Patents by Inventor Mingman Li

Mingman Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Automated material welding
    Patent number: 11904417
    Abstract: Automated material welding including starting a welding operation, scanning a weld in-progress, creating a simulation of the weld in-progress, detecting a flaw in the weld in-progress according to the scanning and the simulation, remediating the weld in-progress, and completing the welding operation.
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: February 20, 2024
    Assignee: International Business Machines Corporation
    Inventors: Michael Benosa Monjardin, LiCen Mu, Mingman Li, Miao Zhang, Susan Zhai, Jia Yu Zheng
  • Method for identifying PCB core-layer properties
    Patent number: 11644501
    Abstract: A reference via in a set of plated vias on a printed circuit board is located. A reference lead is applied to the reference via. A test via in the set of plated vias is located. A test lead is applied to the test via. An electrical conductance between the reference via and the test via is measured. A property of a core layer of the printed circuit board is identified based on the electrical conductance.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: May 9, 2023
    Assignee: International Business Machines Corporation
    Inventors: Tao Song, Zhongfeng Yang, XiYuan Yin, Xiao Hu, LiCen Mu, Mingman Li
  • METHOD FOR IDENTIFYING PCB CORE-LAYER PROPERTIES
    Publication number: 20220091181
    Abstract: A reference via in a set of plated vias on a printed circuit board is located. A reference lead is applied to the reference via. A test via in the set of plated vias is located. A test lead is applied to the test via. An electrical conductance between the reference via and the test via is measured. A property of a core layer of the printed circuit board is identified based on the electrical conductance.
    Type: Application
    Filed: September 21, 2020
    Publication date: March 24, 2022
    Inventors: Tao Song, Zhongfeng Yang, XiYuan Yin, Xiao Hu, LiCen Mu, Mingman Li
  • AUTOMATED MATERIAL WELDING
    Publication number: 20210107082
    Abstract: Automated material welding including starting a welding operation, scanning a weld in-progress, creating a simulation of the weld in-progress, detecting a flaw in the weld in-progress according to the scanning and the simulation, remediating the weld in-progress, and completing the welding operation.
    Type: Application
    Filed: October 15, 2019
    Publication date: April 15, 2021
    Inventors: Michael Benosa Monjardin, LiCen Mu, Mingman Li, Miao Zhang, Susan Zhai, Jia Yu Zheng
  • Image conduction apparatus for soldering inner void analysis
    Patent number: 10957030
    Abstract: System and methods for solder void analysis with an optical inspection component are described, including a plurality of optical fibers longitudinally disposed through a glass tube such that ends of the optical fibers are exposed from corresponding ends of the glass tube. A solderable fill encompassing each of the optical fibers by filling spaces between each of the optical fibers and between the optical fibers and the glass tube such that the ends of the glass tube include the ends of the optical fibers surrounded by the solderable fill to form an interface around the optical fibers for soldering one of the ends of the glass tube to a solder pad.
    Type: Grant
    Filed: August 14, 2018
    Date of Patent: March 23, 2021
    Assignee: International Business Machines Corporation
    Inventors: Jiayu Zheng, Tao Song, Zexin Luo, WeiFeng Zhang, Lingle Guo, Mingman Li, Zhen Wang
  • IMAGE CONDUCTION APPARATUS FOR SOLDERING INNER VOID ANALYSIS
    Publication number: 20200058117
    Abstract: System and methods for solder void analysis with an optical inspection component are described, including a plurality of optical fibers longitudinally disposed through a glass tube such that ends of the optical fibers are exposed from corresponding ends of the glass tube. A solderable fill encompassing each of the optical fibers by filling spaces between each of the optical fibers and between the optical fibers and the glass tube such that the ends of the glass tube include the ends of the optical fibers surrounded by the solderable fill to form an interface around the optical fibers for soldering one of the ends of the glass tube to a solder pad.
    Type: Application
    Filed: August 14, 2018
    Publication date: February 20, 2020
    Inventors: Jiayu Zheng, Tao Song, Zexin Luo, WeiFeng Zhang, Lingle Guo, Mingman Li, Zhen Wang