Abstract: A method includes forming a metal seed layer over a first conductive feature of a wafer, forming a patterned photo resist on the metal seed layer, forming a second conductive feature in an opening in the patterned photo resist, and heating the wafer to generate a gap between the second conductive feature and the patterned photo resist. A protection layer is plated on the second conductive feature. The method further includes removing the patterned photo resist, and etching the metal seed layer.

Abstract: Provided is a package structure including a substrate, a stiffener ring, an eccentric die, a lid layer, and a buffer layer. The stiffener ring is disposed on the substrate. The stiffener ring has an inner perimeter to enclose an accommodation area. The eccentric die is disposed within the accommodation area on the substrate. The eccentric die is offset from a center of the accommodation area to close to a first side of the stiffener ring. The lid layer is disposed on the stiffener ring and overlays the eccentric die. The buffer layer is embedded in the lid layer between the first side of the stiffener ring and the eccentric die. The buffer layer has a thickness less than a thickness of the lid layer.

Abstract: A structure and a formation method of a semiconductor device are provided. The semiconductor device structure includes a semiconductor substrate and an interconnection structure over the semiconductor substrate. The semiconductor device structure also includes a first conductive pillar over the interconnection structure. The first conductive pillar has a first protruding portion extending towards the semiconductor substrate from a lower surface of the first conductive pillar. The semiconductor device structure further includes a second conductive pillar over the interconnection structure. The second conductive pillar has a second protruding portion extending towards the semiconductor substrate from a lower surface of the second conductive pillar. The first conductive pillar is closer to a center point of the semiconductor substrate than the second conductive pillar. A bottom of the second protruding portion is wider than a bottom of the first protruding portion.

Abstract: Semiconductor structures and processes are provided. A semiconductor structure of the present disclosure includes a first base portion and a second base portion extending lengthwise along a first direction, a first source/drain feature disposed over the first base portion, a second source/drain feature disposed over the second base portion, a center dielectric fin sandwiched between the first source/drain feature and the second source/drain feature along a second direction perpendicular to the first direction, and a source/drain contact disposed over the first source/drain feature, the second source/drain feature and the center dielectric fin. A portion of the source/drain contact extends between the first source/drain feature and the second source/drain feature along the second direction.

Abstract: A method for detecting and compensating CNC tools being implemented in an electronic device, receives from a detector first parameters and second parameters in respect of a first tool. Such first parameters include at least one of service life, blade break information, and blade chipping information of the first tool, and such second parameters include at least one of length extension information, length wear information, radial wear information, and blade thickness wear information of the first tool. Based on the first parameters, instructions to process the workpiece are transmitted or not. Upon receiving the second parameters, instructions to adjust operation of the first tool are transmitted, to compensate for deterioration in normal use.

Abstract: A method includes forming a dummy pattern over test region of a substrate; forming an interlayer dielectric (ILD) layer laterally surrounding the dummy pattern; removing the dummy pattern to form an opening; forming a dielectric layer in the opening; performing a first testing process on the dielectric layer; performing an annealing process to the dielectric layer; and performing a second testing process on the annealed dielectric layer.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes an interconnection structure over a semiconductor substrate and a conductive pillar over the interconnection structure. The conductive pillar has a protruding portion extending towards the semiconductor substrate from a lower surface of the conductive pillar. The semiconductor device structure also includes an upper conductive via between the conductive pillar and the interconnection structure and a lower conductive via between the upper conductive via and the interconnection structure. The lower conductive via is electrically connected to the conductive pillar through the upper conductive via. The conductive pillar extends across opposite sidewalls of the upper conductive via and opposite sidewalls of the lower conductive via. A top view of an entirety of the second conductive via is separated from a top view of an entirety of the protruding portion.

