Patents by Inventor Minoru Sugawara
Minoru Sugawara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230381848Abstract: A manufacturing method of a press-formed article (200) including: press-forming a metal sheet into a preformed article (100) including a preformed bottom sheet portion (110), a first preformed standing wall portion (120a), a second preformed standing wall portion (120b), a preformed ridge portion (130) provided between the first preformed standing wall portion (120a) and the second preformed standing wall portion (120b), and a swollen portion (140) provided between the preformed bottom sheet portion (110) and the first and second preformed standing wall portions (120a) and (120b); and press-forming the preformed article (100) into a press-formed article (200) including a bottom sheet portion (210), a first standing wall portion (220a) adjacent to the bottom sheet portion (210), a second standing wall portion (220b) adjacent to the bottom sheet portion (210), and a ridge portion (230) provided between the first standing wall portion (220a) and the second standing wall portion (220b).Type: ApplicationFiled: October 8, 2021Publication date: November 30, 2023Applicant: NIPPON STEEL CORPORATIONInventors: Minoru SUGAWARA, Takashi YAMAMOTO, Yasuharu TANAKA, Takashi MIYAGI, Misao OGAWA, Junki NATORI
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Publication number: 20220097116Abstract: A press forming method includes a first step of pinching one part of a metal sheet by means of a die and a pad, and a second step of moving a punch in a direction in which the punch approaches the die relatively to perform press forming on the metal sheet. The die has a first support surface which has an edge including a curved portion. The pad has a second support surface facing the first support surface of the die. The first support surface includes a first flat portion, and a first deformation portion which protrudes or is recessed with respect to the first flat portion. The second support surface includes a second flat portion which faces the first flat portion, and a second deformation portion which is recessed or protrudes with respect to the second flat portion so as to correspond to the first deformation portion. The first deformation portion is provided on a normal line of the curved portion as viewed from a pressing direction.Type: ApplicationFiled: January 24, 2020Publication date: March 31, 2022Applicant: NIPPON STEEL CORPORATIONInventors: Minoru SUGAWARA, Yasuharu TANAKA, Takashi MIYAGI, Misao OGAWA, Junki NATORI
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Publication number: 20120214886Abstract: Extruded propylene-based resin foam according to the present invention is formed by extrusion-foaming a propylene-based resin, and the extruded propylene-based resin foam has a closed cell content of less than 40% and an expansion ratio of 10 or more. Since the extruded propylene-based resin foam has an open-cell structure in which a cell-broken state is formed at a desired level and has a high expansion ratio, each cell in the foam has a sound absorption performance, such that the extruded foam is excellent in sound absorption performance.Type: ApplicationFiled: April 30, 2012Publication date: August 23, 2012Applicant: PRIME POLYMER CO., LTD.Inventors: Minoru SUGAWARA, Yasuhiko OTSUKI, Ryoichi TSUNORI
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Patent number: 7968180Abstract: The extruded propylene-based resin composite foam (1) according to the present invention is provided by extrusion-foaming a molding material containing a propylene-based resin. The propylene-based resin forming the extruded foam has an olefin-based polymer whose loss tangent (tan ?) is 0.04 to 100 at a temperature of 298 K and a frequency of 10 Hz. The molding material includes a fibrous filler in an amount of more than 0 mass % and 60 mass % or less of the entirety of the molding material. The extruded composite foam (1) includes: first extruded foam (2) whose closed cell content is 40 percent or more and whose expansion ratio is 10 or more; and second extruded foam (3) whose closed cell content is less than 40 percent and whose expansion ratio is 10 or more.Type: GrantFiled: April 26, 2006Date of Patent: June 28, 2011Assignee: Prime Polymer Co., Ltd.Inventors: Minoru Sugawara, Yasuhiko Otsuki, Motoki Yamada, Ryoichi Tsunori
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Patent number: 7938228Abstract: A process for producing a sound absorber having skin layers constituting front and back surfaces and, interposed between the skin layers, a void layer having a plurality of pin formed holes, each hole having a depth which is enough to penetrate one of the skin layers and is not enough to reach the other skin layer. The sound absorber is formed of a resin material containing 2 to 60 wt % of reinforcing fibers with a length of 2 to 100 mm.Type: GrantFiled: March 7, 2006Date of Patent: May 10, 2011Assignees: Prime Polymer Co., Ltd., DaikyoNishikawa CorporationInventors: Yoshiaki Saito, Minoru Sugawara, Hirofumi Goda, Takeharu Suga, Masaharu Okamura, Toshifumi Sakai
