Abstract: Disclosed is a semiconductor package comprising lower and upper structure. The lower structure includes a first semiconductor substrate, first through vias vertically penetrating the first semiconductor substrate, first signal pads connected to the first through vias, first dummy pads between the first signal pads and electrically separated from the first through vias, and a first dielectric layer surrounding the first signal pads and the first dummy pads. The upper structure includes a second semiconductor substrate, second signal pads and second dummy pads, and a second dielectric layer surrounding the second signal pads and the second dummy pads. The first signal pad is in contact with one of the second signal pads. The first dummy pad is in contact with one of the second dummy pads. A first interval between the first dummy pads is 0.5 to 1.5 times a second interval between the first signal pads.

Abstract: A method by which a terminal transmits an SRS can comprise the steps of: receiving, from a base station, first information indicating symbols to which the SRS is transmitted among a plurality of symbols, when the terminal is configured to perform antenna switching for an SRS transmission on the plurality of symbols; and transmitting the SRS on the indicated symbols, wherein the SRS is transmitted through antenna ports respectively corresponding to the indicated symbols, and the antenna ports respectively corresponding to the indicated symbols can be different from each other.

Abstract: A method of manufacturing a window includes: preparing a glass substrate laminate which includes preparing a base substrate, alternately disposing glass substrates and adhesive layers on the base substrate, and disposing a cover substrate on the glass substrates and the adhesive layers alternately disposed; and cutting the glass substrate laminate, where the adhesive layers include a potassium nitrate (KNO3) particle and an adhesive resin. This method makes it possible to effectively manufacture an ultra-thin glass substrate used for a window.

Abstract: A manufacturing method of a window includes: providing a substrate; placing a plurality of masks above the substrate; adjusting positions of the plurality of masks to expose a target area of the substrate; spraying a coating material to the target area of the substrate exposed by the plurality of masks; and heat-treating the substrate and the coating material sprayed on the substrate to form the window.

Abstract: Provided is a light emitting element according to embodiments which includes a body including a semiconductor layer and an active layer, and a ligand including a head portion bonded to a surface of the body, an end portion spaced apart from the body, and having a positive or a negative charge, and a chain portion connecting the head portion and the end portion.

Abstract: A window reinforcing apparatus includes a spray part which sprays a solution downward, a plurality of masks which are disposed below the spray part and move in a first direction, a storage part which is disposed above the spray part, stores the solution, and provides the solution to the spray part, and a stage disposed below the masks.

Abstract: Provided is a display device including a display configured to display first content; a memory storing instructions; and a processor configured to execute the instructions to: obtain first content information by analyzing the first content, obtain user tracking information by tracking a user viewing the first content displayed by the display, determine whether a trigger condition is satisfied, based on at least one of the first content information or the user tracking information, and based on the trigger condition being satisfied, control a communication unit to transmit second content to a projector connected to the display device, wherein the second content is generated based on the first content.

Abstract: An electronic device is provided. The electronic device includes a first circuit board, an antenna member disposed to face one surface of the first circuit board, an electronic module disposed between the first circuit board and the antenna member and including a plurality of contact protrusions disposed to face the antenna member, and a plurality of contact members disposed on the antenna member and configured to electrically contact one of the plurality of contact protrusions. As the antenna member generates an induced current in reaction to an external electrical signal or an external electromagnetic field, the electronic module may be configured to supply power using the induced current generated by the antenna member.

Abstract: A semiconductor package includes a first semiconductor chip including a first semiconductor layer, a first through-electrode passing through the first semiconductor layer in a vertical direction, and a first bonding pad connected to the first through-electrode, and a second semiconductor chip including a second semiconductor layer on the first semiconductor chip, a wiring structure between the second semiconductor layer and the first semiconductor chip, a wiring pad connected to the wiring structure below the wiring structure, and a second bonding pad connected to the wiring pad below the wiring pad and in contact with the first bonding pad, wherein the second bonding pad includes a protrusion protruding toward the wiring pad.

