Patents by Inventor Ming Peng

Ming Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240151200
    Abstract: A remote controller is provided. The remote controller includes a motion sensing circuit and a wireless communication circuit electrically connected to the motion sensing circuit. The motion sensing circuit determines whether or not a motion of the remote controller complies with one of multiple reference motions. When the motion of the remote controller complies with one of the reference motions, the wireless communication circuit is switched from a sleep state to a working state. The wireless communication circuit that is in the working state determines whether or not a received signal strength indication between the remote controller and a controlled device is greater than or equal to a strength threshold. When the received signal strength indication is less than the strength threshold, the wireless communication circuit is switched from the working state to the sleep state.
    Type: Application
    Filed: January 16, 2024
    Publication date: May 9, 2024
    Inventors: CHIA-HSIN WU, CHUI-SUNG PENG, CHU-CHI SUN, FU-MING KANG
  • Publication number: 20240147431
    Abstract: In a management method and system for a shared radio unit and a computer-readable storage medium, N user groups are created for N operators, where N is a positive integer greater than 1; resources of the shared radio unit are divided into public resources and N private resources; the N user groups and the N private resources are bound correspondingly, and the N user groups are set to only have access to corresponding private resources bound in the N private resources; resource permissions of the shared radio unit are initialized, and account passwords configured for the N user groups are sent to the corresponding N operators respectively; and the N operators configures parameters to a data model language database according to the account passwords.
    Type: Application
    Filed: September 7, 2023
    Publication date: May 2, 2024
    Inventors: DONG-MING LI, YAN-HUA PENG, YUN-FENG PENG
  • Publication number: 20240138059
    Abstract: A circuit board structure includes a carrier, a thin film redistribution layer disposed on the carrier, solder balls electrically connected to the thin film redistribution layer and the carrier, and a surface treatment layer. The thin film redistribution layer includes a first dielectric layer, pads, a first metal layer, a second dielectric layer, a second metal layer, and a third dielectric layer. A top surface of the first dielectric layer is higher than an upper surface of each pad. The first metal layer is disposed on a first surface of the first dielectric layer. The second dielectric layer has second openings exposing part of the first metal layer. The second metal layer extends into the second openings and is electrically connected to the first metal layer. The third dielectric layer has third openings exposing part of the second metal layer. The surface treatment layer is disposed on the upper surfaces.
    Type: Application
    Filed: November 23, 2022
    Publication date: April 25, 2024
    Applicant: Unimicron Technology Corp.
    Inventors: Kai-Ming Yang, Chia-Yu Peng, Cheng-Ta Ko, Pu-Ju Lin
  • Publication number: 20240138063
    Abstract: A circuit board structure includes a carrier, a thin film redistribution layer disposed on the carrier, solder balls electrically connected to the thin film redistribution layer and the carrier, and a surface treatment layer. The thin film redistribution layer includes a plurality of pads, a first dielectric layer, a first metal layer, a second dielectric layer, a second metal layer, and a third dielectric layer. A plurality of first openings of the first dielectric layer expose part of the pads, and a first surface of the first dielectric layer is higher upper surfaces of the pads. The solder balls are disposed in a plurality of third openings of the third dielectric layer and are electrically connected to the second metal layer and the carrier. The surface treatment layer is disposed on the upper surfaces, and a top surface of the surface treatment layer is higher than the first surface.
    Type: Application
    Filed: November 15, 2022
    Publication date: April 25, 2024
    Applicant: Unimicron Technology Corp.
    Inventors: Ping-Tsung Lin, Kai-Ming Yang, Chia-Yu Peng, Pu-Ju Lin, Cheng-Ta Ko
  • Patent number: 11965412
    Abstract: A quantitative evaluation method for integrity and damage evolution of a cement sheath in an oil-gas well is provided based on a fractal theory, an image processing technology, structural features and failure mechanisms of a casing-cement sheath-formation combination. The method uses correlations among fractal dimensions of casing-cement sheath interface morphology, cement sheath microscopic pore morphology, particle morphology of an initial blank group, and macroscopic mechanical properties including a radial cementing strength of the cement sheath interface, a tensile strength, and a compressive strength to quantitatively evaluate the integrity of the cement sheath of the blank group.