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Patent number: 7855239Abstract: An object of the present invention is to provide an extruded propylene-based resin foam in which a average diameter of cells therein can be reduced while a high expansion ratio remains high, thereby providing an excellent insulation efficiency. The extruded propylene-based resin foam according to the present invention is extruded propylene-based resin foam that is formed by extrusion-foaming a propylene-based resin, and the extruded propylene-based resin foam has the expansion ratio of 10 or more and the average cell diameter of less than 400 ?m. With this configuration, the extruded foam can have a plurality of air bubble walls therein. Thus, the extruded propylene-based resin foam can efficiently block external radiant heat, thereby realizing excellent insulation efficiency.Type: GrantFiled: November 18, 2005Date of Patent: December 21, 2010Assignee: Prime Polymer Co., Ltd.Inventors: Minoru Sugawara, Yasuhiko Otsuki, Ryoichi Tsunori
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Patent number: 7834078Abstract: Main object is to provide a composition for parts of the intake system, which is capable of enhancing the flexural elasticity modulus of the parts of the intake system and reducing the specific gravity of the parts. Disclosed is a fiber reinforced resin composition for parts of intake system on the internal combustion engine comprising a block polypropylene type resin which has a MFR in the range of 40-70 g/10 minutes (at 230° C. and under a load of 2.16 kg) and which is in the range of 60-80% by weight of the composition, and glass fibers and mica the total of which are in the range of 20-40% by weight of the composition.Type: GrantFiled: June 29, 2004Date of Patent: November 16, 2010Assignees: Toyo Roki Seizo Kabushiki Kaisha, Prime Polymer Co., Ltd.Inventors: Taketoshi Matsumoto, Jun Suzuki, Tohru Iwashita, Minoru Sugawara
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Publication number: 20090155567Abstract: The extruded propylene-based resin foam according to the present invention is extruded propylene-based resin foam that is formed by extrusion-foaming a propylene-based resin, and the extruded propylene-based resin foam has the expansion ratio of 10 or more and the average cell diameter of less than 400 ?m. In addition, the extruded foam contains a 60 or less wt % fibrous filler in relation to the whole molding material. With this configuration, the extruded foam can have a plurality of foam cell walls therein. Thus, the extruded foam can efficiently block external radiant heat, thereby realizing excellent insulation efficiency. Furthermore, because the fibrous filler is oriented along the thickness direction, even when the extruded foam is slightly strained in the thickness direction, a high stress arises, thereby improving energy-absorbing capability.Type: ApplicationFiled: November 18, 2005Publication date: June 18, 2009Applicant: PRIME POLYMER CO., LTD.Inventors: Minoru Sugawara, Yasuhiko Otsuki, Ryoichi Tsunori
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Publication number: 20090076179Abstract: The extruded propylene-based resin composite foam (1) according to the present invention is provided by extrusion-foaming a molding material containing a propylene-based resin. The propylene-based resin forming the extruded foam has an olefin-based polymer whose loss tangent (tan ?) is 0.04 to 100 at a temperature of 298 K and a frequency of 10 Hz. The molding material includes a fibrous filler in an amount of more than 0 mass % and 60 mass % or less of the entirety of the molding material. The extruded composite foam (1) includes: first extruded foam (2) whose closed cell content is 40 percent or more and whose expansion ratio is 10 or more; and second extruded foam (3) whose closed cell content is less than 40 percent and whose expansion ratio is 10 or more.Type: ApplicationFiled: April 26, 2006Publication date: March 19, 2009Applicant: PRIME POLYMER CO., LTD.Inventors: Minoru Sugawara, Yasuhiko Otsuki, Motoki Yamada, Ryoichi Tsunori
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Publication number: 20090026010Abstract: A process for producing a sound absorber having skin layers constituting front and back surfaces and, interposed between the skin layers, a void layer having a number of voids, and having a plurality of formed holes each having a depth which is enough to penetrate one of the skin layers and is not enough to reach the other skin layer; comprising: providing a mold having a fixed part, a movable part, and at least one pin disposed in a manner that it can be projected into and retracted from a cavity; and having a step to cause the pin to project into the cavity during the course of charging the cavity with a resin material and molding the sound absorber and form the holes communicating with the void layer simultaneously with molding of the sound absorber.Type: ApplicationFiled: March 7, 2006Publication date: January 29, 2009Applicants: PRIME POLYMER CO., LTD., DAIKYONISHIKAWA CORPORATIONInventors: Yoshiaki Saito, Minoru Sugawara, Hirofumi Goda, Takeharu Suga, Masaharu Okamura, Toshifumi Sakai
