Abstract: In some implementations, one or more semiconductor processing tools may form a metal cap on a metal gate. The one or more semiconductor processing tools may form one or more dielectric layers on the metal cap. The one or more semiconductor processing tools may form a recess to the metal cap within the one or more dielectric layers. The one or more semiconductor processing tools may perform a bottom-up deposition of metal material on the metal cap to form a metal plug within the recess and directly on the metal cap.

Abstract: A semiconductor package including a first semiconductor die, a second semiconductor die, a first insulating encapsulation, a dielectric layer structure, a conductor structure and a second insulating encapsulation is provided. The first semiconductor die includes a first semiconductor substrate and a through silicon via (TSV) extending from a first side to a second side of the semiconductor substrate. The second semiconductor die is disposed on the first side of the semiconductor substrate. The first insulating encapsulation on the second semiconductor die encapsulates the first semiconductor die. A terminal of the TSV is coplanar with a surface of the first insulating encapsulation. The dielectric layer structure covers the first semiconductor die and the first insulating encapsulation. The conductor structure extends through the dielectric layer structure and contacts with the through silicon via.

Abstract: In some implementations, one or more semiconductor processing tools may form a metal cap on a metal gate. The one or more semiconductor processing tools may form one or more dielectric layers on the metal cap. The one or more semiconductor processing tools may form a recess to the metal cap within the one or more dielectric layers. The one or more semiconductor processing tools may perform a bottom-up deposition of metal material on the metal cap to form a metal plug within the recess and directly on the metal cap.

Abstract: Metal gate cutting techniques for fin-like field effect transistors (FinFETs) are disclosed herein. An exemplary method includes receiving an integrated circuit (IC) device structure that includes a substrate, one or more fins disposed over the substrate, a plurality of gate structures disposed over the fins, a dielectric layer disposed between and adjacent to the gate structures, and a patterning layer disposed over the gate structures. The gate structures traverses the fins and includes first and second gate structures. The method further includes: forming an opening in the patterning layer to expose a portion of the first gate structure, a portion of the second gate structure, and a portion of the dielectric layer; and removing the exposed portion of the first gate structure, the exposed portion of the second gate structure, and the exposed portion of the dielectric layer.

Abstract: A sensor system (100) or a sensing method minimizes the loss of aroma chemicals or other analytes in a sample gas while controlling the temperature and humidity of the sample gas. The system (100) may employ a humidifier (120) that adds water vapor to sample gas to provide a known water content, e.g., a saturated humidity at a known temperature. A sensing unit (130) may accurately measure the composition of the sample gas having a known water content, e.g., at a higher known temperature.

Abstract: An optical detector (100, 200, 300) for detecting gas and suspended matter therein includes a test chamber (111, 113), at least one light source (12), a sensing object (131, 133), a test optical sensor (141) and a processor (19). The test chamber (111, 113) accommodates a gas to be analyzed. The at least one light source (12) emits an incident light that enters the test chamber (111, 113). The sensing object (131, 133) is exposed to gas in the test chamber (111, 113), receives the incident light, and reflects or transmits a portion of the incident light to form a test light. The test optical sensor (141) receives the test light and generates a detected spectral signal. The processor (19) receives the detected spectral signal and calculates a detection result according to the detected spectral signal.

Abstract: A sensor system (100) or a sensing method minimizes the loss of aroma chemicals or other analytes in a sample gas while controlling the temperature and humidity of the sample gas. The system (100) may employ a humidifier (120) that adds water vapor to sample gas to provide a known water content, e.g., a saturated humidity at a known temperature. A sensing unit (130) may accurately measure the composition of the sample gas having a known water content, e.g., at a higher known temperature.

Abstract: Multilayer ceramic capacitor structures may include structural arrangements, materials, and/or substrate modifications that can improve the reliability of the capacitor for long-term usage when faced with environmental stress. Embodiments may implement reduced entryways in the termination patterns of the capacitor to decrease damage potential due to exposure of moisture. Embodiments may implement structures that decrease interfaces with different physical characteristics, which may lead to a reduction in the formation of micro-fractures during regular usage. Methods of manufacture for the features that improve reliability are also detailed.

Abstract: Multilayer ceramic capacitor structures may include structural arrangements, materials, and/or substrate modifications that can improve the reliability of the capacitor for long-term usage when faced with environmental stress. Embodiments may implement reduced entryways in the termination patterns of the capacitor to decrease damage potential due to exposure of moisture. Embodiments may implement structures that decrease interfaces with different physical characteristics, which may lead to a reduction in the formation of micro-fractures during regular usage. Methods of manufacture for the features that improve reliability are also detailed.

Abstract: An electronic device includes a housing and a fan. The housing has a fan-retaining structure including a base, two side walls and at least one elastic clamping unit. The two side walls are disposed on the base and respectively have a guiding slot and an elastic clamping unit. The two guiding slots and the base corporately define a receiving space. The elastic clamping unit has a top-blocking portion formed on one end thereof. The fan is selectively mounted in the receiving space along a longitudinal direction. As the fan is disposing into the receiving space, the top-blocking portion is propped up by the fan, and the elastic clamping unit is elastically curved outward. After the fan is disposed in the receiving space, the top-blocking portions and the base corporately clamp the fan, and the movement of the fan is restricted in the longitudinal direction and in a radial direction.

