Abstract: The present invention provides a chip including an I/O pin and an ESD protection circuit. The ESD protection circuit includes a P-type device and a first diode, wherein the P-type device is coupled between the I/O pin and a ground voltage, and an anode of the first diode is directly connected to the I/O pin. In addition, the ESD protection circuit does not comprise any device whose N-type doping/diffusion is directly connected to the I/O pin.

Abstract: A photo resist layer is used to protect a dielectric layer and conductive elements embedded in the dielectric layer when patterning an etch stop layer underlying the dielectric layer. The photo resist layer may further be used to etch another dielectric layer underlying the etch stop layer, where etching the next dielectric layer exposes a contact, such as a gate contact. The bottom layer can be used to protect the conductive elements embedded in the dielectric layer from a wet etchant used to etch the etch stop layer.

Abstract: A package structure and the manufacturing method thereof are provided. The package structure includes a first package including at least one first semiconductor die encapsulated in an insulating encapsulation and through insulator vias electrically connected to the at least one first semiconductor die, a second package including at least one second semiconductor die and conductive pads electrically connected to the at least one second semiconductor die, and solder joints located between the first package and the second package. The through insulator vias are encapsulated in the insulating encapsulation. The first package and the second package are electrically connected through the solder joints. A maximum size of the solder joints is greater than a maximum size of the through insulator vias measuring along a horizontal direction, and is greater than or substantially equal to a maximum size of the conductive pads measuring along the horizontal direction.

Abstract: A multi-link rotation structure is provided, including: a base; two arm assemblies, each of the two arm assemblies including a pivot portion pivoted to the base and at least two arms connected with the pivot portion and extending away from each other, the pivot portions of the two arm assemblies being non-coaxial; at least two unidirectional rotation devices, respectively axially pivoted to the at least two arms of one of the two arm assemblies, rotatable in a same direction; at least two linkage assemblies, each of the at least two linkage assemblies pivoted to the at least two arms of the other of the two arm assemblies and pivoted to one of the at least two unidirectional rotation devices.

Abstract: The instant invention is an interactive exercise system that is designed to be used as a preventative means to reduce the risk of developing Carpal Tunnel Syndrome (CTS) and to relieve the symptoms of an individual who has developed CTS. More specifically, this system provides feedback to users and occupational therapists to follow recommended motions accurately and to perform diagnosis.

Abstract: An isolating cover for mounting on a top of a bobbin of a small-scaled transformer to cover windings and pins provided on the bobbin and isolate them from a frame core of the transformer. The isolating cover is so designed that it has isolating walls to provide increased creepage distances between any two components on the transformer and therefore prevents a hipot from directly crossing from a high-tension end to a low-tension end on the transformer. The increased creepage distances at all areas of the bobbin enable upgraded quality and reliability of the transformer. The isolating cover can be easily mounted to the bobbin to replace conventional insulating tape for covering the top of the bobbin, and has dimensions that do not exceed an overall volume defined by the bobbin. The transformer with the isolating cover can therefore be manufactured with simplified procedures and at reduced cost.