Abstract: A fan-out package includes a redistribution structure having redistribution-side bonding structures, a plurality of semiconductor dies including a respective set of die-side bonding structures that is attached to a respective subset of the redistribution-side bonding structures through a respective set of solder material portions, and an underfill material portion laterally surrounding the redistribution-side bonding structures and the die-side bonding structures of the plurality of semiconductor dies. A subset of the redistribution-side bonding structures is not bonded to any of the die-side bonding structures of the plurality of semiconductor dies and is laterally surrounded by the underfill material portion, and is used to provide uniform distribution of the underfill material during formation of the underfill material portion.

Abstract: A method of forming a gas spacer in a semiconductor device and a semiconductor device including the same are disclosed. In accordance with an embodiment, a method includes forming a gate stack over a substrate; forming a first gate spacer on sidewalls of the gate stack; forming a second gate spacer on sidewalls of the first gate spacer; removing the second gate spacer using an etching process to form a first opening, the etching process being performed at a temperature less than 0° C., the etching process using an etching solution including hydrogen fluoride; and depositing a dielectric layer over the first gate spacer and the gate stack, the dielectric layer sealing a gas spacer in the first opening.

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a carrier substrate, an interposer substrate, a semiconductor device, a lid, and a thermal interface material. The interposer substrate is disposed on the carrier substrate. The semiconductor device is disposed on the interposer substrate. The lid is disposed on the carrier substrate to cover the semiconductor device. The thermal interface material is disposed between the lid and the semiconductor device. A first recess is formed on a lower surface of the lid facing the semiconductor device, and the first recess overlaps the semiconductor device in a top view.

Abstract: A display device includes a first substrate, a light-emitting element, a light conversion layer, and a color filter layer. The light-emitting element is disposed on the first substrate. The light conversion layer is disposed on the light-emitting element. In addition, the color filter layer is overlapped the light-emitting element and the light conversion layer.

Abstract: An adaptive seat massage system and a method of controlling the same include a massage module providing a massage function in a plurality of regions of a seat; a pressure measurement module detecting pressure applied to the seat by a user in the regions of the seat and transmits pressure measurement signal corresponding to respective regions among the plurality of regions; and a control module determining whether to operate the massage module in at least one region based on the pressure measurement signal received from the pressure measurement module, determining, when the massage module is operated in the at least one region, an operating mode of the massage module in the at least one region based on the pressure measurement signal, and transmitting a control signal corresponding to the determined operating mode to the massage module to control an operation of the massage module in the at least one region.

Abstract: Some embodiments of the present disclosure relate to an integrated chip including an extended via that spans a combined height of a wire and a via and that has a smaller footprint than the wire. The extended via may replace a wire and an adjoining via at locations where the sizing and the spacing of the wire are reaching lower limits. Because the extended via has a smaller footprint than the wire, replacing the wire and the adjoining via with the extended via relaxes spacing and allows the size of the pixel to be further reduced. The extended via finds application for capacitor arrays used for pixel circuits.

Abstract: A method for forming a chip package structure. The method includes bonding first connectors over a front surface of a semiconductor wafer. The method also includes dicing the semiconductor wafer from a rear surface of the semiconductor wafer to form semiconductor dies and mounting first and second semiconductor dies in the semiconductor dies over a top surface of the interposer substrate. The method further forming an encapsulating layer over the top surface of the interposer substrate to cover the first semiconductor die and the second semiconductor die. A first sidewall of the first semiconductor die faces a second sidewall of the second semiconductor die, and upper portions of the first sidewall and the second sidewall have a tapered contour, to define a top die-to-die distance and a bottom die-to-die distance that is less than the top die-to-die distance.

Abstract: A method for separating hydrolysis product of biomass is provided. The method includes providing a mixture solution containing a hydrolysis product of biomass and a divalent metal salt, adjusting the pH value of the mixture solution to between 1-4.6, and performing a filtering procedure on the mixture solution using a nanofiltration membrane to obtain a concentrated solution and a filtrate, wherein the concentrated solution mainly includes the hydrolysis product of biomass and the filtrate mainly includes the divalent metal salt.

