Abstract: An imaging lens assembly module includes an imaging lens assembly and a variable aperture module. The imaging lens assembly has an optical axis. The variable aperture module includes a light blocking sheet set, a fixed element, a movable element, and an annular light blocking portion. The light blocking sheet set includes at least two light blocking sheets, wherein the at least two light blocking sheets are mutually stacked along a circumferential direction surrounding the optical axis to form a variable aperture opening. The fixed element has a sidewall structure. The annular light blocking portion surrounds the optical axis to form a fixed aperture opening.

Abstract: A lithium battery includes a positive electrode plate, a negative electrode plate, an electrolyte disposed between the positive electrode plate and the negative electrode plate, a separator disposed in the electrolyte, and an organic-inorganic composite film disposed on the surface of the positive electrode plate, the surface of the negative electrode plate, the surface of the separator, or a combination thereof. The organic-inorganic composite film includes 100 parts by weight of clay, 3 to 35 parts by weight of lignocellulose, and 25 to 270 parts by weight of a first binder.

Abstract: A package includes a frontside redistribution layer (RDL) structure, a semiconductor die on the frontside RDL structure, and a backside RDL structure on the semiconductor die including a first RDL, and a backside connector extending from a distal side of the first RDL and including a tapered portion having a width that decreases in a direction away from the first RDL, wherein the tapered portion includes a contact surface at an end of the tapered portion. A method of forming the package may include forming the backside redistribution layer (RDL) structure, attaching a semiconductor die to the backside RDL structure, forming an encapsulation layer around the semiconductor die on the backside RDL structure, and forming a frontside RDL structure on the semiconductor die and the encapsulation layer.

Abstract: An adhesive and a method for removing the adhesive are provided. The adhesive includes component (A) and component (B). Component (A) is a combination of a first acrylate resin and a first compound, a second acrylate resin, a combination of the first acrylate resin and the second acrylate resin, a combination of the second acrylate resin and the first compound, or a combination of the first acrylate resin, the second acrylate resin and the first compound. The first acrylate resin has an iodine value from 0 to 3. The second acrylate resin has an acrylate group, or methacrylate group. Component (B) is a near infrared sensitizer. The first compound has at least two reactive functional groups, wherein the reactive functional groups are acrylate group, methacrylate group, or a combination thereof.

Abstract: A dynamic aperture module includes a blade set and a driving portion. The blade set includes a plurality of blades, which are disposed around an optical axis to form a light through hole and rotatable for adjusting the light through hole. The driving portion includes a rotating element, at least one magnet and at least one coil. The rotating element corresponds to the blades and is configured to drive the blades to rotate, so that a dimension of the light through hole is variable. The magnet includes four polarities. The polarities of the magnet are relatively distributed along a direction surrounding the optical axis and a direction parallel to the optical axis, respectively. The coil corresponds to the magnet, and one of the magnet and the coil is disposed on the rotating element. The magnet and the coil are disposed along the direction parallel to the optical axis.

Abstract: A semiconductor chip includes a first intellectual property block. There are a second intellectual property block and a third intellectual property block around the first intellectual property block. There is a multiple metal layer stack over the first intellectual property block, the second intellectual property block, and the third intellectual property block. An interconnect structure is situated in the upper portion of the multiple metal layer stack. The interconnect structure is configured for connecting the first intellectual property block and the second intellectual property block. In addition, at least a part of the interconnect structure extends across and over the third intellectual property block.

Abstract: Provided are a passivation layer for forming a semiconductor bonding structure, a sputtering target making the same, a semiconductor bonding structure and a semiconductor bonding process. The passivation layer is formed on a bonding substrate by sputtering the sputtering target; the passivation layer and the sputtering target comprise a first metal, a second metal or a combination thereof. The bonding substrate comprises a third metal. Based on a total atom number of the surface of the passivation layer, O content of the surface of the passivation layer is less than 30 at %; the third metal content of the surface of the passivation layer is less than or equal to 10 at %. The passivation layer has a polycrystalline structure. The semiconductor bonding structure sequentially comprises a first bonding substrate, a bonding layer and a second bonding substrate: the bonding layer is mainly formed by the passivation layer and the third metal.

Abstract: A lighting device includes a light board and a light dimmer circuit. The light board includes multiple first light emitting elements and second light emitting elements. The first light emitting elements are disposed in a first area of the light board. The second light emitting elements are disposed in a second area of the light board. The light dimmer circuit is configured to drive the second light emitting elements to generate flickering lights from the second area of the light board, and is configured to drive the first light emitting elements to generate non-flickering lights from the first area of the light board.