Abstract: A semiconductor device includes a first chip and a second chip stacked on the first chip. The first chip includes a first substrate, a first upper pad on an upper surface of the first substrate, a first upper insulating layer surrounding a lower portion of the first upper pad and a sacrificial layer surrounding an upper portion of the first upper pad. The second chip includes a second substrate, a second upper pad on an upper surface of the second substrate and a second upper insulating layer surrounding the second upper pad, wherein a thickness of the second upper pad is less than a thickness of the first upper pad.

Abstract: Various embodiments of the present disclosure provide an electronic device comprising: a communication module comprising communication circuitry, a memory, and a processor operatively connected to the communication module and the memory, wherein the processor is configured to: control the electronic device to establish a connection to a wearable display device through the communication module, receive gaze information from the wearable display device, determine a first application and a second application corresponding to the gaze information to be displayed on a screen, identify profiles of the determined first application and second application, and combine graphic data corresponding to the first application and graphic data corresponding to the second application and transmit the combined graphic data to the wearable display device, or transmit each of graphic data corresponding to the first application and graphic data corresponding to the second application to the wearable display device, based on the id

Abstract: An apparatus for manufacturing a display device includes a stage, a surface member disposed on the stage, a linear motion portion that is spaced apart from the stage and that linearly moves, a mock-up portion disposed on the linear motion portion and that falls to the surface member, and a cover window coupled to the mock-up portion and that includes one surface exposed outside the mock-up portion.

Abstract: A touch display device includes a display panel including a plurality of touch electrodes, a touch driving circuit configured to operate in a first mode and a second mode according to a touch sensing type and detect a touch presence or a touch position based on a touch sensing signal received from the plurality of touch electrodes, and a timing controller. The timing controller can generate a first type of touch synchronization signal having a first level for displaying a first image during a first display period of a first display frame and a second level for detecting the touch position during a touch driving period of the first display frame, and supply the first type of touch synchronization signal to the touch driving circuit to operate the touch driving circuit in the first mode.

Abstract: A semiconductor device includes a base structure comprising a first bonding pad and a first test pad, and a semiconductor chip comprising a second bonding pad being in contact with the first bonding pad of the base structure and a second test pad being in contact with the first test pad of the base structure. A width of the second bonding pad of the semiconductor chip is less than a width of the second test pad of the semiconductor chip. An air gap is provided between the first test pad of the base structure and the second test pad of the semiconductor chip.

Abstract: A display device can include a display panel having sub pixels configured to emit light of different colors, a data driver configured to output a data voltage to the sub pixels via data lines, and a timing controller configured to output power control signals for controlling a driving current which drives the data driver. The data driver can include source driving integrated circuits, each including power control circuits configured to generate the driving current in accordance with each of the power control signals, and amplifiers configured to be applied with the driving current to output the data voltage to each of the data lines.

Abstract: Provided is a semiconductor device including lower and upper structures. The lower structure includes a first substrate, a first pad on the first substrate, and a first insulating layer surrounding the first pad. The upper structure includes a second substrate, a second pad on the second substrate, and a second insulating layer surrounding the second pad. The upper and lower structures contact each other. The first and second pads contact each other. The first and second insulating layers contact each other. The first insulating layer includes a first recess adjacent the first pad, the second insulating layer includes a second recess that is adjacent the second pad and overlaps the first recess, and a cavity is defined by the first recess and the second recess, and particles of a metallic material constituting the first and second pads are in the cavity.

Abstract: A display module includes: a display panel including a substrate, a transistor layer disposed on the substrate and including transistors, and a display layer disposed on the transistor layer and including a display element, where the display panel defines a groove or a through-hole therein; a base film including a first portion disposed on the display panel so that a portion of the first portion overlaps the groove or the through-hole, and a second portion connected to the first portion, wherein the base film defines a first indentation portion between the first portion and the second portion; and an adhesive layer bonding the first portion to the display panel.

Abstract: A display device including a display panel, in which a display region including a plurality of organic light emitting devices and a non-display region adjacent to the display region are defined, a protection film disposed below the display panel, a first adhesive layer contacting a bottom surface of the protection film, a supporting layer comprising a metallic material, at least overlapping the entire display region, and contacting the first adhesive layer, an input-sensing unit disposed on the display panel, an anti-reflection unit disposed on the input-sensing unit, and a window panel disposed on the input-sensing unit.