Patents by Inventor Ming-Hong Lin

Ming-Hong Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11963347
    Abstract: A memory device includes a transistor, an anti-fuse element, a source/drain contact, a first gate via, and a second gate via. The transistor is over a substrate. The anti-fuse element is over the substrate and is connected to the transistor in series. The source/drain contact is connected to a source/drain region of the transistor. The first gate via is connected to a first gate structure of the transistor. The first gate structure of the transistor extends along a first direction in a top view. The second gate via is connected to a second gate structure of the anti-fuse element. The second gate via is between the first gate via and the source/drain contact along the first direction in the top view.
    Type: Grant
    Filed: April 21, 2023
    Date of Patent: April 16, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chiung-Ting Ou, Ming-Yih Wang, Jian-Hong Lin
  • Publication number: 20240120854
    Abstract: A triboelectric nanogenerating device is configured for providing an electric power to an electronic device and the triboelectric nanogenerating device includes at least one scaly triboelectric membrane configured for providing the electric power to the electronic device by frictional electrification. The at least one scaly triboelectric membrane includes a keratin and a polyvinyl alcohol, the at least one scaly triboelectric membrane has a first triboelectric surface, and the first triboelectric surface of the at least one scaly triboelectric membrane includes a plurality of scaly layers. Each of the scaly layers is arranged in order and extends along an orienting direction. A distal end of each of the scaly layers has a plurality of saw-tooth structures.
    Type: Application
    Filed: February 6, 2023
    Publication date: April 11, 2024
    Inventors: Zong-Hong Lin, Ming-Zheng Huang, Hsuan-Yu Yeh, An-Rong Chen, Yao-Hsuan Tseng
  • Patent number: 9493043
    Abstract: A TPMS (tire pressure monitoring system) sensor setting method is disclosed and performed by: using a setting tool to input a location code into the TPMS sensor to be set so that the TPMS sensor can feed the location code and its ID to the on-vehicle main unit for enabling the on-vehicle main unit to establish the relationship between the ID of the TPMS sensor and its location.
    Type: Grant
    Filed: October 9, 2014
    Date of Patent: November 15, 2016
    Assignee: CUB ELECPARTS INC.
    Inventors: San-Chuan Yu, Tsan-Nung Wang, Chi-Hung Chen, Chao-Ching Hu, Jyong Lin, Tzu-Wen Ko, Hsiao-Ming Chen, Ming-Hong Lin, Eric Ma
  • Patent number: 9494457
    Abstract: A tank liquid depth measurement method includes the steps of: a) providing a sensor capable of detecting a liquid pressure, b) providing a main unit for receiving data from the sensor, c) mounting the sensor under the liquid level in a water tank and mounting the main unit in the car, d) initiating the sensor and the main unit so as to cause the sensor to measure the internal liquid pressure and to enable the main unit to store the identification code and communication code of the sensor, and e) enabling the main unit to receive data from the sensor for matching and recording. By means of the operation of the sensor to transmit the detected data to the main unit for warning or informing the driver, the expected effects and objectives of the present invention are achieved.
    Type: Grant
    Filed: December 5, 2014
    Date of Patent: November 15, 2016
    Assignee: CUB ELECPARTS INC.
    Inventors: Yu-Tao Yu, Ming-Hong Lin
  • Publication number: 20160161319
    Abstract: A tank liquid depth measurement method includes the steps of: a) providing a sensor capable of detecting a liquid pressure, b) providing a main unit for receiving data from the sensor, c) mounting the sensor under the liquid level in a water tank and mounting the main unit in the car, d) initiating the sensor and the main unit so as to cause the sensor to measure the internal liquid pressure and to enable the main unit to store the identification code and communication code of the sensor, and e) enabling the main unit to receive data from the sensor for matching and recording. By means of the operation of the sensor to transmit the detected data to the main unit for warning or informing the driver, the expected effects and objectives of the present invention are achieved.
