Abstract: An imaging lens assembly includes a lens barrel, optical lens elements, an annular retaining element and a nano-microstructure. The optical lens elements include at least one optical lens element disposed in the lens barrel. The annular retaining element is physically contacted with the optical lens element, and the annular retaining element includes an object-side surface, an image-side surface, an outer diameter surface and a light-through hole. The outer diameter surface is connected to the object-side surface and the image-side surface. The light-through hole is formed by gradually tapering from the object-side surface and the image-side surface towards the optical axis. The nano-microstructure has a plurality of irregular ridged convexes. The nano-microstructure is located between a lens barrel area defined via the lens barrel and a lens element area defined via the optical lens element on a direction vertical to the optical axis.

Abstract: Provided herein is a method for preventing or treating an Epstein-Barr virus (EBV) infection, including administering to the subject in need thereof with an effective amount of immunomodulatory protein of Ganoderma, a recombinant thereof, or a fungal immunomodulatory protein of a similar structure. Also provided is a method for preventing or treating an EBV-associated cancer.

Abstract: An embedded circuit board made without gas bubbles or significant internal gaps according to a manufacturing method which is here disclosed comprises an inner layer assembly, an embedded element, and first and second insulating elements. The inner layer assembly comprises a first main portion with opposing first and second surfaces, a first groove not extending to the second surface is positioned at the first surface. A first opening penetrates the second surface, and the first opening and the first groove are connected. The first groove carries electronic elements for embedment. The first insulating element covers the first surface and a surface of the embedded element away from the second surface. The second insulating element covers the second surface and extends into the first opening to be in contact with the embedded element.

Abstract: Text-to-image generation generally refers to the process of generating an image from one or more text prompts input by a user. While artificial intelligence has been a valuable tool for text-to-image generation, current artificial intelligence-based solutions are more limited as it relates to text-to-3D content creation. For example, these solutions are oftentimes category-dependent, or synthesize 3D content at a low resolution. The present disclosure provides a process and architecture for high-resolution text-to-3D content creation.

Abstract: An adhesive and a method for removing the adhesive are provided. The adhesive includes component (A) and component (B). Component (A) is a combination of a first acrylate resin and a first compound, a second acrylate resin, a combination of the first acrylate resin and the second acrylate resin, a combination of the second acrylate resin and the first compound, or a combination of the first acrylate resin, the second acrylate resin and the first compound. The first acrylate resin has an iodine value from 0 to 3. The second acrylate resin has an acrylate group, or methacrylate group. Component (B) is a near infrared sensitizer. The first compound has at least two reactive functional groups, wherein the reactive functional groups are acrylate group, methacrylate group, or a combination thereof.

Abstract: A dynamic aperture module includes a blade set and a driving portion. The blade set includes a plurality of blades, which are disposed around an optical axis to form a light through hole and rotatable for adjusting the light through hole. The driving portion includes a rotating element, at least one magnet and at least one coil. The rotating element corresponds to the blades and is configured to drive the blades to rotate, so that a dimension of the light through hole is variable. The magnet includes four polarities. The polarities of the magnet are relatively distributed along a direction surrounding the optical axis and a direction parallel to the optical axis, respectively. The coil corresponds to the magnet, and one of the magnet and the coil is disposed on the rotating element. The magnet and the coil are disposed along the direction parallel to the optical axis.

Abstract: A semiconductor structure includes a first dielectric layer, a first metallic feature over the first dielectric layer, an air gap over the first dielectric layer and adjacent to the first metallic feature, a second dielectric layer disposed above the air gap and on a sidewall of the first metallic feature, and a third dielectric layer disposed above the air gap and on a sidewall of the second dielectric layer. A lower portion of the first metallic feature is exposed in the air gap. The third and the second dielectric layers are substantially co-planar.

Abstract: In some embodiments, the present disclosure relates an integrated chip including a substrate. A conductive interconnect feature is arranged over the substrate. The conductive interconnect feature has a base feature portion with a base feature width and an upper feature portion with an upper feature width. The upper feature width is narrower than the base feature width such that the conductive interconnect feature has tapered outer feature sidewalls. An interconnect via is arranged over the conductive interconnect feature. The interconnect via has a base via portion with a base via width and an upper via portion with an upper via width. The upper via width is wider than the base via width such that the interconnect via has tapered outer via sidewalls.

Abstract: A semiconductor chip includes a first intellectual property block. There are a second intellectual property block and a third intellectual property block around the first intellectual property block. There is a multiple metal layer stack over the first intellectual property block, the second intellectual property block, and the third intellectual property block. An interconnect structure is situated in the upper portion of the multiple metal layer stack. The interconnect structure is configured for connecting the first intellectual property block and the second intellectual property block. In addition, at least a part of the interconnect structure extends across and over the third intellectual property block.

Abstract: Provided are a passivation layer for forming a semiconductor bonding structure, a sputtering target making the same, a semiconductor bonding structure and a semiconductor bonding process. The passivation layer is formed on a bonding substrate by sputtering the sputtering target; the passivation layer and the sputtering target comprise a first metal, a second metal or a combination thereof. The bonding substrate comprises a third metal. Based on a total atom number of the surface of the passivation layer, O content of the surface of the passivation layer is less than 30 at %; the third metal content of the surface of the passivation layer is less than or equal to 10 at %. The passivation layer has a polycrystalline structure. The semiconductor bonding structure sequentially comprises a first bonding substrate, a bonding layer and a second bonding substrate: the bonding layer is mainly formed by the passivation layer and the third metal.

