Abstract: In regard to a semiconductor device having a multilayered wiring board where a semiconductor chip is embedded inside, a technology which allows the multilayered wiring board to be made thinner is provided. A feature of the present invention is that, in a semiconductor device where bump electrodes are formed over a main surface (element forming surface) of a semiconductor chip embedded in a chip-embedded wiring board, an insulating film is formed over a back surface (a surface on the side opposite to the main surface) of the semiconductor chip. As a result, it becomes unnecessary to form a prepreg over the back surface of the semiconductor chip. Therefore, an effect of thinning the chip-embedded wiring board in which the semiconductor chip is embedded is obtained.

Abstract: According to one embodiment, a docking station includes: a first support; a second support; a second connector; a cover; and a second mark. The first support supports a second face of an electronic device so that a display screen of the electronic device is positioned in an inclined manner. The second support supports a side portion of the electronic device in the state. The second connector is exposed outward from an area positioned in the second support, and to be connectable to a first connector of the electronic device in the state. The cover covers at least a part of the first face in the state. The second mark is capable of being a guide corresponding to the first mark. The second mark guidably indicates to the operator to move the electronic device to a position at which the electronic device is connected while the display screen is inclined.

Abstract: The present invention enables additional processes required for forming vertical wiring and rewiring in a double face package (DFP) or a wafer level chip size package (WLCSP) to be implemented through use of a component for vertical wiring and rewiring, to thereby simplify the manufacturing process and reduce cost. An electronic component for interconnection is incorporated into an electronic device package in which a circuit element including a semiconductor chip is disposed and which has external electrodes connected to the circuit element via vertical interconnects and horizontal interconnects.

Abstract: A disk transferring device transferring disks delivered one by one from an disk reception opening to an disk ejection opening includes: a disk guide path having left and right guide surfaces that guide a peripheral surface of each of the disks and front and back guide surfaces that guide an front surface and a back surface of the disk, the disk guide path extending from the disk reception opening toward the disk ejection opening; and a plurality of disk pushers protruding into the disk guide path and pushing the disks by making a rotational movement about a plurality of rotational axis lines approximately at a right angle with respect to the front and back guide surfaces.

Abstract: According to one embodiment, an electronic apparatus includes: a display device including a display screen; a first housing which houses the display device and which includes a first surface having an opening through which the display screen is exposed, and a second surface located on a opposite side to the first surface; a second housing connected to the first housing so that the first housing is rotatable between a first position where the display screen is uncovered and a second position where the display screen is covered; first guard portions attached to the second surface to guard corner portions of the first housing along a circumferential edge of the first housing; and second guard portions which are attached to the second housing to guard corner portions of the second housing along a circumferential edge of the second housing and which abut on the first housing in the second position.

Abstract: A printed wiring board includes a built-in semiconductor element. A protective film is formed on a semiconductor element-mounted surface of a base substrate to which the built-in semiconductor element is connected to protect the semiconductor element-mounted surface excepting a mounting pad. Upper and side surfaces of the built-in semiconductor element are covered with a first insulating film formed by filling a sealing material. The first insulating film is covered with a second insulating film formed of an insulating resin melted from an insulating layer that is provided in side and upper portions of the built-in semiconductor element.

Abstract: A daughterboard to be attached to a motherboard on which a host controller is mounted includes a first connector electrically connected to the host controller, a bridge controller electrically connected to the first connector, a chip electrically connected to the bridge controller, and a second connector electrically connected to the bridge controller and configured to electrically connect to other daughterboards.

Abstract: In regard to a semiconductor device having a multilayered wiring board where a semiconductor chip is embedded inside, a technology which allows the multilayered wiring board to be made thinner is provided. A feature of the present invention is that, in a semiconductor device where bump electrodes are formed over a main surface (element forming surface) of a semiconductor chip embedded in a chip-embedded wiring board, an insulating film is formed over a back surface (a surface on the side opposite to the main surface) of the semiconductor chip. As a result, it becomes unnecessary to form a prepreg over the back surface of the semiconductor chip. Therefore, an effect of thinning the chip-embedded wiring board in which the semiconductor chip is embedded is obtained.

Abstract: An electronic apparatus includes: a housing; a motherboard that is accommodated in the housing; a first daughterboard that is accommodated in the housing; a second daughterboard that is accommodated in the housing; a host controller that is mounted on the motherboard; a bridge controller that is mounted on the first daughterboard and electrically connected to the host controller; a first chip that is mounted on the first daughterboard and electrically connected to the bridge controller; and a second chip that is mounted on the second daughterboard and electrically connected to the bridge controller.

Abstract: A printed wiring board includes a built-in semiconductor element. A protective film is formed on a semiconductor element-mounted surface of a base substrate to which the built-in semiconductor element is connected to protect the semiconductor element-mounted surface excepting a mounting pad. Upper and side surfaces of the built-in semiconductor element are covered with a first insulating film formed by filling a sealing material. The first insulating film is covered with a second insulating film formed of an insulating resin melted from an insulating layer that is provided in side and upper portions of the built-in semiconductor element.

Abstract: The present invention provides a printed wiring board with a built-in semiconductor element in which an insufficient or excessive amount of filled sealing material does not affect excellent adhesion of the printed wiring board to an overlying wiring board. The printed wiring board with a built-in semiconductor element comprises a built-in semiconductor element, in which at least the lower surface, the upper surface, or the side surface of the semiconductor element is covered with an insulating film, and an insulating layer is provided in the side and upper portions of the semiconductor element.