    Type: Application
    Filed: December 5, 2014
    Publication date: June 9, 2016
    Inventors: Yu-Tao YU, Ming-Hong LIN
  • Publication number: 20150343859
    Abstract: A TPMS (tire pressure monitoring system) sensor setting method is disclosed and performed by: using a setting tool to input a location code into the TPMS sensor to be set so that the TPMS sensor can feed the location code and its ID to the on-vehicle main unit for enabling the on-vehicle main unit to establish the relationship between the ID of the TPMS sensor and its location.
    Type: Application
    Filed: October 9, 2014
    Publication date: December 3, 2015
    Inventors: San-Chuan YU, Tsan-Nung WANG, Chi-Hung CHEN, Chao-Ching HU, Jyong LIN, Tzu-Wen KO, Hsiao-Ming CHEN, Ming-Hong LIN, Eric MA
  • Publication number: 20150061853
    Abstract: A repeater module used in a TPMS and installed in a mother vehicle or daughter vehicle of a tow truck for receiving the status signal from each daughter vehicle tire pressure sensor and providing a corresponding wireless signal to the on-vehicle main unit in the mother vehicle by using the ID code and communication protocol of any mother vehicle tire pressure sensor so that the mother vehicle can receive the status information of the tires of the daughter vehicle without needing to modify the on-vehicle main unit.
    Type: Application
    Filed: August 30, 2013
    Publication date: March 5, 2015
    Applicant: Cub Elecparts Inc.
    Inventors: San-Chuan YU, Hsiao-Ming CHEN, Ming-Hong LIN, Jyong LIN
  • Publication number: 20110304044
    Abstract: A stacked chip package structure includes: a first chip and a second chip stacked on a substrate; a first electrical connection structure electrically connecting the substrate and the first chip; and a second electrical connection structure electrically connecting the second chip and the first chip, wherein the second electrical connection structure, disposed on a third chip, includes an adhesive layer encapsulating a second solder ball structure on the second chip and a first solder ball structure on the first chip; and a plurality of conductive wires disposed in the adhesive layer for conducting the second solder ball structure and the first solder ball structure. A fabrication method for the stacked chip package structure is also disclosed. Forming conductive wires in the adhesive layer electrically connecting the upper and lower chips may improve potential problems caused when using wire bonding technology for the upper chip during stacking of the multilayer chips.
    Type: Application
    Filed: July 7, 2010
    Publication date: December 15, 2011
    Inventor: Ming-hong LIN
  • Patent number: 6106664
    Abstract: A clamp affixes a wafer by entirely covering the edge of the wafer, wherein the radius of the inner surface of the clamp is about 1 mm shorter than the radius of the wafer. Besides, there are four pairs of square protuberances distributed even along the inner surface of the clamp for affixing the wafer, wherein the square protuberances only hold the edge of the device regions of the wafer. Even though the wafer is slightly off position, the square protuberances are still able to affix the wafer properly. In addition, the lifetime of the clamp of the invention is about 100 hours, which is two times of a conventional clamp, so that the cost is reduced.
    Type: Grant
    Filed: August 25, 1998
    Date of Patent: August 22, 2000
    Assignees: ProMOS Technologies, Inc., Mosel Vitelic Inc., Siemens AG
    Inventors: Ray Lee, Shih-Po Lin, Jim Ho, Ming-Hong Lin
  • Patent number: 5044054
    Abstract: A driving head holder capable of perfectly and effectively holding a driving head on a turret milling machine is provided. The holder includes a cantilevering coupling member having two side walls pivotably mounting therebetween a driving head holding member which includes a middle web having an intermediate hub member having a through hole, two side portions having two cross sectionally T-shaped annular grooves, and a curved peripheral portion integrally forming thereto the web and side portions.
    Type: Grant
    Filed: May 31, 1990
    Date of Patent: September 3, 1991
    Inventor: Ming-Hong Lin