Patents by Inventor Minoru Dooka
Minoru Dooka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9240333Abstract: In a manufacturing method for a monolithic ceramic electronic component, a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block are spaced apart from each other and then tumbled, thereby uniformly making the side surface of each of the green chips an open surface. Thereafter, an adhesive is applied to the side surface. Then, by placing a side surface ceramic green sheet on an affixation elastic body, and pressing the side surface of the green chips against the side surface ceramic green sheet, the side surface ceramic green sheet is punched and stuck to the side surface.Type: GrantFiled: August 8, 2014Date of Patent: January 19, 2016Assignee: Murata Manufacturing Co., Ltd.Inventors: Togo Matsui, Minoru Dooka, Hiroyoshi Takashima, Kenichi Okajima
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Patent number: 8956486Abstract: In a manufacturing method for a monolithic ceramic electronic component, a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block are spaced apart from each other and then tumbled, thereby uniformly making the side surface of each of the green chips an open surface. Thereafter, an adhesive is applied to the side surface. Then, by placing a side surface ceramic green sheet on an affixation elastic body, and pressing the side surface of the green chips against the side surface ceramic green sheet, the side surface ceramic green sheet is punched and stuck to the side surface.Type: GrantFiled: August 29, 2013Date of Patent: February 17, 2015Assignee: Murata Manufacturing Co., Ltd.Inventors: Togo Matsui, Minoru Dooka, Hiroyoshi Takashima, Kenichi Okajima
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Patent number: 8914956Abstract: In a manufacturing method for a monolithic ceramic electronic component, a ceramic paste is applied by using an application plate to a side surface of each of a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block. In the applying step, the ceramic paste is transferred to the side surface by moving the green chips and the application plate relative to each other in the direction in which the side surface extends while separating the green chips from the application plate, in a state where the ceramic paste is connected to both the green chips and the application plate.Type: GrantFiled: June 12, 2013Date of Patent: December 23, 2014Assignee: Murata Manufacturing Co., Ltd.Inventors: Togo Matsui, Minoru Dooka, Hiroyoshi Takashima, Kenichi Okajima
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Publication number: 20140345779Abstract: In a manufacturing method for a monolithic ceramic electronic component, a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block are spaced apart from each other and then tumbled, thereby uniformly making the side surface of each of the green chips an open surface. Thereafter, an adhesive is applied to the side surface. Then, by placing a side surface ceramic green sheet on an affixation elastic body, and pressing the side surface of the green chips against the side surface ceramic green sheet, the side surface ceramic green sheet is punched and stuck to the side surface.Type: ApplicationFiled: August 8, 2014Publication date: November 27, 2014Inventors: Togo MATSUI, Minoru DOOKA, Hiroyoshi TAKASHIMA, Kenichi OKAJIMA
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Patent number: 8839510Abstract: A production method for an electronic chip component includes the steps of forming a first paste layer by applying paste onto a first end surface of an electronic component body with a second end surface being stuck onto a substrate having an adhesive surface and drying the paste, turning the electronic component body 180 degrees so as to stick the first end surface of the electronic component body onto the substrate by sliding a slider relative to the substrate in a state in which the slider is in contact with the first end surface of the electronic component body, forming a second paste layer by applying the paste onto the second end surface of the electronic component body and drying the paste, and firing the first and second paste layers.Type: GrantFiled: December 29, 2010Date of Patent: September 23, 2014Assignee: Murata Manufacturing Co., Ltd.Inventors: Minoru Dooka, Kazunori Kunimoto, Katsunori Ogata, Naohiro Yamada
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Patent number: 8795454Abstract: In a manufacturing method for a monolithic ceramic electronic component, a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block are spaced apart from each other and then tumbled, thereby uniformly making the side surface of each of the green chips an open surface. Thereafter, an adhesive is applied to the side surface. Then, by placing a side surface ceramic green sheet on an affixation elastic body, and pressing the side surface of the green chips against the side surface ceramic green sheet, the side surface ceramic green sheet is punched and stuck to the side surface.Type: GrantFiled: March 13, 2012Date of Patent: August 5, 2014Assignee: Murata Manufacturing Co., Ltd.Inventors: Togo Matsui, Minoru Dooka, Hiroyoshi Takashima, Kenichi Okajima
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Publication number: 20130340920Abstract: In a manufacturing method for a monolithic ceramic electronic component, a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block are spaced apart from each other and then tumbled, thereby uniformly making the side surface of each of the green chips an open surface. Thereafter, an adhesive is applied to the side surface. Then, by placing a side surface ceramic green sheet on an affixation elastic body, and pressing the side surface of the green chips against the side surface ceramic green sheet, the side surface ceramic green sheet is punched and stuck to the side surface.Type: ApplicationFiled: August 29, 2013Publication date: December 26, 2013Applicant: Murata Manufacturing Co., Ltd.Inventors: Togo MATSUI, Minoru DOOKA, Hiroyoshi TAKASHIMA, Kenichi OKAJIMA
