Abstract: A test mode control circuit includes an encryption circuit and a test mode generating circuit. The encryption circuit encrypts, based on an encryption code, an access code set to generate an encrypted access code set. The test mode generating circuit generates a test mode signal based on the encrypted access code set.

Abstract: The present invention relates to a Dunaliella salina OH214 strain having an improved ability to produce pigments, and in particular lutein. As it is possible to produce carotenoid pigments, specifically xanthophylls, with the Dunaliella salina OH214 strain by consuming less energy, it is possible to efficiently produce pigments at an industrial level. In addition, the Dunaliella salina OH214 strain can be applied as a raw material for foods, health functional foods, and pharmaceuticals, containing pigments. Moreover, the Dunaliella salina OH214 strain is a domestic native microalga in Korea and thus does not cause any GMO issues, it is possible to reduce costs by using seawater as a culture medium in Korea, and the effect of related industrial development can be expected.

Abstract: A method of manufacturing a vertical memory device includes forming a first sacrificial layer on a substrate, the first sacrificial layer including a first insulating material, forming a mold including an insulation layer and a second sacrificial layer alternately and repeatedly stacked on the first sacrificial layer, the insulation layer and the second sacrificial layer including second and third insulating materials, respectively, different from the first insulating material, forming a channel through the mold and the first sacrificial layer, forming an opening through the mold and the first sacrificial layer to expose an upper surface of the substrate, removing the first sacrificial layer through the opening to form a first gap, forming a channel connecting pattern to fill the first gap, and replacing the second sacrificial layer with a gate electrode.

Abstract: A semiconductor memory device includes a cell substrate, a mold structure including a plurality of gate electrodes stacked on the cell substrate, the gate electrodes including a first ground selection line, a second ground selection line and a plurality of word lines, which are sequentially stacked, a channel structure that extends in a vertical direction that crosses an upper surface of the cell substrate and penetrates the mold structure, a partial isolation region that extends in a first direction that is parallel with the upper surface of the cell substrate and partially separates the mold structure, and a ground isolation structure that connects two partial isolation regions adjacent to each other in the first direction, extends in the vertical direction and penetrates the first ground selection line and the second ground selection line, wherein a width of the ground isolation structure increases with distance from the cell substrate.

Abstract: A method of manufacturing a vertical memory device includes forming a first sacrificial layer on a substrate, the first sacrificial layer including a first insulating material, forming a mold including an insulation layer and a second sacrificial layer alternately and repeatedly stacked on the first sacrificial layer, the insulation layer and the second sacrificial layer including second and third insulating materials, respectively, different from the first insulating material, forming a channel through the mold and the first sacrificial layer, forming an opening through the mold and the first sacrificial layer to expose an upper surface of the substrate, removing the first sacrificial layer through the opening to form a first gap, forming a channel connecting pattern to fill the first gap, and replacing the second sacrificial layer with a gate electrode.

Abstract: A method of manufacturing a vertical memory device includes forming a first sacrificial layer on a substrate, the first sacrificial layer including a first insulating material, forming a mold including an insulation layer and a second sacrificial layer alternately and repeatedly stacked on the first sacrificial layer, the insulation layer and the second sacrificial layer including second and third insulating materials, respectively, different from the first insulating material, forming a channel through the mold and the first sacrificial layer, forming an opening through the mold and the first sacrificial layer to expose an upper surface of the substrate, removing the first sacrificial layer through the opening to form a first gap, forming a channel connecting pattern to fill the first gap, and replacing the second sacrificial layer with a gate electrode.

Abstract: A method of manufacturing a vertical memory device includes forming a first sacrificial layer on a substrate, the first sacrificial layer including a first insulating material, forming a mold including an insulation layer and a second sacrificial layer alternately and repeatedly stacked on the first sacrificial layer, the insulation layer and the second sacrificial layer including second and third insulating materials, respectively, different from the first insulating material, forming a channel through the mold and the first sacrificial layer, forming an opening through the mold and the first sacrificial layer to expose an upper surface of the substrate, removing the first sacrificial layer through the opening to form a first gap, forming a channel connecting pattern to fill the first gap, and replacing the second sacrificial layer with a gate electrode.