Abstract: Thermoplastic compositions include: (a) from about 10 wt % to about 65 wt % of at least one virgin polycarbonate; (b) from about 10 wt % to about 40 wt % of a polybutylene terephthalate (PBT) component derived from a post-consumer recycled (PCR) polymer; (c) from about 25 wt % to about 65 wt % of at least one PCR polycarbonate; (d) from about 10 wt % to about 40 wt % of a polycarbonate-siloxane (PC-Si) copolymer; (e) from 0.1 wt % to about 10 wt % of a phosphazene flame retardant; and (f) from 0.1 wt % to about 2 wt % of a silicone oil.

Abstract: A thermoplastic composition includes, based on the total weight of the composition: from 20 wt % to 90 wt % of a primary thermoplastic resin including a polycarbonate component; from 0.5 wt % to 30 wt % of a functional filler including electrically conductive carbon powder, carbon nanotubes, or a combination thereof; from 0 wt % to 20 wt % of a second thermoplastic resin; and from 0 wt % to 40 wt % of at least one additional additive. The polycarbonate component includes at least 5 wt % of a poly(aliphatic ester)-polycarbonate copolymer based on the total weight of the polycarbonate component, and the combined weight percent value of all components does not exceed 100 wt %. The thermoplastic composition may be useful in, e.g., molded articles, including as a carrier tape for an electronic component.

Abstract: A thermoplastic composition includes, based on the total weight of the composition: from 20 wt % to 90 wt % of a primary thermoplastic resin including a polycarbonate component; from 0.5 wt % to 30 wt % of a functional fdler including electrically conductive carbon powder, carbon nanotubes, or a combination thereof; from 0 wt % to 20 wt % of a second thermoplastic resin; and from 0 wt % to 40 wt % of at least one additional additive. The polycarbonate component includes at least 5 wt % of a poly(aliphatic ester)-polycarbonate copolymer based on the total weight of the polycarbonate component, and the combined weight percent value of all components does not exceed 100 wt %. The thermoplastic composition may be useful in, e.g., molded articles, including as a carrier tape for an electronic component.

Abstract: A reinforced poly(phthalamide) composition comprising 20-80 weight percent of a poly(phthalamide) component comprising 15-55 weight percent of a crystalline poly(phthalamide), and 5-45 weight percent of an amorphous poly(phthalamide); 0.5-60 weight percent of a reinforcing filler; and 0.1-50 weight percent of an additive composition; wherein weight percent is based on the total weight of the reinforced poly(phthalamide) composition and totals 100; and wherein the reinforced poly(phthalamide) composition has a capillary melt viscosity, measured according to ASTM D3835 (2015) at 320° C., at 5000 s?1, that is at least 10% lower than that of the same reinforced poly(phthalamide) composition without the amorphous poly(phthalamide), and a warpage that is at least 15% lower than that of the same reinforced poly(phthalamide) composition without the amorphous poly(phthalamide).

Abstract: Disclosed herein is a composition for suppressed die lip buildup. The composition may comprise from about 20 wt. % to about 98 wt. % of a polycarbonate; from about 0.01 wt. % to about 30 wt. % of a polybutylene terephthalate; from about 0.5 wt. % to about 60 wt. % of a functional filler; from about 0.1 wt. % to about 5 wt. % of an ultra-high molecular weight polydimethylsiloxane; and from about 0.01 wt. % to about 30 wt. % of a flame retardant component. The composition may exhibit a notched Izod impact strength of greater than 30 J/m when tested in accordance with ASTM D256 and may exhibit less die buildup during a continuous extrusion process when compared to a substantially similar reference composition in the absence of the ultra-high molecular weight polydimethylsiloxane.

Abstract: A thermoplastic composition includes: (a) from about 20 wt % to about 80 wt % of a first thermoplastic polymer including aliphatic polyamide (PA), polyphthalamide (PPA), copolymers thereof, or a combination thereof; (b) from about 0.1 wt % to about 1.5 wt % of a second thermoplastic polymer including polybutylene terephthalate (PBT), poly1,4-cyclohexylene dimethylene terephthalate (PCT), polycarbonate (PC), copolymers thereof, or a combination thereof; and (c) from about 10 wt % to about 60 wt % of a filler component. The composition has a melt volume rate (MVR) as measured in accordance with ASTM D1238 that is at least about 10% higher than that of a substantially identical reference thermoplastic composition that does not include the second thermoplastic polymer, or has a melt viscosity (MV) as measured in accordance with ISO11443 that is at least 20% lower than that of a substantially identical reference thermoplastic composition that does not include the second thermoplastic polymer.