Abstract: An integrated power module packaging structure includes a plastic housing having a cavity; a plurality of step-shaped pins embedded in the plastic housing, a first printed circuit board disposed in the cavity, and a second printed circuit board disposed above the first printed circuit board in the cavity. Each of the step-shaped pins includes a first L-shaped bending portion and a second L-shaped bending portion connected to each other. The first printed circuit board is disposed with at least a power device and is electrically connected to at least a part of the first L-shaped bending portions. Two opposite surfaces of the second printed circuit board are respectively disposed with at least an electronic device, and the second printed circuit board is electrically connected to at least a part of the second L-shaped bending portions.

Abstract: An electronic device includes a housing and a fan. The housing has a fan-retaining structure including a base, two side walls and at least one elastic clamping unit. The two side walls are disposed on the base and respectively have a guiding slot and an elastic clamping unit. The two guiding slots and the base corporately define a receiving space. The elastic clamping unit has a top-blocking portion formed on one end thereof. The fan is selectively mounted in the receiving space along a longitudinal direction. As the fan is disposing into the receiving space, the top-blocking portion is propped up by the fan, and the elastic clamping unit is elastically curved outward. After the fan is disposed in the receiving space, the top-blocking portions and the base corporately clamp the fan, and the movement of the fan is restricted in the longitudinal direction and in a radial direction.

Abstract: An integrated power module packaging structure includes a plastic housing having a cavity; a plurality of step-shaped pins embedded in the plastic housing, a first printed circuit board disposed in the cavity, and a second printed circuit board disposed above the first printed circuit board in the cavity. Each of the step-shaped pins includes a first L-shaped bending portion and a second L-shaped bending portion connected to each other. The first printed circuit board is disposed with at least a power device and is electrically connected to at least a part of the first L-shaped bending portions. Two opposite surfaces of the second printed circuit board are respectively disposed with at least an electronic device, and the second printed circuit board is electrically connected to at least a part of the second L-shaped bending portions.

Abstract: The present invention illustrates a method of manufacturing a surgical implant guide to increase the precision, safety and reliability of the surgery. First the present invention plans an invasive position for implanting an implant, and then, plans an invasive path for the implant to invade from the invasive position of an affected tissue, and finally, produces an implant guide based on the invasive position, the invasive path, and the shapes of the implant and the affected tissue. The surgical implant guide includes a coupling portion matching the shape the affected tissue, and a guiding portion matching the shape of the implant, the invasive position, and the invasive path. When the coupling portion is disposed on the affected tissue, the guiding portion is aligned with the invasive position, so that the implant is implanted in the affected tissue under guidance of the invasive path.

Abstract: The present invention illustrates a method of manufacturing a surgical implant guide to increase the precision, safety and reliability of the surgery. First the present invention plans an invasive position for implanting an implant, and then, plans an invasive path for the implant to invade from the invasive position of an affected tissue, and finally, produces an implant guide based on the invasive position, the invasive path, and the shapes of the implant and the affected tissue. The surgical implant guide includes a coupling portion matching the shape the affected tissue, and a guiding portion matching the shape of the implant, the invasive position, and the invasive path. When the coupling portion is disposed on the affected tissue, the guiding portion is aligned with the invasive position, so that the implant is implanted in the affected tissue under guidance of the invasive path.

Abstract: A multi-slope handoff algorithm for controlling dynamic communication quality in wireless communications is proposed to let a mobile node adjust the handoff slope according to different communication connection situations for setting the optimum add/drop connection trigger thresholds. The algorithm comprises the following steps. First, a mobile node receives pilot strengths of its service pilot and nearby pilots to produce an aggregate strength. Next, the mobile node determines whether to perform handoff according to the magnitude of the aggregate strength. The handoff action is then controlled by multi-slope handoff operations to set an appropriate slope and to calculate the add/drop connection trigger thresholds when performing handoff. Finally, the pilot to be connected is selected based on the communication quality at that time. In this way, the quality of the communication service can be enhanced, the connection power consumption can be lowered, and the communication channel usage can be reduced.

Abstract: A reliability assessment system. The system includes an interface and an assessment engine. The interface is a web-based interface, providing online reliability assessment. The system receives input items through the interface. The assessment engine performs the reliability assessment accordingly, generating and displaying the result on the interface.

Abstract: An apparatus for preventing a substrate from being contaminated by condensed liquid is disclosed to be adapted to a substrate, comprising a reaction chamber having at least a doorway on one side for the substrate to enter or exit wherein the chamber receives the substrate and a process fluid to proceed with a processing step, a conveyor unit for delivering the substrate into or out of the reaction chamber via the doorway, a first jet device disposed on the delivery route of the conveyor unit external to the reaction chamber to eject a gas out in a direction toward the substrate on the conveyor unit, and a second jet device disposed on one side of the doorway external to the reaction chamber to eject a gas out in a direction toward the doorway. Also, a method for preventing a substrate from being contaminated by condensed liquid is provided.