Patents by Inventor Minoru Iizuka
Minoru Iizuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11929709Abstract: An oven-controlled crystal oscillator according to one or more embodiments may include a core section having a crystal resonator, an oscillator IC and a heating IC, wherein the core section is supported by a package via an interposer, and furthermore the core section is hermetically encapsulated in the package.Type: GrantFiled: February 22, 2021Date of Patent: March 12, 2024Assignee: DAISHINKU CORPORATIONInventors: Minoru Iizuka, Takuya Kojo, Yoshinari Morimoto
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Publication number: 20220418047Abstract: A thin-film heater according to one or more embodiments may include an insulated substrate and metal wiring patterned thereon to extend between both terminals of the metal wiring. The metal wiring has a resistance of 10? or less between the terminals. The metal wiring includes a heat-generating layer made of a material that recrystallizes at a temperature of 200° C. or lower.Type: ApplicationFiled: February 19, 2021Publication date: December 29, 2022Applicant: DAISHINKU CORPORATIONInventors: Minoru IIZUKA, Takuya KOJO, Yoshinari MORIMOTO
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Publication number: 20220393643Abstract: An oven-controlled crystal oscillator according to one or more embodiments may include a core section having a crystal resonator, an oscillator IC and a heating IC, wherein the core section is supported by a package via an interposer, and furthermore the core section is hermetically encapsulated in the package.Type: ApplicationFiled: February 22, 2021Publication date: December 8, 2022Applicant: DAISHINKU CORPORATIONInventors: Minoru IIZUKA, Takuya KOJO, Yoshinari MORIMOTO
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Patent number: 10630255Abstract: A piezoelectric resonator device having a sandwich structure is provided, which can avoid gas generation with reduced size or height. A crystal resonator includes a crystal resonator plate, a first sealing member and a second sealing member. A sealing-member-side first bonding pattern and a sealing-member-side second bonding pattern, both to be bonded to the crystal resonator plate, are formed respectively on the first and second sealing members. On the crystal resonator plate, a resonator-plate-side first bonding pattern to be bonded to the first sealing member is formed on a first main surface and a resonator-plate-side second bonding pattern to be bonded to the second sealing member is formed on a second main surface. The sealing-member-side first bonding pattern is bonded to the resonator-plate-side first bonding pattern, and the sealing-member-side second bonding pattern is bonded to the resonator-plate-side second bonding pattern, both by diffusion bonding.Type: GrantFiled: December 4, 2014Date of Patent: April 21, 2020Assignee: DAISHINKU CORPORATIONInventors: Minoru Iizuka, Takuya Kojo
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Patent number: 10333053Abstract: A crystal resonator includes: a crystal resonator plate; a first sealing member that covers a first excitation electrode of the crystal resonator plate; and a second sealing member that covers a second excitation electrode of the crystal resonator plate and includes a first external electrode terminal and a second external electrode terminal to be bonded to a circuit board using a flowable conductive bonding material. The second sealing member includes a second through hole and a third through hole that pass through between a first main surface and a second main surface on which the first external electrode terminal and the second external electrode terminal are formed. The second through hole and the third through hole include: respective through electrodes for conduction between electrodes formed on the first main surface and the second main surface; and respective through parts.Type: GrantFiled: December 22, 2014Date of Patent: June 25, 2019Assignee: Daishinku CorporationInventors: Minoru Iizuka, Takuya Kojo
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Publication number: 20160329484Abstract: A crystal resonator includes: a crystal resonator plate; a first sealing member that covers a first excitation electrode of the crystal resonator plate; and a second sealing member that covers a second excitation electrode of the crystal resonator plate and includes a first external electrode terminal and a second external electrode terminal to be bonded to a circuit board using a flowable conductive bonding material. The second sealing member includes a second through hole and a third through hole that pass through between a first main surface and a second main surface on which the first external electrode terminal and the second external electrode terminal are formed. The second through hole and the third through hole include: respective through electrodes for conduction between electrodes formed on the first main surface and the second main surface; and respective through parts.Type: ApplicationFiled: December 22, 2014Publication date: November 10, 2016Applicant: DAISHINKU CORPORATIONInventors: Minoru IIZUKA, Takuya KOJO
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Publication number: 20160322952Abstract: A piezoelectric resonator device having a sandwich structure is provided, which can avoid gas generation with reduced size or height. A crystal resonator includes a crystal resonator plate, a first sealing member and a second sealing member. A sealing-member-side first bonding pattern and a sealing-member-side second bonding pattern, both to be bonded to the crystal resonator plate, are formed respectively on the first and second sealing members. On the crystal resonator plate, a resonator-plate-side first bonding pattern to be bonded to the first sealing member is formed on a first main surface and a resonator-plate-side second bonding pattern to be bonded to the second sealing member is formed on a second main surface. The sealing-member-side first bonding pattern is bonded to the resonator-plate-side first bonding pattern, and the sealing-member-side second bonding pattern is bonded to the resonator-plate-side second bonding pattern, both by diffusion bonding.Type: ApplicationFiled: December 4, 2014Publication date: November 3, 2016Applicant: Daishinku CorporationInventors: Minoru Iizuka, Takuya Kojo