Abstract: A reinforced poly(phthalamide) composition comprising 20-80 weight percent of a poly(phthalamide) component comprising 15-55 weight percent of a crystalline poly(phthalamide), and 5-45 weight percent of an amorphous poly(phthalamide); 0.5-60 weight percent of a reinforcing filler; and 0.1-50 weight percent of an additive composition; wherein weight percent is based on the total weight of the reinforced poly(phthalamide) composition and totals 100; and wherein the reinforced poly(phthalamide) composition has a capillary melt viscosity, measured according to ASTM D3835 (2015) at 320° C., at 5000 s?1, that is at least 10% lower than that of the same reinforced poly(phthalamide) composition without the amorphous poly(phthalamide), and a warpage that is at least 15% lower than that of the same reinforced poly(phthalamide) composition without the amorphous poly(phthalamide).

Abstract: The disclosure concerns thermally conductive polymer compositions comprising: (a) from about 20 wt % to about 80 wt % of at least one polymer component; (b) from greater than about 0 wt % to about 70 wt % of a thermally conductive filler; and (c) from about 0.1 wt % to about 40 wt % of a laser activatable additive having a core-shell structure; wherein the core comprises an inorganic filler and the shell comprises a laser activatable component; wherein the combined weight percent value of all components does not exceed about 100 wt %; wherein all weight percent values are based on the total weight of the composition; and wherein a molded sample of the blended thermoplastic composition has a through plane thermal conductivity of at least about 0.40 W/m·K when determined in accordance with ASTM E1461.

Abstract: A composition includes about 20 wt % to about 80 wt % of a first resin consisting of polybutylene terephthalate (PBT); about 1 wt % to about 20 wt % of a second resin that is different from the first resin, wherein the second resin does not include polyethylene terephthalate (PET); from about 0.5 wt % to about 10 wt % of a first processing aid; and from about 10 wt % to about 60 wt % of a reinforcing filler. The composition has a tensile modulus of at least 3,000 MPa and a notched Izod impact strength of at least 50 J/m. Methods of making the composition are also described.

Abstract: The disclosure concerns thermally conductive polymer compositions comprising: (a) from about 20 wt % to about 80 wt % of at least one polymer component; (b) from greater than about 0 wt % to about 70 wt % of a thermally conductive filler; and (c) from about 0.1 wt % to about 40 wt % of a laser activatable additive having a core-shell structure; wherein the core comprises an inorganic filler and the shell comprises a laser activatable component; wherein the combined weight percent value of all components does not exceed about 100 wt %; wherein all weight percent values are based on the total weight of the composition; and wherein a molded sample of the blended thermoplastic composition has a through plane thermal conductivity of at least about 0.40 W/m·K when determined in accordance with ASTM E1461.

Abstract: Thermally conductive compositions include from about 20 wt. % to about 80 wt. % of a polycarbonate polymer, from about 0.5 wt. % to about 30 wt. % of an impact modifier, and a thermal conductivity modifier. The thermal conductivity modifier includes from about 0.5 wt. % to about 10 wt. % of a high density polyethylene polymer, from about 0.5 wt. % to about 10 wt. % of a maleic anhydride type copolymer, or from about 0.01 wt. % to about 10 wt. % of an acid component. In some aspects the thermally conductive compositions have a notched Izod impact strength of at least about 30 J/m, a through-plane thermal conductivity of at least about 0.4 W/mK and/or an in-plane thermal conductivity of at least about 1.0 W/mK. Methods for making the compositions and articles formed according to the methods are also described.

Abstract: The present disclosure provides graphite-containing compositions that exhibit favorable thermal conductivity characteristics.

