Abstract: A motion synchronized multi-tier pallet rack and a battery formation apparatus are provided. The pallet rack includes a fixation rack, two movable frames, and two actuators. The movable frames are coupled to two corresponding sides of the fixation rack and each includes telescopic arms, a motor, and a drive rod. The actuators are disposed on other the two corresponding sides of the fixation rack to drive the movable frames to move toward or away from each other. The telescopic arms are kinematically connected to the motor through the drive rod to extend from or retract into the movable frame. The battery formation apparatus includes a motion synchronized multi-tier pallet rack, a conveyor module, a formation cabinet, and a controller. The conveyor module carries a battery module. The controller controls the pallet rack to obtain the battery module from the conveyor module and place the battery module in the formation cabinet.

Abstract: A structure and a formation method of a semiconductor device are provided. The semiconductor device structure includes a semiconductor substrate and an interconnection structure over the semiconductor substrate. The semiconductor device structure also includes a first conductive pillar over the interconnection structure. The first conductive pillar has a first protruding portion extending towards the semiconductor substrate from a lower surface of the first conductive pillar. The semiconductor device structure further includes a second conductive pillar over the interconnection structure. The second conductive pillar has a second protruding portion extending towards the semiconductor substrate from a lower surface of the second conductive pillar. The first conductive pillar is closer to a center point of the semiconductor substrate than the second conductive pillar. A bottom of the second protruding portion is wider than a bottom of the first protruding portion.

Abstract: A chiplet system and a positioning method thereof are provided. The positioning method of the chiplet system includes the following steps. Two end chiplets and a plurality of middle chiplets are classified. A quantity calculation packet is transmitted and accumulated from each of the end chiplets towards another end to analyze a quantity of middle chiplets. A serial number comparison packet is transmitted and accumulated from each of the middle chiplets connected to one of the end chiplets towards another end to set a starting point. An identify number setting packet is transmitted and accumulated from the middle chiplet set as the starting point towards another end to set a positioning number of each of the middle chiplets.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes an interconnection structure over a semiconductor substrate and a conductive pillar over the interconnection structure. The conductive pillar has a protruding portion extending towards the semiconductor substrate from a lower surface of the conductive pillar. The semiconductor device structure also includes an upper conductive via between the conductive pillar and the interconnection structure and a lower conductive via between the upper conductive via and the interconnection structure. The lower conductive via is electrically connected to the conductive pillar through the upper conductive via. The conductive pillar extends across opposite sidewalls of the upper conductive via and opposite sidewalls of the lower conductive via. A top view of an entirety of the second conductive via is separated from a top view of an entirety of the protruding portion.

Abstract: Integrated fan-out packages and methods of forming the same are disclosed. An integrated fan-out package includes two dies, an encapsulant, a first metal line and a plurality of dummy vias. The encapsulant is disposed between the two dies. The first metal line is disposed over the two dies and the encapsulant, and electrically connected to the two dies. The plurality of dummy vias is disposed over the encapsulant and aside the first metal line.

Abstract: A buffering mechanism for a gas circuit breaker includes a center piece which includes two protrusions extending from two ends thereof and two match surfaces are defined in two opposite sides of the center piece. Two side boards each have a pivot hole and a slot defined therethrough, the two protrusions of each end of the center piece are pivotably engaged with the pivot hole and the slot respectively. A plurality of impact plates are engaged with the two match surfaces of the center piece. When the impact plates are hit by the two links of the Y-shaped link mechanism of the gas circuit breaker at different times, the center piece is pivoted along the slots to absorb impact forces from the two links.

Abstract: A buffering mechanism for a gas circuit breaker includes a center piece which includes two protrusions extending from two ends thereof and two match surfaces are defined in two opposite sides of the center piece. Two side boards each have a pivot hole and a slot defined therethrough, the two protrusions of each end of the center piece are pivotably engaged with the pivot hole and the slot respectively. A plurality of impact plates are engaged with the two match surfaces of the center piece. When the impact plates are hit by the two links of the Y-shaped link mechanism of the gas circuit breaker at different times, the center piece is pivoted along the slots to absorb impact forces from the two links.

Abstract: A canopy structure for a play yard includes a pair of base docks to couple with a canvas bracket, which is adjustable angularly. Each base dock has a pair of claws to clamp the upper frame of the play yard to facilitate installation and storage. The turnable canvas bracket may be adjusted angularly to respond to alterations of sunlight direction to achieve an improved shading effect.