Abstract: An electronic device includes a first substrate structure, multiple electronic elements and a second substrate structure. The first substrate structure includes a first substrate. The electronic elements are disposed on the first substrate. The second substrate structure is coupled to the first substrate structure. The second substrate structure includes a second substrate, a protection circuit, a driving circuit and a bonding pad. The protection circuit is disposed on the second substrate. The driving circuit is disposed on the second substrate and configured to drive at least a part of the electronic elements. The bonding pad is disposed on the second substrate. The protection circuit is respectively coupled to the bonding pad and the driving circuit. The electronic device may reduce the damage caused by electrostatic discharge or reduce the impact of the bonding process of the bonding pad on signal conduction.

Abstract: Semiconductor structures and processes are provided. A semiconductor structure of the present disclosure includes a first base portion and a second base portion extending lengthwise along a first direction, a first source/drain feature disposed over the first base portion, a second source/drain feature disposed over the second base portion, a center dielectric fin sandwiched between the first source/drain feature and the second source/drain feature along a second direction perpendicular to the first direction, and a source/drain contact disposed over the first source/drain feature, the second source/drain feature and the center dielectric fin. A portion of the source/drain contact extends between the first source/drain feature and the second source/drain feature along the second direction.

Abstract: A chiplet system and a positioning method thereof are provided. The positioning method of the chiplet system includes the following steps. Two end chiplets and a plurality of middle chiplets are classified. A quantity calculation packet is transmitted and accumulated from each of the end chiplets towards another end to analyze a quantity of middle chiplets. A serial number comparison packet is transmitted and accumulated from each of the middle chiplets connected to one of the end chiplets towards another end to set a starting point. An identify number setting packet is transmitted and accumulated from the middle chiplet set as the starting point towards another end to set a positioning number of each of the middle chiplets.

Abstract: A thin film transistor includes a substrate, a semiconductor layer, a gate insulating layer, a gate, a source and a drain. The semiconductor layer is located above the substrate. The gate insulating layer is located above the semiconductor layer. The gate is located above the gate insulating layer and overlapping with the semiconductor layer. The gate includes a first portion, a second portion and a third portion. The first portion is extending along the surface of the gate insulating layer and directly in contact with the gate insulating layer. The second portion is separated from the gate insulating layer. Taking the surface of the gate insulating layer as a reference, the top surface of the second portion is higher than the top surface of the first portion. The third portion connects the first portion to the second portion. The source and the drain are electrically connected to the semiconductor layer.

Abstract: A semiconductor package includes a conductive pillar and a solder. The conductive pillar has a first sidewall and a second sidewall opposite to the first sidewall, wherein a height of the first sidewall is greater than a height of the second sidewall. The solder is disposed on and in direct contact with the conductive pillar, wherein the solder is hanging over the first sidewall and the second sidewall of conductive pillar.

Abstract: An imaging lens assembly module includes a lens carrier, a rotatable component, an imaging surface and a holder portion. At least one lens element of the imaging lens assembly module is disposed on the lens carrier, and the lens carrier includes an assembling structure. The rotatable component includes a blade set and a rotating element. The blade set includes rotatable blades surrounding an optical axis to form a through hole. The rotating element is connected to the blade set. The imaging surface is located on an image side of the lens carrier. The holder portion is configured to keep a fixed distance between the lens carrier and the imaging surface. The blade set and the rotating element are disposed on the assembling structure, and the blade set and the rotating element rotate relatively to the assembling structure, so that the dimension of the through hole is variable.

Abstract: A method includes forming a dummy pattern over test region of a substrate; forming an interlayer dielectric (ILD) layer laterally surrounding the dummy pattern; removing the dummy pattern to form an opening; forming a dielectric layer in the opening; performing a first testing process on the dielectric layer; performing an annealing process to the dielectric layer; and performing a second testing process on the annealed dielectric layer.

