Patents by Inventor Ming-Wei Lai

Ming-Wei Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240168266
    Abstract: An optical path folding element includes an optical portion, a connection portion, matte structures and a light blocking layer. The optical portion has an optical surface and two reflective surfaces. A light beam enters into the optical path folding element via the optical surface and is reflected inside the optical path folding element through the optical surface. Each reflective surface is configured to reflect the light beam again inside the optical path folding element. The connection portion has connection surfaces connected to the optical surface and the reflective surfaces. The matte structures are at least disposed on and integrally formed with the connection portion. Each unitary structure of the matte structures is tapered off and recessed from the connection portion, such that the outer surface of the connection portion has an undulating shape. The light blocking layer is at least disposed on the connection portion for blocking light.
    Type: Application
    Filed: October 3, 2023
    Publication date: May 23, 2024
    Applicant: LARGAN PRECISION CO., LTD.
    Inventors: Chen Wei FAN, Syuan Ruei LAI, Jyun-Jia CHENG, Ming-Ta CHOU
  • Publication number: 20240170381
    Abstract: In some implementations, one or more semiconductor processing tools may form a metal cap on a metal gate. The one or more semiconductor processing tools may form one or more dielectric layers on the metal cap. The one or more semiconductor processing tools may form a recess to the metal cap within the one or more dielectric layers. The one or more semiconductor processing tools may perform a bottom-up deposition of metal material on the metal cap to form a metal plug within the recess and directly on the metal cap.
    Type: Application
    Filed: February 1, 2024
    Publication date: May 23, 2024
    Inventors: Chun-Hsien HUANG, Peng-Fu HSU, Yu-Syuan CAI, Min-Hsiu HUNG, Chen-Yuan KAO, Ken-Yu CHANG, Chun-I TSAI, Chia-Han LAI, Chih-Wei CHANG, Ming-Hsing TSAI
  • Patent number: 11969448
    Abstract: A probiotic composition for improving an effect of a chemotherapeutic drug of Gemcitabine on inhibiting pancreatic cancer is disclosed in the present disclosure. The probiotic composition comprises an effective amount of Lactobacillus paracasei GMNL-133, an effective amount of Lactobacillus reuteri GMNL-89, and a pharmaceutically acceptable carrier, wherein the Lactobacillus paracasei GMNL-133 was deposited in the China Center for Type Culture Collection on Sep. 26, 2011 under an accession number CCTCC NO. M 2011331, and the Lactobacillus reuteri GMNL-89 was deposited in the China Center for Type Culture Collection on Nov. 19, 2007 under an accession number CCTCC NO. M 207154. A method for improving the effect of the chemotherapeutic drug of Gemcitabine on inhibiting pancreatic cancer is further disclosed in the present disclosure.
    Type: Grant
    Filed: May 12, 2021
    Date of Patent: April 30, 2024
    Assignee: GENMONT BIOTECH INC.
    Inventors: Wan-Hua Tsai, I-ling Hsu, Shan-ju Hsu, Wen-ling Yeh, Ming-shiou Jan, Wee-wei Chieng, Li-jin Hsu, Ying-chun Lai
  • Patent number: 11971601
    Abstract: An imaging lens assembly includes a plurality of optical elements and an accommodating assembly, wherein the accommodating assembly is for containing the optical elements. The accommodating assembly includes a conical-shaped light blocking sheet and a lens barrel. The conical-shaped light blocking sheet includes an out-side portion and a conical portion, and the conical portion is connected to the out-side portion. The conical portion includes a conical structure tapered from the out-side portion toward one of an object-side and an image-side along the optical axis. The lens barrel is disposed on one side of the conical portion. The optical elements include a most object-side optical element, a most image-side optical element and at least one optical element. The conical structure of the conical-shaped light blocking sheet is physically contacted with only one of the lens barrel, the most object-side optical element and the most image-side optical element.
    Type: Grant
    Filed: June 18, 2021
    Date of Patent: April 30, 2024
    Assignee: LARGAN PRECISION CO., LTD.
    Inventors: Yu-Chen Lai, Chih-Wei Cheng, Ming-Ta Chou, Ming-Shun Chang
  • Patent number: 11929314
    Abstract: In some implementations, one or more semiconductor processing tools may form a metal cap on a metal gate. The one or more semiconductor processing tools may form one or more dielectric layers on the metal cap. The one or more semiconductor processing tools may form a recess to the metal cap within the one or more dielectric layers. The one or more semiconductor processing tools may perform a bottom-up deposition of metal material on the metal cap to form a metal plug within the recess and directly on the metal cap.
