Patents by Inventor Minoru Ishinabe

Minoru Ishinabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070000655
    Abstract: To realize a flat heat exchanger with superior stability of the flow path, a heat exchanger for liquid cooling in which a cooling liquid flows inside the heat exchanger includes a pouch made of a water-resistant sheet having an inflow port and an outflow port for the cooling liquid; a heat exchange plate overlapping with the pouch; a presser plate pressing the pouch against the heat exchange plate; wherein protrusions and depressions delimiting a flow path linking the inflow port and the outflow port are formed on the inner side of at least one of the heat exchange plate and the presser plate.
    Type: Application
    Filed: October 24, 2005
    Publication date: January 4, 2007
    Inventors: Hiroki Uchida, Hideshi Tokuhira, Minoru Ishinabe, Hiroaki Date, Jun Taniguchi
  • Patent number: 7155914
    Abstract: A cooling structure for electronic equipment is designed for cooling a heat-generating body (2a) disposed inside a case (20) by recovering heat generated by the heat-generating body (2a) and dissipating the heat to the outside of the case (20). The cooling structure includes a heat-receiving section (4) for recovering heat generated in the heat-generating body (2a), a thermally insulated space (6) provided with an air inflow orifice (42a) and an air outflow orifice (42b) and thermally insulated from the heat-generating body (2a) and heat-receiving section (4) by a thermally insulating member (40), a heat-dissipating section (7) provided inside the thermally insulated space (6), a heat transfer member (5) for transferring the heat recovered in the heat-receiving section (4) to the heat-dissipating section (7), and a fan (22) for generating forcibly an air flow in the thermally insulated space (6).
    Type: Grant
    Filed: September 12, 2005
    Date of Patent: January 2, 2007
    Assignee: Fujitsu Limited
    Inventors: Minoru Ishinabe, Hiroki Uchida, Hideshi Tokuhira, Hiroaki Date, Wataru Tanaka
  • Publication number: 20060209512
    Abstract: A heat receiving member of a heat receiving device includes a coolant passage comprising a bag formed of a flexible sheet made up of a thermally stable, flexible plastic material and a metal film having high heat conductivity. In the coolant passage flows a coolant having an anti-corrosion property. A heat generating member including a main body and a terminal portion is supported by an adapter fitted in an opening formed in the flexible sheet. The main body of the heat generating member comes into direct contact with the coolant flowing in the coolant passage. Since the heat from the heat generating member is directly transferred to the coolant, the heat transfer path between the heat generating member and the coolant becomes shorter. Therefore, the heat resistance is reduced, so that the heat receiving efficiency is extremely high.
    Type: Application
    Filed: June 24, 2005
    Publication date: September 21, 2006
    Inventors: Jun Taniguchi, Hideshi Tokuhira, Minoru Ishinabe, Masatomo Asano, Nobuhiro Nanri
  • Publication number: 20060133032
    Abstract: A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these flow paths. A beam is arranged between a pivot provided in a second housing and a pivot provided in the inner heat-dissipating board, a beam is arranged between the pivot of the inner heat-dissipating board and a pivot provided in the outer heat-dissipating board, and the inner heat-dissipating board and the outer heat-dissipating board are movable to the second housing. According to the operation of opening the second housing, a distance between the second housing and the inner heat-dissipating board, and a distance between the inner flow path and the outer flow path are increased.
    Type: Application
    Filed: March 22, 2005
    Publication date: June 22, 2006
    Inventors: Hiroki Uchida, Jun Taniguchi, Hideshi Tokuhira, Minoru Ishinabe, Masanobu Ishiduka, Hiroaki Date
  • Publication number: 20060065970
    Abstract: A plurality of carbon fibers having a surface having a metal-plated layer (Cu-plated layer) are stood vertically on a flat plate-like provisional substrate by electrostatic flocking, and one end of the carbon fibers is provisionally adhered to the provisional substrate with an adhesive. The other end of the carbon fibers which is not provisionally adhered is contacted with a substrate (Cu plate) having a surface coated with a solder paste and, in this state, a brazing material (solder) is melted and cooled, and carbon fibers and a substrate are brazed (soldered). After completion of mechanical and thermal connection between the substrate and the carbon fibers, this is immersed in an organic solvent, and the provisionally adhered provisional substrate is peeled from the carbon fibers to manufacture a radiating fin.
    Type: Application
    Filed: December 27, 2004
    Publication date: March 30, 2006
    Inventors: Hiroki Uchida, Hideshi Tokuhira, Minoru Ishinabe, Hiroaki Date, Jun Taniguchi
  • Publication number: 20060037741
    Abstract: A pattern is formed with an insulative resin on a bonding face of a silicon chip, which is a heat generating element, and a pattern is formed with the insulative resin on a bonding face of a heat sink, which is a heat dissipating element, in alignment with the insulative resin parts formed on the silicon chip. The silicon chip and the heat sink are bonded to each other via a heat transfer sheet. The silicon chip and the heat sink are bonded to each other by a metal to form metal connection portions in a region where no insulative resin parts are formed, while the silicon ship and the heat sink are bonded to each other by a resin to form resin connection portions in a region where the insulative resin parts are formed.
    Type: Application
    Filed: December 16, 2004
    Publication date: February 23, 2006
    Inventors: Hideshi Tokuhira, Hiroaki Date, Hiroki Uchida, Minoru Ishinabe
  • Publication number: 20060038285
    Abstract: A small-size and light-weight electronic apparatus with a cooling structure capable of exhibiting good cooling performance is provided. A cover member with a plurality of grooves for forming a channel is joined by brazing to a housing on a lid body side to which an LCD panel is attached, and these grooves are covered with the housing to form a channel for circulating a coolant. The housing constitutes a part of the channel, and the channel for the coolant is integrated into the housing. Heat generated by a main body is transferred to the lid body side by the coolant and dissipated outside through the housing that performs the function of a heat-radiation plate.
    Type: Application
    Filed: November 19, 2004
    Publication date: February 23, 2006
    Inventors: Hideshi Tokuhira, Hiroaki Date, Hiroki Uchida, Minoru Ishinabe
  • Publication number: 20060005549
    Abstract: A cooling structure for electronic equipment is designed for cooling a heat-generating body (2a) disposed inside a case (20) by recovering heat generated by the heat-generating body (2a) and dissipating the heat to the outside of the case (20). The cooling structure includes a heat-receiving section (4) for recovering heat generated in the heat-generating body (2a), a thermally insulated space (6) provided with an air inflow orifice (42a) and an air outflow orifice (42b) and thermally insulated from the heat-generating body (2a) and heat-receiving section (4) by a thermally insulating member (40), a heat-dissipating section (7) provided inside the thermally insulated space (6), a heat transfer member (5) for transferring the heat recovered in the heat-receiving section (4) to the heat-dissipating section (7), and a fan (22) for generating forcibly an air flow in the thermally insulated space (6).
    Type: Application
    Filed: September 12, 2005
    Publication date: January 12, 2006
    Applicant: FUJITSU LIMITED
    Inventors: Minoru Ishinabe, Hiroki Uchida, Hideshi Tokuhira, Hiroaki Date, Wataru Tanaka