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Patent number: 7476471Abstract: A method for correcting an exposure mask including a film of mask blank having reflex function for an EUV and an absorber film patterned on the film of mask blank for absorbing the EUV, the present method includes the steps of obtaining a light energy E0 when the EUV is vertically incident to the front surface of the mask, and when the EUV is incident to the front surface of the mask at an angle that can be considered that it is vertically incident thereto; obtaining a light energy E1 when the EUV is obliquely incident to the front surface of the mask and the EUV is reflected; and correcting the mask pattern in accordance with the compared result of the light energies E0 and E1.Type: GrantFiled: February 21, 2005Date of Patent: January 13, 2009Assignee: Sony CorporationInventor: Minoru Sugawara
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Publication number: 20090011218Abstract: Extruded propylene-based resin foam according to the present invention is formed by extrusion-foaming a propylene-based resin, and the extruded propylene-based resin foam has a closed cell content of less than 40% and an expansion ratio of 10 or more. Since the extruded propylene-based resin foam has an open-cell structure in which a cell-broken state is formed at a desired level and has a high expansion ratio, each cell in the foam has a sound absorption performance, such that the extruded foam is excellent in sound absorption performance.Type: ApplicationFiled: March 22, 2006Publication date: January 8, 2009Applicant: PRIME POLYMER CO., LTD.Inventors: Minoru Sugawara, Yasuhiko Otsuki, Ryoichi Tsunori
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Publication number: 20080206653Abstract: Disclosed herein is an exposure mask for use in manufacturing a semiconductor device through exposure conducted by use of extreme ultraviolet rays, including, an absorbing film configured to absorb the extreme ultraviolet rays, and a mask blank having the function of reflecting the extreme ultraviolet rays, wherein the thickness of the absorbing film is so determined that the contrast of an optical image transferred onto a wafer by use of the exposure mask will have a maximal value.Type: ApplicationFiled: February 19, 2008Publication date: August 28, 2008Applicant: SONY CORPORATIONInventor: Minoru Sugawara
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Patent number: 7413831Abstract: When producing an exposure mask including a stack of reflective layers for reflecting extreme ultraviolet light, an absorber film for covering a light reflection plane of the stack of reflective layers with a predetermined pattern, and a buffer film interposed therebetween, the swing effect and the bulk effect that occur on a transferred portion of the predetermined pattern are specified in accordance with characteristic values of forming materials of the absorber film and the buffer film and optical conditions when exposing, and a forming film thickness of the absorber film is decided in consideration of the specified swing effect and the specified bulk effect so that the line width variation of the pattern and/or pattern shift of the pattern are at their minimum values.Type: GrantFiled: February 25, 2003Date of Patent: August 19, 2008Assignee: Sony CorporationInventor: Minoru Sugawara
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Publication number: 20080180696Abstract: A method is provided for determining a process window for a lithography process using a reflective mask. The method begins by selecting a target Critical Dimension (CD) of a feature in an image pattern to be formed on a wafer and a corresponding CD tolerance. A CD of the feature formed on the wafer is determined as a function of exposure and focus position of light used in the lithography process. A shift in position of the image pattern is determined as a function of the exposure and the focus position. For the selected target CD and the selected corresponding CD tolerance, an Exposure-Defocus-Shift of pattern position (EDS).Type: ApplicationFiled: November 30, 2007Publication date: July 31, 2008Applicants: Sony Corporation, Sony Electronics Inc.Inventor: Minoru Sugawara