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Patent number: 8796558Abstract: A base of a surface-mount electronic component package holds an electronic component element and is to be mounted on a circuit board with a conductive bonding material. The base has a principal surface and an external connection terminal to be electrically connected to the circuit board. The external connection terminal is formed in the principal surface. The base includes a bump formed on the external connection terminal. The bump is smaller than the external connection terminal. The base has a distance d between an outer periphery end edge of the external connection terminal and an outer periphery end edge of the bump along an attenuating direction of stress on the external connection terminal The stress is generated in association of mounting of the base on the circuit board. The distance d is more than 0.00 mm and equal to or less than 0.45 mm.Type: GrantFiled: March 24, 2011Date of Patent: August 5, 2014Assignee: Daishinku CorporationInventors: Minoru Iizuka, Yuka Kojo
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Publication number: 20140110643Abstract: The present invention provides an electric insulating oil composition that has excellent low temperature properties, hydrogen gas absorbability and giving less adverse effect on living bodies and comprises [A] 1,1-diphenylethane in an amount of 30 to 70 percent by mass, [B] at least one or more component selected from 4 components that are (a) 1-phenyl-1-methylphenylethane, (b) 1-phenyl-1-xylylethane, (c) 1-phenyl-1-ethylphenylethane and (d) benzyltoluene in a total amount of 30 to 70 percent by mass, and [C] 1,2-diphenylethane in an amount of 0.1 to 2 percent by mass and/or diphenylmethane in an amount of 0.1 to 13 percent by mass.Type: ApplicationFiled: May 25, 2012Publication date: April 24, 2014Applicant: JX Nippon Oil & Energy CorporationInventors: Nobuhiro Kimura, Hiroyuki Hoshino, Takahiro Kawaguchi, Mikihiro Takaki, Minoru Iizuka
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Publication number: 20130098654Abstract: A base of a surface-mount electronic component package holds an electronic component element and is to be mounted on a circuit board with a conductive bonding material. The base has a principal surface and an external connection terminal to be electrically connected to the circuit board. The external connection terminal is formed in the principal surface. The base includes a bump formed on the external connection terminal. The bump is smaller than the external connection terminal. The base has a distance d between an outer periphery end edge of the external connection terminal and an outer periphery end edge of the bump along an attenuating direction of stress on the external connection terminal The stress is generated in association of mounting of the base on the circuit board. The distance d is more than 0.00 mm and equal to or less than 0.45 mm.Type: ApplicationFiled: March 24, 2011Publication date: April 25, 2013Applicant: DAISHINKU CORPORATIONInventors: Minoru Iizuka, Yuka Kojo
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Patent number: 8279610Abstract: An electronic component package has a base in the shape of a rectangle as viewed from the top, and a metal lid. A terminal electrode on a base bottom surface and a circuit substrate are joined using a conductive adhesive material. In the electronic component package, a first terminal electrode group including two or more terminal electrodes formed in parallel is formed eccentrically to one corner position of the base bottom surface, and a single second terminal electrode, or a second terminal electrode group including two or more terminal electrodes formed in parallel, is formed eccentrically only to a first diagonal position diagonally opposite the one corner position. Also, no-electrode regions in which no terminal electrode is formed along a short side of the base are provided at another corner position facing the one corner position in a short side direction of the base, and a second diagonal position diagonally opposite the other corner position.Type: GrantFiled: August 21, 2008Date of Patent: October 2, 2012Assignee: Daishinku CorporationInventors: Minoru Iizuka, Koichi Kishimoto, Kozo Shibutani, Kentaro Nakanishi
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Patent number: 8076576Abstract: There is provided an electronic component package, in which electronic component element is mounted on a metal base, the electronic component element is covered by placing a metal cap over the metal base, and the metal base and the metal cap are joined by resistance welding to hermetically seal the electronic component element. With this electronic component package, a protrusion is provided to a portion of the metal base that comes into contact with the metal cap, and a projection tip of the protrusion has a flat face. Alternatively, the protrusion has a cross sectional shape that combines an arc member with the top side of an isosceles trapezoid.Type: GrantFiled: October 19, 2007Date of Patent: December 13, 2011Assignee: Daishinku CorporationInventors: Kazuhiko Kumatani, Yoshihisa Takano, Naotoshi Nakamura, Mototsugu Ogasa, Takashi Nakamura, Minoru Iizuka
