Patents by Inventor Ming Tsan LAI

Ming Tsan LAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Planarization device and planarization method using the same
    Patent number: 9434045
    Abstract: A planarization device and a planarization method using the same are provided. The planarization device comprises a platen, a grinding pad, an operation arm, a chuck and a shielding pad. The grinding pad is disposed on the platen. The operation arm has a lower surface. The chuck rotatably is disposed on the operation arm. The shielding pad is detachably disposed on the lower surface of the operation arm.
    Type: Grant
    Filed: May 5, 2014
    Date of Patent: September 6, 2016
    Assignee: MACRONIX INTERNATIONAL CO., LTD.
    Inventors: Yu-Hua Yeh, Liang-Yu Hu, Tang-Tsai Chang, Ming-Tsan Lai
  • PLANARIZATION DEVICE AND PLANARIZATION METHOD USING THE SAME
    Publication number: 20150318179
    Abstract: A planarization device and a planarization method using the same are provided. The planarization device comprises a platen, a grinding pad, an operation arm, a chuck and a shielding pad. The grinding pad is disposed on the platen. The operation arm has a lower surface. The chuck rotatably is disposed on the operation arm. The shielding pad is detachably disposed on the lower surface of the operation arm.
    Type: Application
    Filed: May 5, 2014
    Publication date: November 5, 2015
    Applicant: Macronix International Co., Ltd.
    Inventors: Yu-Hua Yeh, Liang-Yu Hu, Tang-Tsai Chang, Ming-Tsan Lai
  • CMP polishing pad detector and system
    Patent number: 9079287
    Abstract: A chemical mechanical planarization apparatus includes a table, a polishing pad and a detector. The polishing pad is disposed at the table. The detector detects an abnormal condition of the polishing pad.
    Type: Grant
    Filed: October 2, 2013
    Date of Patent: July 14, 2015
    Assignee: MACRONIX INTERNATIONAL CO., LTD.
    Inventors: Ming Tsan Lai, Yu Hua Yeh
  • CMP POLISHING PAD DETECTOR AND SYSTEM
    Publication number: 20140273746
    Abstract: A chemical mechanical planarization apparatus includes a table, a polishing pad and a detector. The polishing pad is disposed at the table. The detector detects an abnormal condition of the polishing pad.
    Type: Application
    Filed: October 2, 2013
    Publication date: September 18, 2014
    Inventors: Ming Tsan LAI, Yu Hua YEH