Abstract: The present invention provides antibody or the antigen-binding portion thereof bind to carbohydrate antigen, such as Globo series antigens (e.g. Globo H, SSEA-4 or SSEA-3). Also disclosed herein are pharmaceutical compositions and methods for the inhibition of cancer cells in a subject in need thereof. The pharmaceutical compositions comprise an antibody or an antigen-binding portion thereof and at least one pharmaceutically acceptable carrier.

Abstract: A semiconductor structure includes: a substrate; a first fin and a second fin disposed on the substrate and spaced apart from each other; a dielectric wall disposed on the substrate and having first and second wall surfaces; a third fin disposed on the substrate to be in direct contact with at least one of the first and second fins; a first device disposed on the first fin and including first channel features extending away from the first wall surface; a second device disposed on the second fin and including second channel features extending away from the second wall surface; at least one third device disposed on the third fin and including third channel features; and an isolation feature disposed on the substrate to permit the third device to be electrically isolated from the first and second devices. A method for manufacturing the semiconductor structure is also disclosed.

Abstract: Embodiments of the disclosure are directed to a transportation system for carrying servers. The transportation system includes a server rack and a shock-absorbing pallet. The shock-absorbing pallet is secured under the server rack and configured to move relative to the server rack to dampen vibration during transportation of the server rack. The shock-absorbing pallet includes a top cover, a bottom cover, one or more isolation devices, and one or supporting layers. The one or more isolation devices are disposed between the top cover and the bottom cover. Each isolation device includes a shock-absorbing component coupled to the top cover and the bottom cover. The one or more supporting layers are secured between the top cover and the bottom cover around the one or more isolation devices. The one or more supporting layers have a plurality of slots for guiding a pallet lifter therethrough.

Abstract: Embodiments of the disclosure are directed to a transportation system for carrying servers. The transportation system includes a server rack and a shock-absorbing pallet. The shock-absorbing pallet is secured under the server rack and configured to move relative to the server rack to dampen vibration during transportation of the server rack. The shock-absorbing pallet includes a top cover, a bottom cover, one or more isolation devices, and one or supporting layers. The one or more isolation devices are disposed between the top cover and the bottom cover. Each isolation device includes a shock-absorbing component coupled to the top cover and the bottom cover. The one or more supporting layers are secured between the top cover and the bottom cover around the one or more isolation devices. The one or more supporting layers have a plurality of slots for guiding a pallet lifter therethrough.

Abstract: A robotic system having movable mechanism of a non-planar inner projection is provided. It comprises a non-planar projection surface, a servo motor, an inner projection element, and a support frame. The servo motor is connected to the non-planar projection surface, and the non-planar projection surface can be rotated synchronously by the servo motor drive. The inner projection element is disposed relative to the non-planar projection surface, the inner projection element generates a target image, and the target image is projected onto the non-planar projection surface to form a display area, and the display area has a fixed boundary. The servo motor and the inner projection element are disposed on the support frame, and when the non-planar projection surface is synchronously rotated by the servo motor, the inner projection element also rotates synchronously.

Abstract: A shock absorber apparatus is provided. The shock absorber apparatus includes an elastic device and at least one mounting device connected to the elastic device. Each mounting device includes two securing elements. Each securing element is configured to secure an opposing portion of a structure. Each mounting device can also include two sliders. Each slider can have at least two surfaces, which are interconnected by an inclined surface facing an opposing slider, and a ground surface. The inclined surface can be slidably connected to one of the at least two securing elements. Each slider can be arranged to move in response to an applied force. The ground surface is configured to slidably connect to an inner wall of a box.

