Abstract: An electronic device is provided. The electronic device includes a first substrate, an insulating layer, a first conductive layer and a second conductive layer. The insulating layer is overlapped with the first substrate. The second conductive layer contacts with the first conductive layer. The first conductive layer and the second conductive layer are disposed between the first substrate and the insulating layer. The second conductive layer is disposed between the first conductive layer and the insulating layer. Moreover, a thermal expansion coefficient of the second conductive layer is between a thermal expansion coefficient of the first conductive layer and a thermal expansion coefficient of the insulating layer.

Abstract: Provided are a passivation layer for forming a semiconductor bonding structure, a sputtering target making the same, a semiconductor bonding structure and a semiconductor bonding process. The passivation layer is formed on a bonding substrate by sputtering the sputtering target; the passivation layer and the sputtering target comprise a first metal, a second metal or a combination thereof. The bonding substrate comprises a third metal. Based on a total atom number of the surface of the passivation layer, O content of the surface of the passivation layer is less than 30 at %; the third metal content of the surface of the passivation layer is less than or equal to 10 at %. The passivation layer has a polycrystalline structure. The semiconductor bonding structure sequentially comprises a first bonding substrate, a bonding layer and a second bonding substrate: the bonding layer is mainly formed by the passivation layer and the third metal.

Abstract: An electronic device includes a substrate, a driving element, a first insulating layer, a pixel electrode layer, and a common electrode layer. The driving element is disposed on the substrate. The first insulating layer is disposed on the driving element. The pixel electrode layer is disposed on the first insulating layer. The first insulating layer comprises a hole, and the pixel electrode layer is electrically connected to the driving element through the hole. The common electrode layer is disposed on the pixel electrode layer. The common electrode layer comprises a slit, and the slit has an edge, and the edge is disposed in the hole.

Abstract: A chip packaging structure and a method for fabricating the same are provided. The chip package structure includes a conductive substrate, a dam and a metal shielding layer. The conductive substrate includes a substrate, vias and electrodes. The substrate has first and second board surfaces opposite to each other. The vias penetrate through the first board surface and the second board surface, and a part of the vias is disposed in a first die-bonding region on which a chip is to be arranged. The electrodes extend from the first board surface to the second board surface through the vias. The dam is formed on the first board surface to surround the first die-bonding region, and the dam has a height higher than that of the chip. The metal shielding layer covers the dam and a part of the first board surface that do not overlap with the electrodes.

Abstract: A backlight apparatus includes a circuit board, a control board, and a connection cable connecting the above components. A first light source driver and a second light source driver are disposed on the circuit board and are electrically connected to a plurality of first light sources and a plurality of second light sources respectively. A connector is disposed on the circuit board. The first and second light source drivers are individually electrically coupled in series to the connector. The control board outputs electrical power, a first data stream, and a second data stream. The first light source driver controls the first light sources to light individually according to the first data stream. The second light source driver controls the second light sources to light individually according to the second data stream. Thereby, the circuit board can control the operation of the light sources individually.

Abstract: A backlight apparatus includes a circuit board, a control board, and a connection cable connecting the above components. A first light source driver and a second light source driver are disposed on the circuit board and are electrically connected to a plurality of first light sources and a plurality of second light sources respectively. A connector is disposed on the circuit board. The first and second light source drivers are individually electrically coupled in series to the connector. The control board outputs electrical power, a first data stream, and a second data stream. The first light source driver controls the first light sources to light individually according to the first data stream. The second light source driver controls the second light sources to light individually according to the second data stream. Thereby, the circuit board can control the operation of the light sources individually.

Abstract: A backlight apparatus includes a circuit board, a control board, and a connection cable connecting the above components. A first light source driver and a second light source driver are disposed on the circuit board and are electrically connected to a plurality of first light sources and a plurality of second light sources respectively. A connector is disposed on the circuit board. The first and second light source drivers are individually electrically coupled in series to the connector. The control board outputs electrical power, a first data stream, and a second data stream. The first light source driver controls the plurality of first light sources to light individually according to the first data stream. The second light source driver controls the plurality of second light sources to light individually according to the second data stream. Thereby, the circuit board can control the operation of the light sources individually.