    Type: Grant
    Filed: May 5, 2023
    Date of Patent: April 23, 2024
    Assignee: SOUTHWEST PETROLEUM UNIVERSITY
    Inventors: Kuanhai Deng, Niantao Zhou, Yuanhua Lin, Mingyuan Yao, Ming Zhang, Deqiang Yi, Pengfei Xie, Yang Peng
  • Publication number: 20240129167
    Abstract: A communication receiver includes a first signal processing circuit and a second signal processing circuit. The first signal processing circuit includes a first feedforward equalizer and a decision circuit. The first feedforward equalizer processes a received signal to generate a first equalized signal. The decision circuit performs hard decision upon the first equalized signal to generate a first symbol decision signal. The second signal processing circuit includes a second feedforward equalizer, a decision feedforward equalizer, and a first decision feedback equalizer. The second feedforward equalizer processes the first equalized signal to generate a second equalized signal. The decision feedforward equalizer processes the first symbol decision signal to generate a third equalized signal. The first decision feedback equalizer generates a second symbol decision signal according to the second equalized signal and the third equalized signal.
    Type: Application
    Filed: September 18, 2023
    Publication date: April 18, 2024
    Applicant: MEDIATEK INC.
    Inventors: Chung-Hsien Tsai, Che-Yu Chiang, Yu-Ting Liu, Tsung-Lin Lee, Chia-Sheng Peng, Ting-Ming Yang
  • Publication number: 20240124437
    Abstract: The present disclosure relates to an injectable lurasidone suspension and a preparation method thereof, and in particular to an irregular form of a lurasidone solid and a pharmaceutical composition thereof. The present disclosure also relates to a preparation method for the solid and the pharmaceutical composition thereof, and an application thereof in the treatment of mental diseases. According to the present disclosure, the lurasidone solid prepared has controllable particle size and has Dv5O particle size of 6 ?m to 110 ?m. The good particle size stability can also he maintained in the pharmaceutical composition. The lurasidone suspension preparation obtained by the method is fast-acting, has a long sustained release period, and can effectively reduce the risk caused by poor patient compliance.
    Type: Application
    Filed: March 21, 2022
    Publication date: April 18, 2024
    Inventors: Ming LI, Xiangyong LIANG, Zhengxing SU, Dan LI, Duo KE, Cong YI, Wei WEI, Guifu DENG, Ya PENG, Dong ZHAO, Jingyi WANG
  • Publication number: 20240120376
    Abstract: Semiconductor structures and methods are provided. A semiconductor structure according to the present disclosure includes a first active region extending lengthwise along a first direction and having a first width along a second direction perpendicular to the first direction, a second active region extending lengthwise along the first direction and having a second width along the second direction, and an epitaxial feature sandwiched between the first active region and the second active region along the first direction. The first width is greater than the second width.
    Type: Application
    Filed: January 26, 2023
    Publication date: April 11, 2024
    Inventors: Po Shao Lin, Jiun-Ming Kuo, Yuan-Ching Peng, You-Ting Lin, Yu Mei Jian
  • Publication number: 20240118660
    Abstract: Embodiments of this application provide example holographic recording media, holographic polymer materials, methods for preparing holographic polymer materials, and display devices. An example holographic recording medium includes a first-order crosslinked network, a photoinitiator, and a second-order monomer. The first-order crosslinked network provides a mechanical support for the holographic recording medium. The second-order monomer includes a monomer with a free radical reactivity. The photoinitiator is used to initiate polymerization of the second-order monomer. The holographic recording medium includes at least one of an ester group (I), a urethane group (II), a carbamido group (III), an allophanate group (IV), or an amide group (V). Groups linked to the ester group (I), the urethane group (II), the carbamido group (III), the allophanate group (IV), and the amide group (V) are separately selected from at least one of the following: alkyl, alkoxy, alkenyl, or aryl.
    Type: Application
    Filed: November 22, 2023
    Publication date: April 11, 2024
    Inventors: Haiyan PENG, Shaoqin XU, Xiaolin XIE, Xingping ZHOU, Ming YAO, Botong QIU
  • Patent number: 11953940
    Abstract: A display apparatus includes a light-transmitting structural plate, some optical microscopic structures, an optical film, a base plate and some light emitting elements. The light-transmitting structural plate has a first side and a second side opposite to each other. The optical microscopic structures are regularly arrayed and formed on the first side or the second side. The optical microscopic structure has an inclined surface connecting at a connecting line and forming an angle ranging between 30 degrees and 150 degrees with a corresponding inclined surface of an adjacent one of the optical microscopic structures. The optical film is located on the first side. The base plate is separated from the second side by a space. The light emitting elements are located inside the space and disposed on the base plate. The light emitting elements respectively emit a light ray to the light-transmitting structural plate.
    Type: Grant
    Filed: October 7, 2020
    Date of Patent: April 9, 2024
    Assignee: DARWIN PRECISIONS CORPORATION
    Inventors: Yu-Cheng Chang, Shu-Ching Peng, Yu-Ming Huang
  • Publication number: 20240113221
    Abstract: A fin field effect transistor (FinFET) device structure is provided. The FinFET device structure includes a plurality of fin structures above a substrate, an isolation structure over the substrate and between the fin structures, and a gate structure formed over the fin structure. The FinFET device structure includes a source/drain (S/D) structure over the fin structure, and the S/D structure is adjacent to the gate structure. The FinFET device structure also includes a metal silicide layer over the S/D structure, and the metal silicide layer is in contact with the isolation structure.
