Abstract: A culture device is provided with a culture tank having sidewalls that are formed from a translucent material, and cultures fine algae in a culture liquid that is accommodated in the culture tank and through which light is emitted via the sidewalls. The culture device is provided with a translucent insulating part that covers the sidewalls. The insulating part forms an air layer that insulates the inside of the culture tank. A culture device is provided with a culture tank having sidewalls that are formed from a translucent material, and cultures fine algae in a culture liquid that is accommodated in the culture tank and through which light is emitted via the sidewalls. The culture device is provided with a translucent insulating part that covers the sidewalls. The insulating part forms an air layer that insulates the inside of the culture tank.

Abstract: A cleaning apparatus for a semiconductor wafer comprising: a double container including an inner container with an upper opening for accommodating a substrate to be cleaned and an outer container having an airtight space accommodating the inner container therein, the inner container being communicated to the outer container through the upper opening; a cleaning liquid supply conduit for supplying a cleaning liquid into the inner container; an inner container drain conduit for draining the cleaning liquid from the inner container; a solvent-containing gas supply conduit for supplying a solvent-containing gas into the inner container for drying the substrate; a solvent-resolving gas supply conduit for supplying a solvent-resolving gas into the inner container for resolving a solvent component attached on the substrate; an exhaust pipe for exhausting the gases from the double container, and an outer container drain conduit for draining the liquid spilled from the inner container to the outer container.

Abstract: A cleaning apparatus for a semiconductor wafer comprising: a double container including an inner container with an upper opening for accommodating a substrate to be cleaned and an outer container having an airtight space accommodating the inner container therein, the inner container being communicated to the outer container through the upper opening; a cleaning liquid supply conduit for supplying a cleaning liquid into the inner container; an inner container drain conduit for draining the cleaning liquid from the inner container; a solvent-containing gas supply conduit for supplying a solvent-containing gas into the inner container for drying the substrate; a solvent-resolving gas supply conduit for supplying a solvent-resolving gas into the inner container for resolving a solvent component attached on the substrate; an exhaust pipe for exhausting the gases from the double container, and an outer container drain conduit for draining the liquid spilled from the inner container to the outer container.

Abstract: There are provided an system for evaluating the amount of particles, a dip cleaning system, and a method of evaluating the amount of particles adhering to a substrate, which enable high-precision quantitative evaluation of the amount of particles suspended in a liquid without use of a monitor substrate, which enable easy determination of the correlation between the amount of particles suspended in the liquid and the amount of particles adhering to the substrate which is an object of cleaning, and which enable low-cost and highly-reliable cleaning evaluation. A residual liquid recovery pan for recovering a residual liquid interposed and a residual liquid quantitative measurement bath for measuring the amount of submerged particles is interposed, between the first substrate treatment bath and the second substrate treatment bath.

Abstract: In an apparatus for testing an electronic device, a life of a measurement board is significantly extended by interposing a plate member between the measurement board and a device mounting member for accommodating the electronic device. The plate member has a plurality of rear pads to be brought into contact with each of the pads of the measurement board on a back surface thereof and a plurality of front pads electrically connected to each of the rear pads through via holes on a front surface thereof. The plate member is places between the measurement board and the device mounting member on testing the electronic device and can be readily replaced by a new one when it is worn away.

Abstract: An alloy for use as a fuse element in a high temperature fuse characterized by having a high resistance to corrosion and a melting point at a fixed temperature within a range of 1000.degree. to 1100.degree.C. The alloy consists of copper containing 10-14% aluminum and 0-2.5% of a second constituent which second constituent consists of one or more metals selected from a group consisting of nickel, manganese and iron. The alloy also has desirable hardness and good workability to enable fabrication of the alloy into a fused element.