Abstract: A backlight apparatus includes a circuit board, a control board, and a connection cable connecting the above components. A first light source driver and a second light source driver are disposed on the circuit board and are electrically connected to a plurality of first light sources and a plurality of second light sources respectively. A connector is disposed on the circuit board. The first and second light source drivers are individually electrically coupled in series to the connector. The control board outputs electrical power, a first data stream, and a second data stream. The first light source driver controls the plurality of first light sources to light individually according to the first data stream. The second light source driver controls the plurality of second light sources to light individually according to the second data stream. Thereby, the circuit board can control the operation of the light sources individually.

Abstract: An electronic assembly including a portable electronic device and a docking station is provided. The portable electronic device has a first surface and a second surface opposite to each other, and the first surface is a display. The docking station includes a body, and first, second, and third supporting plates disposed thereon, wherein the first, the third, and the second supporting plates are located on the body side by side sequentially. The first supporting plate is hinged to the body along a first axis, the second supporting plate is hinged to the body along a second axis, the third supporting plate is freely pivoted to the second supporting plate along the first axis, and freely pivoted to the first supporting plate along the second axis, wherein the first axis and the second axis are parallel to but not overlapped with each other. A docking station is also provided.

Abstract: An electronic assembly including a portable electronic device and a docking station is provided. The portable electronic device has a first surface and a second surface opposite to each other, and the first surface is a display. The docking station includes a body, and first, second, and third supporting plates disposed thereon, wherein the first, the third, and the second supporting plates are located on the body side by side sequentially. The first supporting plate is hinged to the body along a first axis, the second supporting plate is hinged to the body along a second axis, the third supporting plate is freely pivoted to the second supporting pate along the first axis, and freely pivoted to the first supporting plate along the second axis, wherein the first axis and the second axis are parallel to but not overlapped with each other. A docking station is also provided.

Abstract: A pivoting mechanism, including a first bracket, a second bracket, at least one first crank, and at least one second crank, is provided. The first bracket connecting a first body of an electronic device has a first slot. The second bracket connecting a second body has a second slot. The first crank has a first end slidably and rotatably coupled to the first slot, a second end pivoted to the second bracket, and a first pivoting portion. The second crank has a third end slidably and rotatably coupled to the second slot, a fourth end pivoted to the first bracket, and a second pivoting portion. The first and second pivoting portions are connected to form a rotation center, such that the first and second cranks are rotated about the rotation center and the first and second ends slide in the first and second slots respectively.

Abstract: An electronic device is provided, including a first module, a second module, and a protecting member. The first module includes a side surface and a fixed member, wherein the fixed member includes a protrusion protruding from the side surface. The second module includes a recess. The protecting member encompasses the protrusion and includes a first surface, a second surface, and an elastic portion, wherein the first surface is opposite to the second surface. The elastic portion protrudes from the first surface. When the protrusion is joined to the recess, the second surface and the elastic portion contact an inner wall of the recess.

Abstract: A docking station for installing a portable electronic device is provided. The portable electronic device includes a display surface and at least one slot located at one side of the display surface. The docking station includes a supporting structure, at least one hook, and at least one first magnetic element. The supporting structure includes a body and a shell. The shell covers the body. The hook is disposed on the body and extrudes out of the supporting surface of the shell. The first magnetic element is disposed on the body and located in the shell. The hook is adapted to inlay in the slot and the first magnetic element is adapted to attract the portable electronic device, such that the portable electronic device is fixed on the supporting structure.