Abstract: A radar signal processing system with a self-interference cancelling function includes an analog front end (AFE) processor, an analog to digital converter (ADC), an adaptive interference canceller (AIC), and a digital to analog converter (DAC). The AFE processor receives an original input signal and generates an analog input signal. The ADC converts the analog input signal to a digital input signal. The AIC generates a digital interference signal digital interference signal by performing an adaptive interference cancellation process according to the digital input signal. The DAC converts the digital interference signal to an analog interference signal. Finally, the analog interference signal is fed back to the AFE and cancelled from the original input signal in the AFE processor while performing the front end process, reducing the interference of the static interference from the leaking of a close-by transmitter during the front end process.

Abstract: A semiconductor structure includes: a substrate; a first fin and a second fin disposed on the substrate and spaced apart from each other; a dielectric wall disposed on the substrate and having first and second wall surfaces; a third fin disposed on the substrate to be in direct contact with at least one of the first and second fins; a first device disposed on the first fin and including first channel features extending away from the first wall surface; a second device disposed on the second fin and including second channel features extending away from the second wall surface; at least one third device disposed on the third fin and including third channel features; and an isolation feature disposed on the substrate to permit the third device to be electrically isolated from the first and second devices. A method for manufacturing the semiconductor structure is also disclosed.

Abstract: A method for forming a chip package structure. The method includes bonding first connectors over a front surface of a semiconductor wafer. The method also includes dicing the semiconductor wafer from a rear surface of the semiconductor wafer to form semiconductor dies and mounting first and second semiconductor dies in the semiconductor dies over a top surface of the interposer substrate. The method further forming an encapsulating layer over the top surface of the interposer substrate to cover the first semiconductor die and the second semiconductor die. A first sidewall of the first semiconductor die faces a second sidewall of the second semiconductor die, and upper portions of the first sidewall and the second sidewall have a tapered contour, to define a top die-to-die distance and a bottom die-to-die distance that is less than the top die-to-die distance.

Abstract: An electric door lock includes a lock device and an electric control device. The lock device includes a latch bolt, an inner cover seat, and a handle mechanism driving movement of the latch bolt. The inner cover seat has an inner cover having an inner receiving room, and a window that is communicated with the inner receiving room. The electric control device electrically controls the lock device, and includes a middle circuit board fixedly received in the inner receiving room, and an inner circuit board removably received in the inner receiving room, removably connected to the middle circuit board, corresponding to the window in position, and removable from the inner receiving room through the window.

Abstract: An electric door lock includes a lock device and an electric control device. The lock device includes a latch bolt, an inner cover seat, and a handle mechanism driving movement of the latch bolt. The inner cover seat has an inner cover having an inner receiving room, and a window that is communicated with the inner receiving room. The electric control device electrically controls the lock device, and includes a middle circuit board fixedly received in the inner receiving room, and an inner circuit board removably received in the inner receiving room, removably connected to the middle circuit board, corresponding to the window in position, and removable from, the inner receiving room through the window.

Abstract: A cut-off structure of a charger contains a power supply unit and a cutting-off set. The power supply unit includes a voltage converting portion, a connector member, and an extension cord connecting with the voltage converting portion and the connector member. The voltage converting portion has a transforming coil for transforming mains electricity into a charging voltage. The cutting-off set includes a controlling head, a control switch, and a control wire coupling with the controlling head and the control switch. The control switch is fixed on the connector member, and the voltage converting portion is disposed on the controlling head. After removing the connector member, the mains electricity cannot conduct to the power supply unit via the controlling head. After the connector member is inserted to an electronic device, the control switch is triggered so that the relay circuit conducts with a mains power cable.

Abstract: An optical disc polishing device includes a housing in which a disc turntable assembly is arranged for carrying an optical disc on a rotation surface thereof. The housing includes a cover that carries a polishing assembly. The cover forms a slot serving as a track extending in a radial direction of the optical disc. The polishing assembly includes a positioning member, a polishing wheel, and a locking knob. A threaded section is provided on the positioning member and the polishing wheel is coupled to the positioning member to be opposite to the threaded section. The threaded section is set through the track slot to threadingly engage the locking knob in a releasable and re-tightenable manner so as to allow for position adjustment of the polishing assembly with respect to the track slot. The polishing assembly can thus be positionable to oppose a scratch formed on the disc.

