gate terminals coupled to a clock terminal, source terminals respectively coupled to the drain terminals of the first pair of transistors, and drain terminals. The sense amplifier also includes a third pair of transistors having gate terminals coupled to the clock terminal, drain terminals respectively coupled to the drain terminals of the second pair of transistors, and source terminals coupled to a second power supply terminal. In addition, the sense amplifier includes an output circuit coupled to the drain terminals of the second pair of transistors and having an output terminal.
    Type: Grant
    Filed: June 1, 2022
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tsung-Che Lu, Chin-Ming Fu, Chih-Hsien Chang
  • Publication number: 20240119625
    Abstract: A method and system of automatically estimating a ball carrier in team sports.
    Type: Application
    Filed: June 16, 2021
    Publication date: April 11, 2024
    Applicant: Intel Corporation
    Inventors: Ming Lu, Liwei Liao, Haihua Lin, Xiaofeng Tong, Wenlong Li, Jiansheng Chen, Yiwei He
  • Publication number: 20240121040
    Abstract: This application provides a resource indication method and apparatus, and relates to the field of communication technologies. In the method, the first communication apparatus may receive resource indication information. The resource indication information may include resource unit allocation information for indicating one or more first VRUs, and station information of a station to which the one or more first VRUs are allocated. There is a mapping relationship between the first PRU and the first VRU. The first communication apparatus transmits data on the first PRU.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 11, 2024
    Inventors: Yuxin LU, Chenchen LIU, Mengshi HU, Ming GAN
  • Patent number: 11949877
    Abstract: Innovations in adaptive encoding of screen content based on motion type are described. For example, a video encoder system receives a current picture of a video sequence. The video encoder system determines a current motion type for the video sequence and, based at least in part on the current motion type, sets one or more encoding parameters. Then, the video encoder system encodes the current picture according to the encoding parameter(s). The innovations can be used in real-time encoding scenarios when encoding screen content for a screen sharing application, desktop conferencing application, or other application. In some cases, the innovations allow a video encoder system to adapt compression to different characteristics of screen content at different times within the same video sequence.
    Type: Grant
    Filed: October 1, 2021
    Date of Patent: April 2, 2024
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Satya Sasikanth Bendapudi, Ming-Chieh Lee, Yan Lu, Bin Li, Jizhe Jin, Jiahao Li, Shao-Ting Wang
  • Patent number: D1024959
    Type: Grant
    Filed: September 2, 2021
    Date of Patent: April 30, 2024
    Assignee: VOLTRONIC POWER TECHNOLOGY CORP.
    Inventors: You-Sheng Chiang, Yu-Cheng Lu, Juor-Ming Hsieh