Abstract: A docking station capable of assembling a portable electronic device is provided. The portable electronic device has a display screen and a slot. The docking station includes a body and a pressing member. The body has a protrusion. The pressing member is movably arranged in the body, so as to be hidden in the body or moved out of the body. When the portable electronic device is locked with the protrusion through the slot, the pressing member is moved out of the body and presses against the portable electronic device along a pressing direction, so that the portable electronic device is fixed onto the body. The pressing direction is perpendicular to the display screen.

Abstract: An electronic device is provided, including a first module, a second module, and a protecting member. The first module includes a side surface and a fixed member, wherein the fixed member includes a protrusion protruding from the side surface. The second module includes a recess. The protecting member encompasses the protrusion and includes a first surface, a second surface, and an elastic portion, wherein the first surface is opposite to the second surface. The elastic portion protrudes from the first surface. When the protrusion is joined to the recess, the second surface and the elastic portion contact an inner wall of the recess.

Abstract: A docking station for installing a portable electronic device is provided. The portable electronic device includes a display surface and at least one slot located at one side of the display surface. The docking station includes a supporting structure, at least one hook, and at least one first magnetic element. The supporting structure includes a body and a shell. The shell covers the body. The hook is disposed on the body and extrudes out of the supporting surface of the shell. The first magnetic element is disposed on the body and located in the shell. The hook is adapted to inlay in the slot and the first magnetic element is adapted to attract the portable electronic device, such that the portable electronic device is fixed on the supporting structure.

Abstract: A docking station capable of assembling a portable electronic device is provided. The portable electronic device has a display screen and a slot. The docking station includes a body and a pressing member. The body has a protrusion. The pressing member is movably arranged in the body, so as to be hidden in the body or moved out of the body. When the portable electronic device is locked with the protrusion through the slot, the pressing member is moved out of the body and presses against the portable electronic device along a pressing direction, so that the portable electronic device is fixed onto the body. The pressing direction is perpendicular to the display screen.

Abstract: Disclosed is a leadframe-type semiconductor package having an EMI shielding layer connected to ground, comprising a leadframe, a chip, an encapsulant, and an EMI shielding layer. The encapsulant has two lead-extending sides and two leadless sides. The EMI shielding layer covers at least one surface of the encapsulant and the leadless sides. A metal tie bar coupling to the die attach pad of the leadframe has a cut end aligned with and exposed on one of the leadless sides. A ground lead also has a cut end aligned with and exposed on one of the leadless sides Since the EMI shielding layer covers and electrically connects the cut ends of the metal tie bar and the ground lead, the die pad with its metal tie bar of the leadframe is connected to the ground lead through external electrical connection outside the encapsulant to allow the die pad having ground potential.

Abstract: Disclosed is a leadframe-type semiconductor package having an EMI shielding layer connected to ground, comprising a leadframe, a chip, an encapsulant, and an EMI shielding layer. The encapsulant has two lead-extending sides and two leadless sides. The EMI shielding layer covers at least one surface of the encapsulant and the leadless sides. A metal tie bar coupling to the die attach pad of the leadframe has a cut end aligned with and exposed on one of the leadless sides. A ground lead also has a cut end aligned with and exposed on one of the leadless sides Since the EMI shielding layer covers and electrically connects the cut ends of the metal tie bar and the ground lead, the die pad with its metal tie bar of the leadframe is connected to the ground lead through external electrical connection outside the encapsulant to allow the die pad having ground potential.

Abstract: A connection mechanism connecting the main body and display of an electronic device includes an arm, a first hinge connecting the main body with the arm, a second hinge connecting the arm with the display, and a magnetic element disposed on the arm for exerting a magnetic attraction force on the display. When the arm rotates in a first direction relative to the main body with an included angle between the main body and the display smaller than a critical angle, a first torque opposite to the first direction is provided by the first hinge. When the arm continues rotating relative to the main body with the included angle between the main body and the display exceeding or equaling the critical angle, a second torque opposite to the first direction is provided by the first hinge, wherein the second torque exceeds the first torque.