Abstract: An underground generating device includes a housing, a coil assembly mounted in the housing, and a core assembly movably mounted in the housing. The coil assembly includes a coil seat, a plurality of mounting tubes mounted in the coil seat and a plurality of induction coil sets mounted on each of the mounting tubes. The core assembly includes a plurality of cores movably mounted in the mounting tubes, a plurality of magnetic disks mounted on each of the cores, and a driven piece located outside of the housing and connected with the cores. Thus, when the driven piece is pressed intermittently, the magnetic disks are moved to pass through the induction coil sets reciprocally to change the magnetic field between the magnetic disks and the induction coil sets so that the induction coil sets produce an induction current to provide a generating effect.

Abstract: An underground generating device includes a housing, a coil assembly mounted in the housing, and a core assembly movably mounted in the housing. The coil assembly includes a coil seat, a plurality of mounting tubes mounted in the coil seat and a plurality of induction coil sets mounted on each of the mounting tubes. The core assembly includes a plurality of cores movably mounted in the mounting tubes, a plurality of magnetic disks mounted on each of the cores, and a driven piece located outside of the housing and connected with the cores. Thus, when the driven piece is pressed intermittently, the magnetic disks are moved to pass through the induction coil sets reciprocally to change the magnetic field between the magnetic disks and the induction coil sets so that the induction coil sets produce an induction current to provide a generating effect.

Abstract: An optical disc polishing device includes a housing in which a disc turntable assembly is arranged for carrying an optical disc on a rotation surface thereof. The housing includes a cover that carries a polishing assembly. The cover forms a slot serving as a track extending in a radial direction of the optical disc. The polishing assembly includes a positioning member, a polishing wheel, and a locking knob. A threaded section is provided on the positioning member and the polishing wheel is coupled to the positioning member to be opposite to the threaded section. The threaded section is set through the track slot to threadingly engage the locking knob in a releasable and re-tightenable manner so as to allow for position adjustment of the polishing assembly with respect to the track slot. The polishing assembly can thus be positionable to oppose a scratch formed on the disc.

Abstract: An optic disc retaining structure includes an optic disc, a disc carrier, and magnetically attractive device, wherein the carrier forms a hub in the form of a projection extending from a surface of the carrier without any transverse outward protrusion and having an outside diameter substantially corresponding to an inside diameter of a central bore of the optic disc. The magnetically attractive device includes a thin plate of magnetically attractive material and a flexible magnet mounted to and surrounding the central bore of the disc and the hub whereby the disc can be easily disposed into the carrier and attached thereto by the magnetic attraction between the thin plate of magnetically attractive material and the flexible magnet and can be easily removed from the carrier.

Abstract: A structure for a polishing machine of an optical disk, which comprises a motor, a turntable unit integrated with a housing, at least two polishing wheel positioned on a cover which can cover up the housing, and a timer. When the cover is closed, the polishing wheel can polish the optical disk. The primary objective of this invention is to provide a structure for a polishing machine with a precise polishing effect and higher automation to increase the quality of polishing. The secondary objective of the present invention is to provide a structure for a polishing machine which is simplified in structure, miniaturize in volume and is easily stored and used.

Abstract: This invention is related to an improved structure for a polishing machine of an optical disk, which comprises a motor, a turntable unit integrated with a housing, at least two polishing wheel positioned on a cover which can cover up the housing, and a timer. When the cover is closed, the polishing wheel can polish the optical disk. The primary objective of this invention is to provide a structure for a polishing machine with a precise polishing effect and higher automation to increase the quality of polishing. The secondary objective of the present invention is to provide a structure for a polishing machine which is simplified in structure, miniaturize in volume and easy to stored and used personally.