Abstract: Thermoplastic moulding composition consisting of (A) 51 to 69.9 wt % of polyamide elastomer; (B) 15 to 38 wt % of ethylene-?-olefin copolymer; (C) 3 to 25 wt % of polyamide selected from the group consisting of: PA6, PA66, PA6/66, PA610, PA612, PA614, PA616, PA6/610, PA66/610 or mixtures thereof; (D) 0.1 to 2.0 wt % of heat stabilizers based on copper and/or iodide, organic stabilizers or a mixture thereof; (E) 0 to 5.0 wt % of additives, different from (A) to (D); where the sum of (A) to (E) makes 100 wt % of the total moulding composition, and with the proviso that the sum of (B) and (C) is in the range from 30 to 48 wt % based on the total moulding composition.

Abstract: Thermoplastic moulding composition consisting of (A) 51 to 69.9 wt % of polyamide elastomer; (B) 15 to 38 wt % of ethylene-?-olefin copolymer; (C) 3 to 25 wt % of polyamide selected from the group consisting of: PA6, PA66, PA6/66, PA610, PA612, PA614, PA616, PA6/610, PA66/610 or mixtures thereof; (D) 0.1 to 2.0 wt % of heat stabilizers based on copper and/or iodide, organic stabilizers or a mixture thereof; (E) 0 to 5.0 wt % of additives, different from (A) to (D); where the sum of (A) to (E) makes 100 wt % of the total moulding composition, and with the proviso that the sum of (B) and (C) is in the range from 30 to 48 wt % based on the total moulding composition.

Abstract: The present invention refers to a polyamide moulding composition consisting of the following components: a) 45 to 75% by weight of at least one partially crystalline polyamide consisting of at least one diamine and at least one aromatic dicarboxylic acid, whereupon the at least one diamine has 4 to 18 carbon atoms and is selected from a group of diamines consisting of linear aliphatic diamines, branched aliphatic diamines and cycloaliphatic diamines, b) 5 to 20% by weight of at least one fibrous reinforcing agent, c) 10 to 40% by weight of at least one non-sized filler which is different from the fibrous reinforcing agent in b), d) 0 to 10% by weight of a at least one additive, with the proviso that the component b) and c) add up to 25 to 45% by weight and the entirety of components a) to d) add up to 100% by weight. Moreover, the present invention refers to a moulded article producible from this moulding composition.

Abstract: The present invention refers to a polyamide moulding composition consisting of the following components: (A) 30 to 79.7% by weight of at least one partially crystalline polyamide consisting of at least one diamine and at least one aromatic dicarboxylic acid, whereupon the at least one diamine has 4 to 20 carbon atoms and is selected from a group of diamines consisting of linear aliphatic diamines, branched aliphatic diamines, cycloaliphatic diamines and araliphatic diamines, (B) 0 to 10% by weight of at least one polyamide different from component (A) (C) 20 to 55% by weight of at least one fibrous reinforcing agent, (D) 0.2 to 2.0% by weight of nigrosine, (E) 0.1 to 3.0% by weight of at least one heat stabilizer, (F) 0 to 10% by weight of a at least one additive, whereby the entirety of components (A) to (F) add up to 100% by weight.

Abstract: The present invention refers to a polyamide moulding composition consisting of the following components: a) 45 to 75% by weight of at least one partially crystalline polyamide consisting of at least one diamine and at least one aromatic dicarboxylic acid, whereupon the at least one diamine has 4 to 18 carbon atoms and is selected from a group of diamines consisting of linear aliphatic diamines, branched aliphatic diamines and cycloaliphatic diamines, b) 5 to 20% by weight of at least one fibrous reinforcing agent, c) 10 to 40% by weight of at least one non-sized filler which is different from the fibrous reinforcing agent in b), d) 0 to 10% by weight of a at least one additive, with the proviso that the component b) and c) add up to 25 to 45% by weight and the entirety of components a) to d) add up to 100% by weight. Moreover, the present invention refers to a moulded article producible from this moulding composition.

Abstract: The invention relates according to a first aspect to a sealing strip (11) for vehicle windows and according to a second aspect to a use of thermoplastics for producing such multilayered sealing strips (11), which comprise at least a first, elastic layer (12) made of a thermoplastic elastomer and a second, harder layer (13), the first layer (12) being implemented to exert a sealing function between a construction element (14) of the vehicle and a surface (15,15?) of a windowpane (16) movable in relation to the sealing strip (11), and the second layer (13) being implemented as a visible cover for at least the largest, otherwise visible part of the first layer (12), and the first layer (12) and the second layer (13) being bonded to one another over essentially the entire length of the sealing strip (11). The sealing strips (11) as well as the use according to the invention are characterized in that the second layer (13) is made of a transparent or translucent polyamide.

Abstract: Foamed composition comprising: 100 parts by weight elastomeric polymer (A), comprising monomeric units of ethylene and an ?-olefin, 1-50 parts by weight olefinic polymer (B), and further comprising 98-65 weight % monomeric units of ethylene; and 2-35 weight % monomeric units of an alpha-olefin having 4-12 carbon atoms, polymer B having a density of 880-915 kg/m3. The composition shows a very good foam structure.

Abstract: Sub data buses extending in the bit-line direction and sense amplifiers are connected to each other by inside-cell-array-block inside-column-block column select lines which are controlled by (i) column-block select lines extending in the bit-line direction and (ii) inside-cell-array-block column select lines which cross at right angles thereto. The number of the sub data bus pairs is equal to the number of columns which are simultaneously selected by all inside-cell-array-block column select line. According to the present invention, the number of the sub data bus pairs is increased as compared with a conventional DRAM. However, the sub data bus pairs to be connected to the sense amplifiers are limited only to those in a column block selected out of a plurality of column blocks into which cell array blocks are divided. This prevents the power consumption from being increased.

Abstract: In a memory device, if there is a defective column among the memory cell columns in the memory cell array, all of the bit lines sharing the same I/O data lines as such a defective column are separated from the I/O data line regardless of the column address, and instead a group of spare bit lines disposed corresponding to each column address and selected according to the column addresses is electrically connected to the I/O data line. In this structure, the bit lines are disposed by dividing into corresponding I/O data line, and if there are defects extending in two or more columns, as long as they are within a block of the same I/O data line, all of the defective memory cells can be replaced by the memory cells in the spare column. Therefore, while minimizing the increase of chip area and lowering of operating speed in the multiple-bit organized memories, a redundancy circuit having a high defect repair efficiency may be realized.