Abstract: An annular airflow regulating apparatus includes a cup-shaped element and an adjustment element. The cup-shaped element has a bowl and a bottom, integrated to form a first chamber. The bottom has a tapered channel parallel to an axis and penetrating through the bottom. A ring-shaped groove is disposed between the tapered channel and the bottom. The ring-shaped groove has an annular plane perpendicular to the axis. The adjustment element, having a tapered portion and second holes, is movably disposed in the cup-shaped element. The tapered portion protrudes into the tapered channel A tapered annular gap is formed between the tapered portion and the tapered channel. When the adjustment element is moved with respect to the cup-shaped element, a width of the tapered annular gap is varied, and thereupon a flow rate and velocity of the process gas would be varied accordingly.

Abstract: A variable aperture module includes a blade assembly, a positioning element, a driving part and pressing structures. The blade assembly includes movable blades disposed around an optical axis to form a light passable hole with an adjustable size. Each movable blade has a positioning hole and a movement hole adjacent thereto. The positioning element includes positioning structures disposed respectively corresponding to the positioning holes. The driving part includes a rotation element disposed corresponding to the movement holes and is rotatable with respect to the positioning element. The pressing structures are disposed respectively corresponding to the movable blades. Each pressing structure is at least disposed into at least one of the positioning hole and the movement hole of the corresponding movable blade. Each pressing structure at least presses against at least one of the corresponding one positioning structure and the rotation element.

Abstract: In an embodiment, a device includes: an integrated circuit die; an encapsulant at least partially surrounding the integrated circuit die, the encapsulant including fillers having an average diameter; a through via extending through the encapsulant, the through via having a lower portion of a constant width and an upper portion of a continuously decreasing width, a thickness of the upper portion being greater than the average diameter of the fillers; and a redistribution structure including: a dielectric layer on the through via, the encapsulant, and the integrated circuit die; and a metallization pattern having a via portion extending through the dielectric layer and a line portion extending along the dielectric layer, the metallization pattern being electrically coupled to the through via and the integrated circuit die.

Abstract: A semiconductor package including a first semiconductor die, a second semiconductor die, a first insulating encapsulation, a dielectric layer structure, a conductor structure and a second insulating encapsulation is provided. The first semiconductor die includes a first semiconductor substrate and a through silicon via (TSV) extending from a first side to a second side of the semiconductor substrate. The second semiconductor die is disposed on the first side of the semiconductor substrate. The first insulating encapsulation on the second semiconductor die encapsulates the first semiconductor die. A terminal of the TSV is coplanar with a surface of the first insulating encapsulation. The dielectric layer structure covers the first semiconductor die and the first insulating encapsulation. The conductor structure extends through the dielectric layer structure and contacts with the through silicon via.

Abstract: A ferroelectric memory device and a semiconductor die are provided. The ferroelectric memory device includes a gate electrode; a channel layer, overlapped with the gate electrode; source/drain contacts, in contact with separate ends of the channel layer; a ferroelectric layer, lying between the gate electrode and the channel layer; and a first insertion layer, extending in between the ferroelectric layer and the channel layer, and comprising a metal carbonitride or a metal nitride.

Abstract: An imaging lens assembly includes a first optical element and a low-reflection layer. The first optical element has a central opening, and includes a first surface, a second surface and a first outer diameter surface. The first outer diameter surface is connected to the first surface and the second surface. The low-reflection layer is located on at least one of the first surface and the second surface, and includes a carbon black layer, a nano-microstructure and a coating layer. The nano-microstructure is directly contacted with and connected to the carbon black layer, and the nano-microstructure is farther from the first optical element than the carbon black layer from the first optical element. The coating layer is directly contacted with and connected to the nano-microstructure, and the coating layer is farther from the first optical element than the nano-microstructure from the first optical element.

Abstract: An imaging lens assembly includes a first optical element and a low-reflection layer. The first optical element has a central opening, and includes a first surface, a second surface and a first outer diameter surface. The first outer diameter surface is connected to the first surface and the second surface. The low-reflection layer is located on at least one of the first surface and the second surface, and includes a carbon black layer, a nano-microstructure and a coating layer. The nano-microstructure is directly contacted with and connected to the carbon black layer, and the nano-microstructure is farther from the first optical element than the carbon black layer from the first optical element. The coating layer is directly contacted with and connected to the nano-microstructure, and the coating layer is farther from the first optical element than the nano-microstructure from the first optical element.

