Abstract: The present disclosure is directed to an apparatus having a bond head configured to heat and compress a semiconductor package assembly, and a bonding stage configured to hold the semiconductor package assembly, wherein the bonding stage comprises a ceramic material including silicon and either magnesium or indium.

Abstract: Embodiments disclosed herein include package architectures. In an embodiment, the package architecture comprises a package substrate, a first bridge in the package substrate, where the first bridge includes conductive routing, and a second bridge in the package substrate. In an embodiment, the package architecture further comprises a third bridge in the package substrate, where the second bridge and the third bridge are positioned symmetrically about the first bridge.

Abstract: The present disclosure relates to a system. The system may include a stage configured to support a substrate. The system may also include a bondhead configured to press a device against the substrate. The system may further include a light source configured to emit UV light towards the stage.

Abstract: The present disclosure is directed to a thermocompression bonding tool having a bond head with a surface for compression and heating and a sensor, a stage for compression and heating, and a controller, and a method for its use for chip gap height and alignment control. For chip gap height and alignment control, the controller is provided with a recipe displacement and temperature profile and measured offsets.

Abstract: Embodiments disclosed herein include a package architecture. In an embodiment, the package architecture comprises a first substrate with a first fiducial mark on a surface of the first substrate. In an embodiment, the package architecture further comprises a second substrate over the first substrate, where the second substrate comprises glass and a second fiducial mark on the second substrate, and where a footprint of the second fiducial mark at least partially overlaps a footprint of the first fiducial mark.

Abstract: Provided is a multimedia data stream processing method, an electronic device and a storage medium, relating to the field of artificial intelligence, and specifically, to the technical fields of cloud computing, media cloud technology, and the like, which may be applied to scenes such as smart cloud. The multimedia data stream processing method includes: allocating a plurality of sub-streams of a multimedia data stream to a plurality of edge resource nodes, where the multimedia data stream is segmented into a plurality of slices and each of the plurality of sub-streams includes a part of the plurality of slices of the multimedia data stream; and scheduling the plurality of edge resource nodes to provide the plurality of sub-streams of the multimedia data stream for a terminal device.

Abstract: Provided is a multimedia data stream processing method, an electronic device and a storage medium, relating to the field of artificial intelligence, and specifically, to the technical fields of cloud computing, media cloud technology, and the like, which may be applied to scenes such as smart cloud. The multimedia data stream processing method includes: allocating a plurality of sub-streams of a multimedia data stream to a plurality of edge resource nodes, where the multimedia data stream is segmented into a plurality of slices and each of the plurality of sub-streams includes a part of the plurality of slices of the multimedia data stream; and scheduling the plurality of edge resource nodes to provide the plurality of sub-streams of the multimedia data stream for a terminal device.

Abstract: A method for recognizing a reference point associated with a fiducial marker including the steps of: obtaining or receiving image data of the fiducial marker; determining the degree of which the image data of the fiducial marker is aligned with one or more reference images; of which if the degree of alignment is determined to be less than an acceptable threshold predicting a set of coordinates of the reference point associated with the fiducial marker; incorporating the set of coordinates with the image data to form a modified image data; and determining the degree of which the modified image data of the fiducial marker is aligned with one or more reference images.

Abstract: Embodiments herein describe techniques for a magnetic conductive device including a substrate, an under layer above the substrate, and a magnetic conductive layer including NiFe alloy formed on the under layer. A method for forming a magnetic conductive device includes forming a support stack including an under layer above a substrate, cleaning the support stack, and performing electrodeposition on the under layer by placing the support stack into a plating bath to form NiFe alloy on the under layer. The NiFe alloy includes Ni in a range of about 74% to about 84%, and Fe in a range of about 26% to about 16%. Other embodiments may be described and/or claimed.

Abstract: Embodiments herein describe techniques for a magnetic conductive device including a substrate, an under layer above the substrate, and a magnetic conductive layer including NiFe alloy formed on the under layer. A method for forming a magnetic conductive device includes forming a support stack including an under layer above a substrate, cleaning the support stack, and performing electrodeposition on the under layer by placing the support stack into a plating bath to form NiFe alloy on the under layer. The NiFe alloy includes Ni in a range of about 74% to about 84%, and Fe in a range of about 26% to about 16%. Other embodiments may be described and/or claimed.

Abstract: The present disclosure is related to an electroencephalography signal collecting apparatus, comprising an electrode module, a TGAM module, a data outputting module, a power source module and a frame. The modules are disposed on the frame. The electrode module and the power outputting module are electrically connected to the TGAM module respectively. The electrode module transmits the collected electroencephalography signal to the TGAM module and is attached on the head of a wearer. The TGAM module is coupled to a vehicle apparatus outside of the electroencephalography signal collecting apparatus through the data outputting module, transmits the electroencephalography signal to a digital signal and outputs the digital signal to the vehicle apparatus. The vehicle intelligent terminal controlled through the electroencephalography signal is achieved and the operation of the driver is reduced. The intelligence and the convenience of the vehicle controlling operation is improved.