Abstract: Embodiments of this application relate to the field of power supply system technologies, and provide a charging protection circuit, a driving method, a chip, a package structure, and an electronic device, to provide a charging protection circuit with stable bi-directional protection effect. The charging protection circuit includes a first switching transistor and a pull-up circuit. For example, the first switching transistor is a bi-directional HEMTs device, and includes a first drain electrode, a second drain electrode, a first gate electrode, and a substrate electrode. The first drain electrode is configured to receive a signal from the second drain electrode, the second drain electrode is configured to receive a signal from the first drain electrode, and the first gate electrode is configured to control the first switching transistor to be turned on or turned off.

Abstract: A wet leakage current test system for a photovoltaic component is disclosed having a liquid pool and a voltage-withstanding insulation tester as well as a first storage rack, a lifting actuator, a second storage rack, a drying apparatus and an electrical protection device; the first storage rack is arranged above the liquid pool, and is mechanically connected with the lifting actuator; the lifting actuator is configured to drive the first storage rack to descend into the liquid pool or ascend above the liquid pool; the drying apparatus is mounted on the second storage rack, for blowing air to a front surface and a back surface of the photovoltaic component laid flat on the second storage rack; and the electrical protection device is in electrical signal connection with the voltage-withstanding insulation tester, for disabling a voltage output from the voltage-withstanding insulation tester in the case that the operator operates in a high voltage region, and/or for cutting off a power source of the voltage-wit

Abstract: Particulate contamination can occur in physical vapor deposition (PVD) systems when sputtered target material accumulates on the walls of the processing chamber and flakes off onto the workpiece. In a method for preparing a shield to reduce particulate contamination, sheet metal is formed to conform to the surfaces of the deposition chamber. The base metal is roughened, such as by sand blasting. A layer of coating material, whose coefficient of thermal expansion (CTE) is similar to that of the target material, is applied to the roughened base metal surface by a thermal spraying process. The surface of the coating is very rough, more than five times rougher than the underlying base metal texture. When the coating CTE and surface roughness are chosen carefully, shield performance can be optimized, resulting in longer processing times between shield replacements, reduced PVD chamber maintenance and less down time in these systems.

Abstract: A plasma sputtering system that may be used to deposit a film on a substrate such as an optical disk is disclosed. In one embodiment, the sputtering system includes a main vacuum chamber. A plurality of sputtering chambers and a load lock chamber are connected to the main vacuum chamber. An assembly of a horizontal unprocessed substrate, an inner mask, and an outer mask are pressed onto a substrate transport tray that is positioned in the load lock. The tray supports the substrate and the masks throughout the processing of the substrate. A vertical lift lowers the tray from the load lock onto a carousel. The carousel transports the tray, substrate and masks to the sputtering chambers and then back to the load lock for unloading. Other lifts raise the tray, processed substrate, and masks from the carousel to the sputtering chambers. The tray is selectively pressed against the lower access aperture of the load lock and sputtering chambers so as to isolated them from the main chamber.

Abstract: A plasma sputtering system is disclosed, along with methods of sputtering and methods of arranging an array of magnets disposed within the sputtering system. An embodiment of the sputtering system includes a vacuum chamber. A rotating magnetron is disposed in the vacuum chamber. A target is positioned between the magnetron and a substrate upon which material from the target is to be deposited. The magnetron includes an array of pairs of oppositely poled permanent magnets. A closed loop magnetic path extends between the pairs of oppositely poled magnets of the array. The magnetic path includes an inturn region proximate to an axis of rotation of the magnetron and at least two (e.g., five) indent regions.

Abstract: An internally cooled target assembly for use in a magnetron sputtering apparatus is provided. The internally cooled target assembly includes a cooling plate that is configured to promote highly turbulent coolant flow through the target assembly to achieve efficient and uniform target cooling. The volume of coolant required to cool the target assembly is minimized.