Abstract: A method for separating hydrolysis product of biomass is provided. The method includes providing a mixture solution containing a hydrolysis product of biomass and a divalent metal salt, adjusting the pH value of the mixture solution to between 1-4.6, and performing a filtering procedure on the mixture solution using a nanofiltration membrane to obtain a concentrated solution and a filtrate, wherein the concentrated solution mainly includes the hydrolysis product of biomass and the filtrate mainly includes the divalent metal salt.

Abstract: An electronic device and an operating method thereof are provided. The method firstly establishes a database recording at least one predefined operating gesture, a predefined function corresponding to the predefined operating gesture, and a specific color. An image captured by an image capturing unit of the electronic device is then obtained. When the specific color is found in the image, a position of the specific color is obtained and a gesture trajectory is displayed on a screen of the electronic device according to the position. The method repeats the steps of obtaining the image and displaying the gesture trajectory till it is unable to find the specific color in the currently obtained image. By referring to the database, the predefined function is then executed according to the predefined operating gesture which is determined by connecting the positions of the specific color in the obtained images.

Abstract: An ambulatory hip fixation-traction splint frame includes a supporting frame having an upper end arranged for positioning below an armpit of a treated patient and a lower end arranged for positioning below a hip portion of the treated patient, and a side splint assembly for supporting a side body of the treated patient. The side splint assembly includes a flexible guiding frame having first and second ends, and a curved guiding surface, having a predetermined curvature, defining between the first and second ends for biasing against the side body of the treated patient, and two coupling joints adjustably mounted on the supporting frame to connect with the first and second ends of the guiding frame respectively so as to retain the curvature of the guiding surface of the guiding frame for fitting on the side body of the treated patient.

Abstract: An ambulatory hip fixation-traction splint set includes a supporting frame having an upper end arranged for positioning below an armpit of a treated patient and a lower end extending to position below a hip portion of the treated patient, and a side splint assembly including a flexible guiding frame having first and second end portions mounted to the supporting frame wherein the guiding frame has a curved guiding surface adapted for fixing on a side body of the treated patient to retain the side body thereof at a fixation position. Therefore, the ambulatory hip fixation-traction splint set not only keeps the fracture area of the patient in fixation position but also assists the patient to have a suitable movement so as to enhance the recovery of the fracture area.

Abstract: A screen protection apparatus equipped with character information transmission and calendar memo function is located in a mobile communication device. It includes a condition setting module, a display module, an information storing module, an information access module, a timer and a switch module. The condition setting module aims to set the mobile communication device in a screen protection state. The display module aims to display a protection picture on the display screen of the mobile communication device. The information storing module stores a plurality of information. The information access module accesses information in the information storing module when the mobile communication device is in the screen protection state, and display the protection picture on the display screen. The timer measures a switch time according to a preset time interval.

Abstract: An ambulatory hip fixation-traction splint frame includes a supporting frame having an upper end arranged for positioning below an armpit of a treated patient and a lower end arranged for positioning below a hip portion of the treated patient, and a side splint assembly for supporting a side body of the treated patient. The side splint assembly includes a flexible guiding frame having first and second ends, and a curved guiding surface, having a predetermined curvature, defining between the first and second ends for biasing against the side body of the treated patient, and two coupling joints adjustably mounted on the supporting frame to connect with the first and second ends of the guiding frame respectively so as to retain the curvature of the guiding surface of the guiding frame for fitting on the side body of the treated patient.

Abstract: An ambulatory hip fixation-traction splint set includes a supporting frame having an upper end arranged for positioning below an armpit of a treated patient and a lower end extending to position below a hip portion of the treated patient, and a side splint assembly including a flexible guiding frame having first and second end portions mounted to the supporting frame wherein the guiding frame has a curved guiding surface adapted for fixing on a side body of the treated patient to retain the side body thereof at a fixation position. Therefore, the ambulatory hip fixation-traction splint set not only keeps the fracture area of the patient in fixation position but also assists the patient to have a suitable movement so as to enhance the recovery of the fracture area.