    Type: Grant
    Filed: March 12, 2021
    Date of Patent: March 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Hsien Huang, Peng-Fu Hsu, Yu-Syuan Cai, Min-Hsiu Hung, Chen-Yuan Kao, Ken-Yu Chang, Chun-I Tsai, Chia-Han Lai, Chih-Wei Chang, Ming-Hsing Tsai
  • Publication number: 20240071776
    Abstract: A chip packaging structure and a method for fabricating the same are provided. The chip package structure includes a conductive substrate, a dam and a metal shielding layer. The conductive substrate includes a substrate, vias and electrodes. The substrate has first and second board surfaces opposite to each other. The vias penetrate through the first board surface and the second board surface, and a part of the vias is disposed in a first die-bonding region on which a chip is to be arranged. The electrodes extend from the first board surface to the second board surface through the vias. The dam is formed on the first board surface to surround the first die-bonding region, and the dam has a height higher than that of the chip. The metal shielding layer covers the dam and a part of the first board surface that do not overlap with the electrodes.
    Type: Application
    Filed: December 2, 2022
    Publication date: February 29, 2024
    Inventors: DEI-CHENG LIU, CHIA-SHUAI CHANG, MING-YEN PAN, JIAN-YU SHIH, JHIH-WEI LAI, SHIH-HAN WU
  • Patent number: 9837244
    Abstract: A sample holding device for studying light-driven reactions and a sample analysis method using the same are disclosed. The sample holding device comprises a main body, a supporting structure and a light source assembly. The main body has a channel which has a first end and a second end opposite to the first end, and a focusing lens which is located on the second end. The supporting structure is located on one end of the main body for sample supporting. The light source assembly is detachably disposed on the other end opposite to the end which is disposed with the supporting structure. The light source assembly emits a light beam into the first end of the channel. The light beam then irradiates the sample which locates on the supporting structure after passing through the focusing lens.
    Type: Grant
    Filed: December 26, 2014
    Date of Patent: December 5, 2017
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSITUTE
    Inventors: Ming-Wei Lai, Shen-Chuan Lo
  • Publication number: 20160189918
    Abstract: A sample holding device for studying light-driven reactions and a sample analysis method using the same are disclosed. The sample holding device comprises a main body, a supporting structure and a light source assembly. The main body has a channel which has a first end and a second end opposite to the first end, and a focusing lens which is located on the second end. The supporting structure is located on one end of the main body for sample supporting. The light source assembly is detachably disposed on the other end opposite to the end which is disposed with the supporting structure. The light source assembly emits a light beam into the first end of the channel. The light beam then irradiates the sample which locates on the supporting structure after passing through the focusing lens.
    Type: Application
    Filed: December 26, 2014
    Publication date: June 30, 2016
    Inventors: MING-WEI LAI, SHEN-CHUAN LO
  • Patent number: 9231893
    Abstract: An embodiment of the invention provides a processing circuit of a telecommunications device. The processing circuit includes a pre-buffer, a de-shuffler, and a processing module. The pre-buffer is configured to receive and buffer a plurality of sets of data of a transport block in a shuffled order. The sets of data correspond to a plurality of code blocks, respectively. The de-shuffler is coupled to the pre-buffer and is configured to retrieve the sets of data from the pre-buffer in a de-shuffled order. The de-shuffled order is different from the shuffled order. The processing module is coupled to the de-shuffler and is configured to receive the sets of data from the de-shuffler in the de-shuffled order to recover the code blocks.
    Type: Grant
    Filed: May 15, 2013
    Date of Patent: January 5, 2016
    Assignee: MEDIATEK INC.
    Inventors: Kai-Li Lin, Ming-Chih Hu, Ming-Wei Lai
  • Patent number: 9082582
    Abstract: A carrier assembly and an operation method thereof are provided. The carrier assembly comprises a base, a first gear element, a second gear element, an object-carrier and a fixing part. The first gear element is rotatably disposed on the base, and the second gear element is rotatably disposed on the base and meshed with the first gear element. The object-carrier is used for carrying an object. The fixing part connects the base to a carrier platform. Wherein, an included angle is contained between the rotating axis of the first gear element and the rotating axis of the second gear element.
    Type: Grant
    Filed: September 1, 2011
    Date of Patent: July 14, 2015
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Shen-Chuan Lo, Ming-Wei Lai, Mei-Lun Wu, Li-Jiaun Lin
  • Publication number: 20140341233
    Abstract: An embodiment of the invention provides a processing circuit of a telecommunications device. The processing circuit includes a pre-buffer, a de-shuffler, and a processing module. The pre-buffer is configured to receive and buffer a plurality of sets of data of a transport block in a shuffled order. The sets of data correspond to a plurality of code blocks, respectively. The de-shuffler is coupled to the pre-buffer and is configured to retrieve the sets of data from the pre-buffer in a de-shuffled order. The de-shuffled order is different from the shuffled order. The processing module is coupled to the de-shuffler and is configured to receive the sets of data from the de-shuffler in the de-shuffled order to recover the code blocks.