Abstract: A thermoplastic composition includes a poly(phenylene ether), a poly(amide), a poly(etherimide), and a reinforcing filler, wherein the specific amount of each component is specified herein. The thermoplastic composition can advantageously exhibit improved physical properties. The thermoplastic composition can be used to form various articles. A method of the manufacture of the composition is also described herein.

Abstract: Thermally conductive compositions include from about 20 wt. % to about 80 wt. % of a polycarbonate polymer, from about 0.5 wt. % to about 30 wt. % of an impact modifier, and a thermal conductivity modifier. The thermal conductivity modifier includes from about 0.5 wt. % to about 10 wt. % of a high density polyethylene polymer, from about 0.5 wt. % to about 10 wt. % of a maleic anhydride type copolymer, or from about 0.01 wt. % to about 10 wt. % of an acid component. In some aspects the thermally conductive compositions have a notched Izod impact strength of at least about 30 J/m, a through-plane thermal conductivity of at least about 0.4 W/mK and/or an in-plane thermal conductivity of at least about 1.0 W/mK. Methods for making the compositions and articles formed according to the methods are also described.

Abstract: A poly(phenylene ether) composition comprises, based on the total weight of the poly(phenylene ether), addition polymer, impact modifier, and flame retardant: 40 to 90 weight percent of a poly(phenylene ether); 1 to 20 weight percent of an addition polymer comprising repeat units derived from a glycidyl ester of an ?,?-ethylenically unsaturated acid; 1 to 20 weight percent of an impact modifier other than the addition polymer; and 5 to 20 weight percent of a flame retardant comprising an organophosphate ester. The composition is useful for molding articles.

Abstract: The present disclosure provides graphite-containing compositions that exhibit favorable thermal conductivity characteristics.

Abstract: The invention concerns compositions comprising (a) from about 20 wt % to about 80 wt % of a polymer component; (b) from about 10 wt % to about 70 wt % of a flame retardant component; and (c) from about 0.01 wt % to about 5 wt % of an acid component; wherein the combined weight percent value of all components does not exceed 100 wt %; wherein all weight percent values are based on the total weight of the composition; and wherein the composition has: (i) a thermal conductivity of at least about 1.5 W/mK for through plane thermal conductivity; (ii) flame retardancy of at least VI at 0.8 mm using the UL94 test standard; and (iii) melt volume flow rate of at least 10 g/cm3 using ASTM D 1238.

Abstract: A composition includes specific amounts of a poly(phenylene ether), a polystyrene-poly(ethylene-butylene)-polystyrene triblock copolymer, an organophosphate ester, and compound that improves adhesion to potting silicone sealant. The adhesion promoter can be a phenolic compound, a hydroxysilyl-terminated polydiorganosiloxane, or a combination thereof. The composition is particularly useful for molding parts of photovoltaic junction boxes that utilize potting silicone sealant as an internal electrical insulator.

Abstract: A composition includes specific amounts of a poly(phenylene ether), a polystyrene-poly(ethylene-butylene)-polystyrene triblock copolymer, an organophosphate ester, and compound that improves adhesion to potting silicone sealant. The adhesion promoter can be a phenolic compound, a hydroxysilyl-terminated polydiorganosiloxane, or a combination thereof. The composition is particularly useful for molding parts of photovoltaic junction boxes that utilize potting silicone sealant as an internal electric al insulator.

Abstract: The present disclosure is directed to polymer composites, and, particularly, thermally conductive polymer composites. The polymer composites can include from about 20 wt. % to about 80 wt. % of a base polymer resin; from about 1 wt. % to about 70 wt. % of thermoconductive filler material comprising thermoconductive particles having a plurality of electronegative functional groups at the surface of the particles, and having a thermal conductivity of at least 2 W/m*K; from about 0.01 wt. % to about 20 wt. % of an amphiphilic compatibilizer including a hydrophilic component and hydrophobic chain component; and, optionally, from about 0 wt. % to 50 wt. % of an additive. As compared to a control composition having 0.00 wt. % of the amphiphilic compatibilizer, the composite has (i) increased mechanical strength as measured by Izod impact testing, and, (ii) increased thermal conductivity as measured by through-plane or in-plane testing.