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Patent number: 8004157Abstract: An electrode forming region for providing lead electrodes (65a, 65b) is provided on a crystal resonator plate (2). Opposed side surfaces (67a, 67b) of a substrate (6) are formed and inclined in the same direction with respect to a front major surface (63). Also, an adhesion reinforcing portion (7) for reinforcing adhesion to a conductive adhesive (5) is provided in the electrode forming region for the lead electrodes (65a, 65b). For example, the adhesion reinforcing portion (7) is a notch portion which is cut and formed in the opposed side surfaces (67a, 67b). Thereby, an adhesion strength of the crystal resonator plate (2) and the conductive adhesive (5) is increased.Type: GrantFiled: March 2, 2006Date of Patent: August 23, 2011Assignee: Daishinku CorporationInventors: Minoru Iizuka, Tatsuya Murakami, Syunsuke Satoh, Takashi Shirai, Hiroyuki Ishihara, Tomo Fujii
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Publication number: 20110114353Abstract: An electronic component package has a base in the shape of a rectangle as viewed from the top, and a metal lid. A terminal electrode on a base bottom surface and a circuit substrate are joined using a conductive adhesive material. In the electronic component package, a first terminal electrode group including two or more terminal electrodes formed in parallel is formed eccentrically to one corner position of the base bottom surface, and a single second terminal electrode, or a second terminal electrode group including two or more terminal electrodes formed in parallel, is formed eccentrically only to a first diagonal position diagonally opposite the one corner position. Also, no-electrode regions in which no terminal electrode is formed along a short side of the base are provided at another corner position facing the one corner position in a short side direction of the base, and a second diagonal position diagonally opposite the other corner position.Type: ApplicationFiled: August 21, 2008Publication date: May 19, 2011Applicant: DAISHINKU CORPORATIONInventors: Minoru Iizuka, Koichi Kishimoto, Kozo Shibutani, Kentaro Nakanishi
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Publication number: 20100033268Abstract: A piezoelectric resonator device includes a metal base through which at least two metal lead terminals are erected via an insulating material, a piezoelectric resonator plate that is placed on the metal lead terminals and is electrically connected to the metal lead terminals via an electroconductive resin adhesive, and a metal lid that hermetically covers the piezoelectric resonator plate placed on the metal lead terminals. The electroconductive resin adhesive has flexibility of at least a pencil hardness of 4B. Also, an anticorrosive film is formed on the outer surface of the metal base and the metal lead terminals, and the electroconductive resin adhesive is used for the direct electrical connecting and mechanical joining of the ends of the piezoelectric resonator plate to the upper face of the anticorrosive film of the metal lead terminals inside the hermetic seal.Type: ApplicationFiled: December 25, 2007Publication date: February 11, 2010Applicant: Daishinku CorporationInventors: Minoru Iizuka, Akinori Maemori, Yosuke Morimoto
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Publication number: 20100006315Abstract: There is provided an electronic component package, in which electronic component element is mounted on a metal base, the electronic component element is covered by placing a metal cap over the metal base, and the metal base and the metal cap are joined by resistance welding to hermetically seal the electronic component element. With this electronic component package, a protrusion is provided to a portion of the metal base that comes into contact with the metal cap, and a projection tip of the protrusion has a flat face. Alternatively, the protrusion has a cross sectional shape that combines an arc member with the top side of an isosceles trapezoid.Type: ApplicationFiled: October 19, 2007Publication date: January 14, 2010Applicant: DAISHINKU CORPORATIONInventors: Kazuhiko Kumatani, Yoshihisa Takano, Naotoshi Nakamura, Mototsugu Ogasa, Takashi Nakamura, Minoru Iizuka
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Publication number: 20080265717Abstract: An electrode forming region for providing lead electrodes (65a, 65b) is provided on a crystal resonator plate (2). Opposed side surfaces (67a, 67b) of a substrate (6) are formed and inclined in the same direction with respect to a front major surface (63). Also, an adhesion reinforcing portion (7) for reinforcing adhesion to a conductive adhesive (5) is provided in the electrode forming region for the lead electrodes (65a, 65b). For example, the adhesion reinforcing portion (7) is a notch portion which is cut and formed in the opposed side surfaces (67a, 67b). Thereby, an adhesion strength of the crystal resonator plate (2) and the conductive adhesive (5) is increased.Type: ApplicationFiled: March 2, 2006Publication date: October 30, 2008Inventors: Minoru Iizuka, Tatsuya Murakami, Syunsuke Satoh, Takashi Shirai, Hiroyuki Ishihara, Tomo Fujii
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Patent number: D760230Type: GrantFiled: March 6, 2015Date of Patent: June 28, 2016Assignee: DAISHINKU CORPORATIONInventors: Minoru Iizuka, Takuya Kojo
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Patent number: D767571Type: GrantFiled: March 29, 2016Date of Patent: September 27, 2016Assignee: DAISHINKU CORPORATIONInventors: Minoru Iizuka, Takuya Kojo
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Patent number: D806044Type: GrantFiled: March 6, 2015Date of Patent: December 26, 2017Assignee: DAISHINKU CORPORATIONInventors: Minoru Iizuka, Takuya Kojo