Abstract: A lighting device includes a light board and a light dimmer circuit. The light board includes multiple first light emitting elements and second light emitting elements. The first light emitting elements are disposed in a first area of the light board. The second light emitting elements are disposed in a second area of the light board. The light dimmer circuit is configured to drive the second light emitting elements to generate flickering lights from the second area of the light board, and is configured to drive the first light emitting elements to generate non-flickering lights from the first area of the light board.

Abstract: A mounting system is disclosed that includes a bracket configured to mount an object on a structure. The bracket includes a front panel, two side panels extending from the front panel, and a plurality of slots. Each slot is configured to accept a projection connected to the object and retain the projection within the slot. The bracket further includes a plurality of apertures. The mounting system further includes a retainer configured to extend into the bracket through the plurality of apertures and prevent, at least in part, the plurality of projections, retained by the bracket in the plurality of slots, from being withdrawn from the plurality of slots.

Abstract: An annular airflow regulating apparatus includes a cup-shaped element and an adjustment element. The cup-shaped element has a bowl and a bottom, integrated to form a first chamber. The bottom has a tapered channel parallel to an axis and penetrating through the bottom. A ring-shaped groove is disposed between the tapered channel and the bottom. The ring-shaped groove has an annular plane perpendicular to the axis. The adjustment element, having a tapered portion and second holes, is movably disposed in the cup-shaped element. The tapered portion protrudes into the tapered channel A tapered annular gap is formed between the tapered portion and the tapered channel. When the adjustment element is moved with respect to the cup-shaped element, a width of the tapered annular gap is varied, and thereupon a flow rate and velocity of the process gas would be varied accordingly.

Abstract: A quantitative evaluation method for integrity and damage evolution of a cement sheath in an oil-gas well is provided based on a fractal theory, an image processing technology, structural features and failure mechanisms of a casing-cement sheath-formation combination. The method uses correlations among fractal dimensions of casing-cement sheath interface morphology, cement sheath microscopic pore morphology, particle morphology of an initial blank group, and macroscopic mechanical properties including a radial cementing strength of the cement sheath interface, a tensile strength, and a compressive strength to quantitatively evaluate the integrity of the cement sheath of the blank group.

Abstract: An embedded circuit board, made without gas bubbles or significant internal gaps according to a manufacturing method which is provided, includes an inner layer assembly, an embedded element, and first and second insulating elements. The inner layer assembly comprises a first main portion with opposing first and second surfaces and a first groove not extending to the second surface is positioned at the first surface. A first opening penetrates the second surface, and the first opening and the first groove are connected. The first groove carries electronic elements for embedment. The first insulating element covers the first surface and a surface of the embedded element away from the second surface. The second insulating element covers the second surface and extends into the first opening to be in contact with the embedded element.

Abstract: The present disclosure relates to an injectable lurasidone suspension and a preparation method thereof, and in particular to an irregular form of a lurasidone solid and a pharmaceutical composition thereof. The present disclosure also relates to a preparation method for the solid and the pharmaceutical composition thereof, and an application thereof in the treatment of mental diseases. According to the present disclosure, the lurasidone solid prepared has controllable particle size and has Dv5O particle size of 6 ?m to 110 ?m. The good particle size stability can also he maintained in the pharmaceutical composition. The lurasidone suspension preparation obtained by the method is fast-acting, has a long sustained release period, and can effectively reduce the risk caused by poor patient compliance.

Abstract: Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.

Abstract: Provided is a lens assembly driving module including a photographing lens assembly, a first driving mechanism and a second driving mechanism. The photographing lens assembly includes N lens elements and has an optical axis passing through the N lens elements. The first driving mechanism drives at least N/2 said lens elements to move along the optical axis of the photographing lens assembly. The second driving mechanism enables a relative distance along the optical axis of two adjacent ones of the N lens elements to vary. Therefore, any specific one of the lens elements is capable of being driven to optimize optical imaging resolution of various fields of view independently within a real shot at different object distances.

Abstract: The present disclosure discloses a data receiving apparatus and a data receiving method having blind deconvolution mechanism. A descrambling circuit descrambles received data according to an antenna assumption and N data position assumptions within a transmission period to generate N groups of soft-bit data. A soft-bit processing circuit retrieves bit position data to determine non-variable bit positions and variable bit positions. N circular buffers of a storage circuit store and superimpose the N groups of soft-bit data corresponding to N data position assumptions in a circular manner to generate N groups of superimposed results and keep the data corresponding to the non-variable bit positions. A post-processing circuit performs de-interleaving and decoding on the N groups of superimposed results to generate N groups of decoded results to perform redundancy check thereon. When one decoded results passes the redundancy check, the soft-bit processing circuit stops performing the blind deconvolution process.

Abstract: Provided is a pharmaceutical composition including an active pharmaceutical ingredient, a toll-like receptor (TLR) agonist, a stimulator of interferon genes (STING) agonist, and a pharmaceutically acceptable carrier. Also provided are a method for inducing immune response and a method for treating or preventing cancer or an infectious disease, including administering an effective amount of the pharmaceutical composition to a subject in need thereof.