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Publication number: 20080176971Abstract: An object of the present invention is to provide an extruded propylene-based resin foam in which a average diameter of cells therein can be reduced while a high expansion ratio remains high, thereby providing an excellent insulation efficiency. The extruded propylene-based resin foam according to the present invention is extruded propylene-based resin foam that is formed by extrusion-foaming a propylene-based resin, and the extruded propylene-based resin foam has the expansion ratio of 10 or more and the average cell diameter of less than 400 ?m. With this configuration, the extruded foam can have a plurality of air bubble walls therein. Thus, the extruded propylene-based resin foam can efficiently block external radiant heat, thereby realizing excellent insulation efficiency.Type: ApplicationFiled: November 18, 2005Publication date: July 24, 2008Inventors: Minoru Sugawara, Yasuhiko Otsuki, Ryoichi Tsunori
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Patent number: 7364014Abstract: A sound absorbing body 40 has a molded body 44 including two unexpanded layers 41, 42 and an expanded layer 43 having a number of voids and held between these unexpanded layers 41, 42, a plurality of holes 41A of a depth that passes through the unexpanded layer 41 and does not reach the other unexpanded layer 42 are formed at any positions on the molded body 44, a cross-sectional area of the hole 41A is in the range from 0.785 to 314 mm2, and the pitch is 1 mm or larger. Laminating a plurality of materials is not required, and both the sound absorbing capability and sound insulating capability can be secured by integral molding, and further, only unpleasant sounds can selectively be absorbed.Type: GrantFiled: April 25, 2003Date of Patent: April 29, 2008Assignees: Prime Polymer Co., Ltd., Daikyonishikawa CorporationInventors: Hirofumi Goda, Minoru Sugawara, Yoshiaki Saito, Takeharu Suga, Masaharu Okamura, Toshifumi Sakai
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Patent number: 7274207Abstract: A semiconductor integrated circuit device has a plurality of circuit elements, a plurality of connection elements each of which becomes a conductive state or a nonconductive state, interconnects for supplying control signals for placing the connection elements in the conductive state or the nonconductive state, and a plurality of circuit selection switching elements, wherein said circuit selection switching elements are driven in response to the circuit configuration instruction signal, control signals are output from the circuit selection switching elements. As the connection elements, preferably use is made of magnetoresistance effect elements or resistance control elements which become the conductive state or the nonconductive state in accordance with application of a magnetic field. As the circuit elements, use can be made of magnetoresistance effect elements or resistance control elements.Type: GrantFiled: April 3, 2003Date of Patent: September 25, 2007Assignee: Sony CorporationInventors: Minoru Sugawara, Makoto Motoyoshi
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Patent number: 7265580Abstract: A semiconductor integrated circuit device has a plurality of circuit elements, a plurality of connection elements each of which becomes a conductive state or a nonconductive state, interconnects for supplying control signals for placing the connection elements in the conductive state or the nonconductive state, and a plurality of circuit selection switching elements, wherein said circuit selection switching elements are driven in response to the circuit configuration instruction signal, and control signals are output from the circuit selection switching elements. The connection elements may be magnetoresistance effect elements or resistance control elements which become the conductive state or the nonconductive state in accordance with application of a magnetic field. The circuit elements may also be magnetoresistance effect elements or resistance control elements.Type: GrantFiled: November 16, 2006Date of Patent: September 4, 2007Assignee: Sony CorporationInventors: Minoru Sugawara, Makoto Motoyoshi
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Publication number: 20070103191Abstract: A semiconductor integrated circuit device able to configure a desired circuit in accordance with a circuit configuration instruction signal given from the outside and able to operate the configured circuit is provided. The semiconductor integrated circuit device has a plurality of circuit elements, a plurality of connection elements each of which becomes a conductive state or a nonconductive state, interconnects for supplying control signals for placing the connection elements in the conductive state or the nonconductive state, and a plurality of circuit selection switching elements, wherein said circuit selection switching elements are driven in response to the circuit configuration instruction signal, control signals are output from the circuit selection switching elements, and the desired circuit is configured by combining the circuit elements via said connection elements which become the conductive state or the nonconductive state in accordance with the control signals.Type: ApplicationFiled: November 16, 2006Publication date: May 10, 2007Applicant: Sony CorporationInventors: Minoru Sugawara, Makoto Motoyoshi