    Type: Application
    Filed: May 15, 2013
    Publication date: November 20, 2014
    Applicant: MEDIATEK INC.
    Inventors: Kai-Li Lin, Ming-Chih Hu, Ming-Wei Lai
  • Patent number: 8481967
    Abstract: A method of processing objects by a FIB (Focused Ion Beam) system and a carrier used therewith are provided. The carrier includes a carrying member and a processing portion having an object disposed thereon. Before the carrier is disposed into the FIB system, the carrying member is set to be flush in height with the processing portion having the object disposed thereon. After an eucentric height adjustment inside the FIB system, both the carrying member and the processing portion are in a same plane with the eucentric point of the system. Therefore, after the object on the processing portion is processed, a processed object or a processed block of the object can be moved to the carrying member without performing further eucentric height adjustment with respect to the carrying member.
    Type: Grant
    Filed: June 10, 2009
    Date of Patent: July 9, 2013
    Assignee: Industrial Technology Research Institute
    Inventors: Shen-Chuan Lo, Ming-Wei Lai, Shi-Ri Lee, Li-Jiaun Lin
  • Publication number: 20120162756
    Abstract: A carrier assembly and an operation method thereof are provided. The carrier assembly comprises a base, a first gear element, a second gear element, an object-carrier and a fixing part. The first gear element is rotatably disposed on the base, and the second gear element is rotatably disposed on the base and meshed with the first gear element. The object-carrier is used for carrying an object. The fixing part connects the base to a carrier platform. Wherein, an included angle is contained between the rotating axis of the first gear element and the rotating axis of the second gear element.
    Type: Application
    Filed: September 1, 2011
    Publication date: June 28, 2012
    Inventors: Shen-Chuan LO, Ming-Wei Lai, Mei-Lun Wu, Li-Jiaun Lin
  • Publication number: 20100163752
    Abstract: A method of processing objects by a FIB (Focused Ion Beam) system and a carrier used therewith are provided. The carrier includes a carrying member and a processing portion having an object disposed thereon. Before the carrier is disposed into the FIB system, the carrying member is set to be flush in height with the processing portion having the object disposed thereon. After an eucentric height adjustment inside the FIB system, both the carrying member and the processing portion are in a same plane with the eucentric point of the system. Therefore, after the object on the processing portion is processed, a processed object or a processed block of the object can be moved to the carrying member without performing further eucentric height adjustment with respect to the carrying member.
    Type: Application
    Filed: June 10, 2009
    Publication date: July 1, 2010
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Shen-Chuan LO, Ming-Wei Lai, Shi-Ri Lee, Li-Jiaun Lin
  • Patent number: 7724163
    Abstract: An apparatus and method of multi-stage network for iterative network are disclosed. The apparatus has M stages, and each stage uses N multiplexers to transmit N codeword partitions simultaneously. Every starting terminal, either the output port of memories, soft-in soft-out decoders, or multiplexers, has two paths to couple with two different multiplexers at next stage. One path connects the source to the first data port of one multiplexer; the other connects the source to the second data port of another multiplexer. The two multiplexers will be controlled with the same 1-bit signal, so each source has only one valid path to next stage. The invention can guarantee that the transmission of N data blocks is free from contention.
    Type: Grant
    Filed: July 24, 2008
    Date of Patent: May 25, 2010
    Assignee: National Chiao Tung University
    Inventors: Cheng-Chi Wong, Yung-Yu Lee, Ming-Wei Lai, Chien-Ching Lin, Hsie-Chia Chang, Chen-Yi Lee
  • Publication number: 20090160686
    Abstract: An apparatus and method of multi-stage network for iterative network are disclosed. The apparatus has M stages, and each stage uses N multiplexers to transmit N codeword partitions simultaneously. Every starting terminal, either the output port of memories, soft-in soft-out decoders, or multiplexers, has two paths to couple with two different multiplexers at next stage. One path connects the source to the first data port of one multiplexer; the other connects the source to the second data port of another multiplexer. The two multiplexers will be controlled with the same 1-bit signal, so each source has only one valid path to next stage. The invention can guarantee that the transmission of N data blocks is free from contention.
    Type: Application
    Filed: July 24, 2008
    Publication date: June 25, 2009
    Inventors: Cheng-Chi WONG, Yung-Yu LEE, Ming-Wei LAI, Chien-Ching LIN, Hsie-Chia CHANG, Chen-Yi LEE