Abstract: Metal gate cutting techniques for fin-like field effect transistors (FinFETs) are disclosed herein. An exemplary method includes receiving an integrated circuit (IC) device structure that includes a substrate, one or more fins disposed over the substrate, a plurality of gate structures disposed over the fins, a dielectric layer disposed between and adjacent to the gate structures, and a patterning layer disposed over the gate structures. The gate structures traverses the fins and includes first and second gate structures. The method further includes: forming an opening in the patterning layer to expose a portion of the first gate structure, a portion of the second gate structure, and a portion of the dielectric layer; and removing the exposed portion of the first gate structure, the exposed portion of the second gate structure, and the exposed portion of the dielectric layer.

Abstract: A protection system includes a multimedia unit, which is able to output a warning signal under an abnormal condition thereof and to restart on receipt of a restart signal, in which a phone number message for identifying a source of the restart signal is included; Ethernet for transmitting the warning signal output by the multimedia unit; a phoneline network for transmitting the restart signal to the multimedia unit; a supervising unit for receiving the warning signal sent via Ethernet and then outputting the restart signal via the phoneline network; and a filter unit located between the multimedia unit and the phoneline network for receiving the restart signal via the phoneline network, and being internally provided with a list of phones containing the phone number message included in the restart signal for determining whether to transmit the restart signal to the multimedia unit according to the source of the restart signal.

Abstract: A system for restarting an electric home appliance in an energy-saving manner includes an AV output unit, which outputs a warning signal under an abnormal condition thereof and is restarted on receiving a restart signal; a first communication line for transmitting the warning signal; a second communication line for transmitting the restart signal; a supervising unit for receiving the warning signal via the first communication line and then generating the restart signal; and a transmission unit for storing the restart signal generated by the supervising unit and then transmitting the restart signal to the AV output unit via the second communication line when the latter is electrically connected to the transmission unit. The transmission unit is located between the supervising unit and the second communication line and internally provided with a dialing program for electrically connecting the transmission unit to the second communication line.

Abstract: A monitoring protecting system and a method of the same are provided. The monitoring protecting system includes a playing unit for outputting a warning signal generated when the playing unit is detected to exhibit an abnormal state and receiving a re-starting signal to cause the playing unit to turn off the power and then re-start; a first transmitting channel for transmitting the warning signal; a second transmitting channel for transmitting the re-starting signal; and a monitoring unit for receiving the warning signal via the first transmitting channel and outputting the re-starting signal via the second transmitting channel.

Abstract: A power adaptor of the present invention has a single power cable connecting between an adaptor body and an electric device. The power cable can be conveniently retrieved or dispensed by a cable winder for easy management. The plug for plugging into a power source is directly installed on the adaptor body. The prongs of the plug is mounted on a sliding rail inside the adaptor body so that the prongs can be stuck out for plugging or completely retracted inside the adaptor body for transportation or storage. Conducting plates are provided along the sliding rail so that the prongs are always in reliable contact with the conducting plates for the conduction of electricity to the electric member inside the adaptor body. When the prongs are fully exposed or when the prongs are completely concealed, the prongs are securely locked to the adaptor body.

Abstract: A power adaptor of the present invention has a single power cable connecting between an adaptor body and an electric device. The power cable can be conveniently retrieved or dispensed by a cable winder for easy management. The plug for plugging into a power source is directly installed on the adaptor body. The prongs of the plug is mounted on a sliding rail inside the adaptor body so that the prongs can be stuck out for plugging or completely retracted inside the adaptor body for transportation or storage. Conducting plates are provided along the sliding rail so that the prongs are always in reliable contact with the conducting plates for the conduction of electricity to the electric member inside the adaptor body. When the prongs are securely locked to the adaptor body.

Abstract: The subject invention relates to a resin composition having a high dielectric constant, comprising (a) an epoxy resin, (b) a curing agent, (c) a ceramic powder, and (d) a highly polar modifier. The subject invention further relates to a process for the manufacture of a printed circuit board comprising using the composition of the subject invention as a material for a capacitor material embedded in the printed circuit board.