Abstract: A robot system having a vision sensor. The robot system includes a robot; a robot controlling section for controlling an operation of the robot; an imaging section provided on the robot and obtaining image data of a working environment of the robot; an image processing section for processing the image data obtained in the imaging section; a vision controlling section for controlling the imaging section and the image processing section to cause execution of obtaining the image data, transmitting the image data thus obtained, and processing the image data; and a communication network to which the robot controlling section, the image processing section and the vision controlling section are connected.

Abstract: A robot control apparatus comprises a servo amplifier having an AC/DC converter and used for driving a servo motor of a robot, and performs control so that power for driving the robot is supplied to the servo amplifier through a capacitor inrush current preventing resistor until precharging of a capacitor provided for the AC/DC converter is completed. The robot control apparatus has a first operation mode in which the power is supplied by bypassing the resistor, a second operation mode in which power is supplied through the resistor thereby controlling the servo motor in the robot to a lower driving speed than the driving speed in the first operation mode, and a selector switch SW for effecting switching from the first operation mode to the second operation mode or from the second operation mode to the first operation mode. With this configuration, a power supply circuit for supplying power to the servo amplifier for limiting the driving of the robot is reliably implemented by hardware.

Abstract: An electronic apparatus includes: a housing; a motherboard that is accommodated in the housing; a first daughterboard that is accommodated in the housing; a second daughterboard that is accommodated in the housing; a host controller that is mounted on the motherboard; a bridge controller that is mounted on the first daughterboard and electrically connected to the host controller; a first chip that is mounted on the first daughterboard and electrically connected to the bridge controller; and a second chip that is mounted on the second daughterboard and electrically connected to the bridge controller.

Abstract: An electronic apparatus includes: a housing; a motherboard that is accommodated in the housing; a first daughterboard that is accommodated in the housing; a second daughterboard that is accommodated in the housing; a host controller that is mounted on the motherboard; a bridge controller that is mounted on the first daughterboard and electrically connected to the host controller; a first chip that is mounted on the first daughterboard and electrically connected to the bridge controller; and a second chip that is mounted on the second daughterboard and electrically connected to the bridge controller.

Abstract: A coin hopper includes a rotating disk provided obliquely upward at a predetermined angle; an outer covering unit covering at least a lower outer circumference of the rotating disk; a holding bowl continuing from the outer covering unit and holding coins; a circular supporting rack provided in a central region of an upper surface of the rotating disk; and coin stoppers being provided on the upper surface of the rotating disk and extending radially from the supporting rack in a circumferential direction to a periphery of the rotating disk at an equal interval. Coins are accepted one by one while a surface thereof is contacted with a holding surface of the upper surface of the rotating disk between the coin stoppers, are moved in one direction while a periphery thereof is held by the supporting rack, and are received from the coin stoppers during transportation by a coin receiver.

Abstract: A pressing member having a body member with a first downwardly inclined plate and a second downwardly inclined plate is configured for mounting on a coin feeding apparatus to control the translation of coins on a rotary selector disk as they are released. The coins experience a downward force from the inclined plates to push them against the surface of the rotary disk to ensure that the coins remain within the predetermined translation path for the coins. A blocking plate can be extended upward from the body member adjacent the upstream downwardly extending plate, to prevent a rising of the coins to ensure the coins passes under the canopy of the pressing member across the translation path.

Abstract: The present invention provides a coin feeding device that can separate coins of multiple denominations that are different in diameter. A rotary disk has a circular base plate and a pushing out disk with a plurality of space radial projecting portions extending above the circular base plate. The spaces between the radial projecting portions form coin separating concave portions for receiving coins. The circular base plate can have cam grooves. A pivoting moving body can be driven by the cam grooves and can be positioned at either a radially inward surface of the separating concave portion or extended forward to discharge a coin. One side of the separating concave portions are curved as a coin pushing portion while the other side has a protruding portion that is cantilevered to extend into the concave portion and to project upward to remove any extraneous coin that may be carried by movement of the rotary disk.

Abstract: A coin replenishing apparatus, such as a detachable safe, can be securely mounted on a coin receiving and dispensing machine. The safe can have an interior cavity with an opening that can be covered by a lid that is lockable. Coins can be deposited into the safe cavity in a bulk state. A shutter member is movable from an exterior of the safe body member to enable the opening and closing of access to the interior cavity. The safe body exterior can have guide rails, connectors and other features for both securing and determining the position of the safe above a coin receipt opening in the coin receiving and dispensing apparatus.

Abstract: A coin hopper is provided that can dispense coins of different diameters without any trouble. A rotating disk has coin stoppers that are upwardly inclined at a specified angle, and a circular supporting rack at the center of the upper surface thereof. The stoppers expand radially at regular intervals, from the supporting rack side to the circumferential direction. The rotating disk makes the coins contact a holding surface between the coin stoppers and receives the coins one by one, and supports them by the supporting rack and feeds them out. An outer covering unit covers at least the lower outer circumference of the rotating disk. A storing bowl stores coins in bulk following the outer covering unit. A coin receiving unit expands from the vicinity of the supporting rack to the circumferential direction of the rotating disk, wherein the coin stoppers are arranged in a state fixed to the rotating disk.