    Type: Application
    Filed: November 28, 2023
    Publication date: April 4, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chun-Hsiung TSAI, Shahaji B. MORE, Cheng-Yi PENG, Yu-Ming LIN, Kuo-Feng YU, Ziwei FANG
  • Publication number: 20240112969
    Abstract: An in-mold electronic (IME) device includes a curved substrate, a first conductive layer, a dielectric layer, a gap compensation layer, and a second conductive layer. The curved substrate has a first surface. The first conductive layer is disposed on the first surface. The dielectric layer is disposed on the first conductive layer and has a first thickness. The gap compensation layer is disposed on the first surface and connected to the dielectric layer. The gap compensation layer has a second thickness. The second conductive layer is disposed on the gap compensation layer and electrically connected to the gap compensation layer. A curvature radius of the curved substrate is c, a ratio of the second thickness to the first thickness is r, and c and r satisfy a relationship: r=1.5?0.02c±15%.
    Type: Application
    Filed: July 28, 2023
    Publication date: April 4, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Yu-Ming Peng, Hsiao-Fen Wei, Chih-Chia Chang
  • Patent number: 11946079
    Abstract: The present invention relates to a method for producing a protein hydrolysate using a polypeptide having endopeptidase activity and a polypeptide having carboxypeptidase activity and the use of these enzymes for hydrolysing a protein substrate. In addition, the present invention relates to polypeptides having carboxypeptidase activity and polynucleotides encoding the polypeptides. The invention also relates to nucleic acid constructs, vectors, and host cells comprising the polynucleotides as well as methods of producing and using the polypeptides.
    Type: Grant
    Filed: January 10, 2022
    Date of Patent: April 2, 2024
    Assignee: Novozymes A/S
    Inventors: Hanne Vang Hendriksen, Gitte Budolfsen Lynglev, Henrik Frisner, Ciu Liu, Ye Liu, Eduardo Antonio Della Pia, Hans Peter Heldt-Hansen, Kenneth Jensen, Wei Peng, Ming Li
  • Publication number: 20240104043
    Abstract: Embodiments herein relate to a module which can be inserted into or removed from a computing device by a user. The module includes an input-output port which is configured for a desired specification, such as USB-A, USB-C, Thunderbolt, DisplayPort or HDMI. The port can be provided on an expansion card such as an M.2 card for communicating with a host platform. The host platform can communicate with different types of modules in a standardized way so that complexity and costs are reduced. In another aspect, with a dual port module, the host platform can concurrently send/receive power through one port and send/receive data from the other port.
    Type: Application
    Filed: September 22, 2022
    Publication date: March 28, 2024
    Inventors: Shailendra Singh Chauhan, Nirmala Bailur, Reza M. Zamani, Jackson Chung Peng Kong, Charuhasini Sunder Raman, Venkataramani Gopalakrishnan, Chuen Ming Tan, Sreejith Satheesakurup, Karthi Kaliswamy, Venkata Mahesh Gunnam, Yi Jen Huang, Kie Woon Lim, Dhinesh Sasidaran, Pik Shen Chee, Venkataramana Kotakonda, Kunal A. Shah, Ramesh Vankunavath, Siva Prasad Jangili Ganga, Ravali Pampala, Uma Medepalli, Tomer Savariego, Naznin Banu Wahab, Sindhusha Kodali, Manjunatha Venkatarauyappa, Surendar Jeevarathinam, Madhura Shetty, Deepak Sharma, Rohit Sharad Mahajan
  • Publication number: 20240103097
    Abstract: The present disclosure provides a direct current (DC) transformer error detection apparatus for a pulsating harmonic signal, including a DC and pulsating harmonic current output module and an external detected input module, where the DC and pulsating harmonic current output module outputs a DC and a DC superimposed pulsating harmonic current to an internal sampling circuit and a self-calibrated standard resistor array; and the internal sampling circuit converts the input DC and the input DC superimposed pulsating harmonic current into a voltage signal, and sends the voltage signal to an analog-to-digital (AD) sampling and measurement component through a front-end conditioning circuit and a detected input channel. The DC transformer error detection apparatus can complete self-calibration for measurement of the DC and the pulsating harmonic signal on a test site.