Abstract: A robotic system having movable mechanism of a non-planar inner projection is provided. It comprises a non-planar projection surface, a servo motor, an inner projection element, and a support frame. The servo motor is connected to the non-planar projection surface, and the non-planar projection surface can be rotated synchronously by the servo motor drive. The inner projection element is disposed relative to the non-planar projection surface, the inner projection element generates a target image, and the target image is projected onto the non-planar projection surface to form a display area, and the display area has a fixed boundary. The servo motor and the inner projection element are disposed on the support frame, and when the non-planar projection surface is synchronously rotated by the servo motor, the inner projection element also rotates synchronously.

Abstract: A shock absorber apparatus is provided. The shock absorber apparatus includes an elastic device and at least one mounting device connected to the elastic device. Each mounting device includes two securing elements. Each securing element is configured to secure an opposing portion of a structure. Each mounting device can also include two sliders. Each slider can have at least two surfaces, which are interconnected by an inclined surface facing an opposing slider, and a ground surface. The inclined surface can be slidably connected to one of the at least two securing elements. Each slider can be arranged to move in response to an applied force. The ground surface is configured to slidably connect to an inner wall of a box.

Abstract: A hard drive disk carrier for reducing airflow-induced vibration of a hard disk drive includes a bracket assembly configured to removably secure the hard disk drive to a receiving component within an enclosure. The bracket assembly is configured for substantially exposing major surfaces of the hard drive to yield exposed surfaces and for mounting within the enclosure so that a first end of the hard disk drive faces the first end of the enclosure and a second end of the hard disk drive faces the second end of the enclosure. The bracket assembly also includes at least one end member associated with the second end of the hard disk drive. The carrier also includes an airfoil assembly with one or more louvers configured to extend from at least the second end of the hard disk drive and partially cover at least one of the exposed surfaces.

Abstract: A hard drive disk carrier for reducing airflow-induced vibration of a hard disk drive includes a bracket assembly configured to removably secure the hard disk drive to a receiving component within an enclosure. The bracket assembly is configured for substantially exposing major surfaces of the hard drive to yield exposed surfaces and for mounting within the enclosure so that a first end of the hard disk drive faces the first end of the enclosure and a second end of the hard disk drive faces the second end of the enclosure. The bracket assembly also includes at least one end member associated with the second end of the hard disk drive. The carrier also includes an airfoil assembly with one or more louvers configured to extend from at least the second end of the hard disk drive and partially cover at least one of the exposed surfaces.

Abstract: In some implementations, cooling fans can be mounted in a server chassis using a multi-level vibration dampening mechanism to reduce the transmission of fan vibrations to the server chassis. For example, a plurality of cooling fans can be housed within a plurality of fan cages. The plurality of fan cages can be mounted to a cooling fan tray. The cooling fan tray can be mounted to the chassis. For example, the mountings used to attach the fan cages to the tray and the tray to the chassis can include resilient vibration dampers. Thus, the vibrations generated by the cooling fans can be more effectively reduced and operation of vibration sensitive server components can be improved.

Abstract: In some implementations, cooling fans can be mounted in a server chassis using a multi-level vibration dampening mechanism to reduce the transmission of fan vibrations to the server chassis. For example, a plurality of cooling fans can be housed within a plurality of fan cages. The plurality of fan cages can be mounted to a cooling fan tray. The cooling fan tray can be mounted to the chassis. For example, the mountings used to attach the fan cages to the tray and the tray to the chassis can include resilient vibration dampers. Thus, the vibrations generated by the cooling fans can be more effectively reduced and operation of vibration sensitive server components can be improved.

Abstract: A safety apparatus for a passage controlled by means of a first member and a second member, has a first device for detecting opening of the passage, a second device for detecting fierce knocking on the first and second members and a third device for detecting abnormally high temperature. The first device detects relative movement between the first and second members. The first device has (a) a block being attached to the first member and having a curved surface, (b) a detector having a casing attached to the second member and a pin having a free end so that the pin is in various positions relative to the casing when the free end of the pin is in various positions against the curved surface of the block as the first member is moved relative to the second member and (c) an alarm actuated by means of the detector for warning of the relative movement between the first member and second members.