Abstract: In some implementations, one or more semiconductor processing tools may form a metal cap on a metal gate. The one or more semiconductor processing tools may form one or more dielectric layers on the metal cap. The one or more semiconductor processing tools may form a recess to the metal cap within the one or more dielectric layers. The one or more semiconductor processing tools may perform a bottom-up deposition of metal material on the metal cap to form a metal plug within the recess and directly on the metal cap.

Abstract: An electrical connection structure is provided. The electrical connection structure includes a through hole, a first pad, a second pad and a conductive bridge. The through hole has a first end and a second end. The first pad at least partially surrounds the first end of the through hole and is electrically connected to a first circuit. The second pad is located at the second end of the through hole and is electrically connected to a second circuit. The conductive bridge is connected to the first pad and second pad through the through hole, thereby making the first and second circuits electrically connected to each other.

Abstract: The present disclosure provides an electronic wearable device. The electronic wearable device includes a first module having a first contact and a second module having a second contact. The first contact is configured to keep electrical connection with the second contact in moving with respect to each other during a wearing period.

Abstract: A liquid-cooling device includes multiple water blocks and at least one connection tube. Each of the water blocks has a water incoming end, a water outgoing end and a water-receiving space in communication with the water incoming end and the water outgoing end. The connection tube is disposed between each two water blocks. Two ends of the connection tube are respectively connected with the water incoming end of one of the two water blocks and the water outgoing end of the other water block, whereby the water-receiving spaces of the two water blocks communicate with each other via the connection tube. The connection tube has at least one bellows section between two ends of the connection tube. The liquid-cooling device solves the problems of the conventional liquid-cooling device that when the water block is welded, thermal deformation is produced to cause tolerance and the manufacturing cost is higher.

Abstract: In some implementations, one or more semiconductor processing tools may form a metal cap on a metal gate. The one or more semiconductor processing tools may form one or more dielectric layers on the metal cap. The one or more semiconductor processing tools may form a recess to the metal cap within the one or more dielectric layers. The one or more semiconductor processing tools may perform a bottom-up deposition of metal material on the metal cap to form a metal plug within the recess and directly on the metal cap.

Abstract: An electronic device and a method enables an unlock operation of the electronic device. When the electronic device in a lock state is moved for the unlock operation, the electronic device receives a three-axis acceleration vector of the electronic device from an accelerometer. The electronic device analyzes three movement directions of the electronic device along three coordinate axes. The electronic device determines whether the analyzed three movement directions are the same as three predetermined movement directions along the three coordinate axes. If the analyzed three movement directions are the same as the three predetermined movement directions along the three coordinate axes, the electronic device is changed from the lock state to an unlock state.

Abstract: A portable electronic device includes an earphone jack device for connecting a plug of an earphone and a main circuit board. The main circuit board includes an audio signal processor module connected to the earphone jack device, an MSM module connected to the audio signal processor module, and a PMIC module connected to the earphone jack device. The MSM module generates a first bias voltage inputted into the audio signal processor module to actuate the audio signal processor module to play audio signals, and the PMIC module generates a second bias voltage inputted to the earphone jack device to actuate the earphone connected to the earphone jack device.

Abstract: A portable electronic device includes an earphone jack device for connecting a plug of an earphone and a main circuit board. The main circuit board includes an audio signal processor module connected to the earphone jack device, an MSM module connected to the audio signal processor module, and a PMIC module connected to the earphone jack device. The MSM module generates a first bias voltage inputted into the audio signal processor module to actuate the audio signal processor module to play audio signals, and the PMIC module generates a second bias voltage inputted to the earphone jack device to actuate the earphone connected to the earphone jack device.