    Type: Application
    Filed: August 17, 2022
    Publication date: March 28, 2024
    Inventors: Xin Zheng, Wenjing Yu, Tao Peng, Yi Fang, Ming Lei, Hong Shi, Ben Ma, Li Ding, Wei Wei, Linghua Li, He Yu, Tian Xia, Yingchun Wang, Sike Wang, Dongri Xie, Xin Wang, Bo Pang, Xianjin Rong
  • Publication number: 20240105814
    Abstract: A first layer is formed over a substrate; a second layer is formed over the first layer; and a third layer is formed over the second layer. The first and third layers each have a first semiconductor element; the second layer has a second semiconductor element different from the first semiconductor element. The second layer has the second semiconductor element at a first concentration in a first region and at a second concentration in a second region of the second layer. A source/drain trench is formed in a region of the stack to expose side surfaces of the layers. A first portion of the second layer is removed from the exposed side surface to form a gap between the first and the third layers. A spacer is formed in the gap. A source/drain feature is formed in the source/drain trench and on a sidewall of the spacer.
    Type: Application
    Filed: November 30, 2023
    Publication date: March 28, 2024
    Inventors: Che-Lun Chang, Jiun-Ming Kuo, Ji-Yin Tsai, Yuan-Ching Peng
  • Patent number: 11937541
    Abstract: A grass cutting head includes a spool for winding a grass cutting line, a head housing for accommodating the spool, a first guiding structure disposed at least partially in the head housing, and a second guiding structure formed on the spool. The first guiding structure guides the grass cutting line through the head housing when threading the grass cutting line. The second guiding structure guides the grass cutting line to move and be wound around the spool by relative motion created between the spool and the head housing. The head housing includes a first housing and a second housing. The first guiding structure is disposed at least partially in the first housing. The spool is disposed between the first housing and the second housing. The first housing or the second housing is provided with an outer threading hole for allowing the grass cutting line to pass in or out.
    Type: Grant
    Filed: September 9, 2021
    Date of Patent: March 26, 2024
    Assignee: Nanjing Chervon Industry Co., Ltd.
    Inventors: Ming Peng, Jianpeng Guo, Dehong Ren
  • Patent number: 11939942
    Abstract: A remote controller, a remote-control system and a control method thereof are provided. The remote controller includes a motion sensing circuit and a wireless communication circuit electrically connected to the motion sensing circuit. The motion sensing circuit determines whether or not a motion of the remote controller complies with one of multiple reference motions. When the motion of the remote controller complies with one of the reference motions, the wireless communication circuit is switched from a sleep state to a working state. The wireless communication circuit that is in the working state determines whether or not a received signal strength indication between the remote controller and a controlled device is greater than or equal to a strength threshold. When the received signal strength indication is less than the strength threshold, the wireless communication circuit is switched from the working state to the sleep state.
    Type: Grant
    Filed: July 20, 2022
    Date of Patent: March 26, 2024
    Assignee: WISTRON NEWEB CORPORATION
    Inventors: Chia-Hsin Wu, Chui-Sung Peng, Chu-Chi Sun, Fu-Ming Kang
  • Publication number: 20240096867
    Abstract: A semiconductor structure is provided and includes a first gate structure, a second gate structure, and at least one local interconnect that extend continuously across a non-active region from a first active region to a second active region. The semiconductor structure further includes a first separation spacer disposed on the first gate structure and first vias on the first gate structure. The first vias are arranged on opposite sides of the first separation spacer are isolated from each other and apart from the first separation spacer by different distances.
    Type: Application
    Filed: December 1, 2023
    Publication date: March 21, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Charles Chew-Yuen YOUNG, Chih-Liang CHEN, Chih-Ming LAI, Jiann-Tyng TZENG, Shun-Li CHEN, Kam-Tou SIO, Shih-Wei PENG, Chun-Kuang CHEN, Ru-Gun LIU
  • Patent number: 11932534
    Abstract: A microelectromechanical system (MEMS) structure and method of forming the MEMS device, including forming a first metallization structure over a complementary metal-oxide-semiconductor (CMOS) wafer, where the first metallization structure includes a first sacrificial oxide layer and a first metal contact pad. A second metallization structure is formed over a MEMS wafer, where the second metallization structure includes a second sacrificial oxide layer and a second metal contact pad. The first metallization structure and second metallization structure are then bonded together. After the first metallization structure and second metallization structure are bonded together, patterning and etching the MEMS wafer to form a MEMS element over the second sacrificial oxide layer. After the MEMS element is formed, removing the first sacrificial oxide layer and second sacrificial oxide layer to allow the MEMS element to move freely about an axis.
    Type: Grant
    Filed: March 16, 2022
    Date of Patent: March 19, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hung-Hua Lin, Chang-Ming Wu, Chung-Yi Yu, Ping-Yin Liu, Jung-Huei Peng