Abstract: Provided is a lens assembly driving module including a photographing lens assembly, a first driving mechanism and a second driving mechanism. The photographing lens assembly includes N lens elements and has an optical axis passing through the N lens elements. The first driving mechanism drives at least N/2 said lens elements to move along the optical axis of the photographing lens assembly. The second driving mechanism enables a relative distance along the optical axis of two adjacent ones of the N lens elements to vary. Therefore, any specific one of the lens elements is capable of being driven to optimize optical imaging resolution of various fields of view independently within a real shot at different object distances.

Abstract: An imaging lens module includes a casing, an imaging lens disposed to the casing, a lens carrier supporting the image lens, an elastic element connected to the lens carrier to provide the lens carrier with a translational degree of freedom along an optical axis, a frame connected to the elastic element such that the lens carrier is movable along the optical axis with respect to the frame, a variable through hole module coupled to the imaging lens and having a light passable hole with a variable aperture size, and a wiring assembly including a fixed wiring part at least partially located closer to the opening than the elastic element and a movable wiring part electrically connected to the fixed wiring part and the variable through hole module. The optical axis passes through lens elements of the imaging lens and the center of the variable through hole module.

Abstract: An electronic device includes a control module and a touch panel. The touch panel receives a first signal and a second signal from the control module. The first signal is at a high level when the touch panel is operating normally. When the electronic device enters sleep mode, the control module turns the first signal to be at a low level and records a first operating status of the second signal. The electronic device stops supplying power for the touch panel when the first signal is at a low level; when the electronic device quits sleep mode, the control module adjusts statuses of the first and second signals according to a first sequence. When the first signal is at the high level and the second signal is in the first operating status, the touch panel continues to operate.

Abstract: A file transmitting system and method can deliver a file to other directories according to a user's operation. The system and method record status information corresponding to different user interfaces, and are configured to detect a user interface and a file that the user is operating. The system and method further deliver the file to a designated directory from the record without changing a current user interface to the user interface with the designated directory.

Abstract: An electronic device includes a main board. The main board includes a number of PCI interfaces, an addressing unit, a determination unit, and a control unit. The addressing unit is configured for addressing addresses of each of the PCI interfaces of the main board from an address bus of the electronic device. The determination unit is configured for determining whether any PCI interfaces are not connected to corresponding PCI devices according to a value at the addressed addresses. The control unit is configured to turn off the PCI interfaces that are not connected to corresponding PCI devices. A method for controlling status of the PCI interfaces is also provided.

Abstract: An electronic device includes a memory, an addressing unit, a status determination unit, and a control unit. The memory unit stores a memory status parameter. The addressing unit is configured for addressing an address of the memory status parameter of the memory. The status determination unit is configured for determining a status of the memory according to a value at the addressed address. The status of the memory can be a read-only status or a writable status.

Abstract: A method for restricting access to an electronic device using basic input output system (BIOS) password comprises: generating a first window on a display to receive a first user input in response to a password pre-setting input via an input module; formatting the first user input into American Standard Code for Information Interchange (ASCII); and writing the ASCII into a BIOS chip as the preset password. The electronic device is also provided.

Abstract: A method for setting removal policy of a USB device includes: obtaining device information of a USB device connected to a USB port when the electronic device is started up and on a BIOS process; comparing the obtained device information with device information stored in a storage unit to determine whether the obtained device information matches one of the device information stored in the storage unit, thus producing a comparison result; and setting removal policy of the USB device connected to the USB port according to the comparison result.

Abstract: A computer-based method for automatically loading software components is disclosed. The method includes the steps of: powering on a computer, identifying whether there is an identifier recorded in a desktop management interface (DMI) in a BIOS of the computer, and detecting that the computer is installed with a non-Windows based operating system if the DMI includes an identifier, and that the computer is installed with a Windows based operating system if there is no identifier recorded in the DMI; loading specified application software to the computer if the computer is installed with the Windows based operating system. A related system is also disclosed.

Abstract: A computer-based method for automatically loading software components is disclosed. The method includes the steps of: powering on a computer, identifying whether there is an identifier recorded in a desktop management interface (DMI) in a BIOS of the computer, and detecting that the computer is installed with a non-Windows based operating system if the DMI includes an identifier, and that the computer is installed with a Windows based operating system if there is no identifier recorded in the DMI; loading specified application software to the computer if the computer is installed with the Windows based operating system. A related system is also disclosed.