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Patent number: 8584332Abstract: In a manufacturing method for a monolithic ceramic electronic component, a ceramic paste is applied by using an application plate to a side surface of each of a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block. In the applying step, the ceramic paste is transferred to the side surface by moving the green chips and the application plate relative to each other in the direction in which the side surface extends while separating the green chips from the application plate, in a state where the ceramic paste is connected to both the green chips and the application plate.Type: GrantFiled: March 13, 2012Date of Patent: November 19, 2013Assignee: Murata Manufacturing Co., Ltd.Inventors: Togo Matsui, Minoru Dooka, Hiroyoshi Takashima, Kenichi Okajima
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Publication number: 20130276955Abstract: In a manufacturing method for a monolithic ceramic electronic component, a ceramic paste is applied by using an application plate to a side surface of each of a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block. In the applying step, the ceramic paste is transferred to the side surface by moving the green chips and the application plate relative to each other in the direction in which the side surface extends while separating the green chips from the application plate, in a state where the ceramic paste is connected to both the green chips and the application plate.Type: ApplicationFiled: June 12, 2013Publication date: October 24, 2013Inventors: Togo MATSUI, Minoru DOOKA, Hiroyoshi TAKASHIMA, Kenichi OKAJIMA
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Publication number: 20120233828Abstract: In a manufacturing method for a monolithic ceramic electronic component, a ceramic paste is applied by using an application plate to a side surface of each of a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block. In the applying step, the ceramic paste is transferred to the side surface by moving the green chips and the application plate relative to each other in the direction in which the side surface extends while separating the green chips from the application plate, in a state where the ceramic paste is connected to both the green chips and the application plate.Type: ApplicationFiled: March 13, 2012Publication date: September 20, 2012Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Togo MATSUI, Minoru DOOKA, Hiroyoshi TAKASHIMA, Kenichi OKAJIMA
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Publication number: 20120234462Abstract: In a manufacturing method for a monolithic ceramic electronic component, a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block are spaced apart from each other and then tumbled, thereby uniformly making the side surface of each of the green chips an open surface. Thereafter, an adhesive is applied to the side surface. Then, by placing a side surface ceramic green sheet on an affixation elastic body, and pressing the side surface of the green chips against the side surface ceramic green sheet, the side surface ceramic green sheet is punched and stuck to the side surface.Type: ApplicationFiled: March 13, 2012Publication date: September 20, 2012Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Togo MATSUI, Minoru DOOKA, Hiroyoshi TAKASHIMA, Kenichi OKAJIMA
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Publication number: 20110088840Abstract: A production method for an electronic chip component includes the steps of forming a first paste layer by applying paste onto a first end surface of an electronic component body with a second end surface being stuck onto a substrate having an adhesive surface and drying the paste, turning the electronic component body 180 degrees so as to stick the first end surface of the electronic component body onto the substrate by sliding a slider relative to the substrate in a state in which the slider is in contact with the first end surface of the electronic component body, forming a second paste layer by applying the paste onto the second end surface of the electronic component body and drying the paste, and firing the first and second paste layers.Type: ApplicationFiled: December 29, 2010Publication date: April 21, 2011Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Minoru DOOKA, Kazunori KUNIMOTO, Katsunori OGATA, Naohiro YAMADA
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Patent number: 7874068Abstract: A production method for an electronic chip component includes the steps of forming a first paste layer by applying paste onto a first end surface of an electronic component body with a second end surface being stuck onto a substrate having an adhesive surface and drying the paste, turning the electronic component body 180 degrees so as to stick the first end surface of the electronic component body onto the substrate by sliding a slider relative to the substrate in a state in which the slider is in contact with the first end surface of the electronic component body, forming a second paste layer by applying the paste onto the second end surface of the electronic component body and drying the paste, and firing the first and second paste layers.Type: GrantFiled: December 7, 2009Date of Patent: January 25, 2011Assignee: Murata Manufacturing Co., Ltd.Inventors: Minoru Dooka, Kazunori Kunimoto, Katsunori Ogata, Naohiro Yamada
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Publication number: 20100146778Abstract: A production method for an electronic chip component includes the steps of forming a first paste layer by applying paste onto a first end surface of an electronic component body with a second end surface being stuck onto a substrate having an adhesive surface and drying the paste, turning the electronic component body 180 degrees so as to stick the first end surface of the electronic component body onto the substrate by sliding a slider relative to the substrate in a state in which the slider is in contact with the first end surface of the electronic component body, forming a second paste layer by applying the paste onto the second end surface of the electronic component body and drying the paste, and firing the first and second paste layers.Type: ApplicationFiled: December 7, 2009Publication date: June 17, 2010Applicant: Murata Manufacturing Co., Ltd.Inventors: Minoru DOOKA, Kazunori KUNIMOTO, Katsunori OGATA, Naohiro YAMADA