Patents by Inventor Minoru Uda
Minoru Uda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10072321Abstract: The copper alloy of the present invention contains 5% by mass to 25% by mass of Ni, 5% by mass to 10% by mass of Sn, 0.005% by mass to 0.5% by mass of element A (element A being at least one selected from the group consisting of Nb, Zr and Ti), and 0.005% by mass or more of carbon. In the copper alloy, the mole ratio of the carbon to the element A is 10.0 or less. The copper alloy may further contain 0.01% by mass to 1% by mass of Mn. In this copper alloy, the element A may be present as carbide.Type: GrantFiled: June 25, 2015Date of Patent: September 11, 2018Assignees: NGK Insulators, Ltd., Osaka Alloying Works, Co., Ltd.Inventors: Minoru Uda, Takahiro Ishikawa, Taiji Mizuta, Yasunari Mizuta, Hiroyasu Taniguchi
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Publication number: 20160312340Abstract: The copper alloy of the present invention contains 5% by mass to 25% by mass of Ni, 5% by mass to 10% by mass of Sn, 0.005% by mass to 0.5% by mass of element. A (element A being at least one selected from the group consisting of Mb, Zr and Ti), and 0.005% by mass or more of carbon. In the copper alloy, the mole ratio of the carbon to the element A is 10.0 or less. The copper alloy may further contain 0.01% by mass to 1% by mass of Mn. In this copper alloy, the element A may be present as carbide.Type: ApplicationFiled: June 25, 2015Publication date: October 27, 2016Inventors: Minoru UDA, Takahiro ISHIKAWA, Taiji MIZUTA, Yasunari MIZUTA, Hiroyasu TANIGUCHI
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Patent number: 7784369Abstract: An inspection device 1 is provided to inspect a headrest return prevention mechanism 50 that prevents return of a headrest at a position supporting the head of a seated person by moving forward at a rear collision. The headrest return prevention mechanism 50 is provided with a bracket 52 and an engagement piece 51 which can return to a normal position again after being displaced from the normal position to a fixed position. The inspection device 1 comprises a base 11, a clamp mechanism 12 that fixes the bracket 52 to the base 11, a load applying mechanism 13 that applies a load to the engagement piece 51 so as to displace it from the normal position to the fixed position, a displacement sensor 14 that measures the fixed position when the engagement piece 51 is displaced from the normal position to the fixed position, and a computer 15 that determines whether the engagement piece 51 has been displaced to a predetermined fixed position or not based on the fixed position measured by the displacement sensor 14.Type: GrantFiled: September 21, 2006Date of Patent: August 31, 2010Assignee: TS Tech Co., Ltd.Inventor: Minoru Uda
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Patent number: 7560069Abstract: A material for a nuclear fusion reactor of the present invention contains intermetallic compounds of beryllium with Ti, V, Zr, Nb, Ta, Mo, W or Y. The beryllium intermetallic compounds are mixed with another metal or intermetallic compound. The material is preferably applied to blankets and facing members which are exposed to neutrons and heat generated by plasma of the nuclear fusion reactor.Type: GrantFiled: September 30, 2004Date of Patent: July 14, 2009Assignee: NGK Insulators, Ltd.Inventors: Hiroshi Kawamura, Munenori Uchida, Minoru Uda, Yoshio Ito
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Publication number: 20090151481Abstract: An inspection device 1 is provided to inspect a headrest return prevention mechanism 50 that prevents return of a headrest at a position supporting the head of a seated person by moving forward at a rear collision. The headrest return prevention mechanism 50 is provided with a bracket 52 and an engagement piece 51 which can return to a normal position again after being displaced from the normal position to a fixed position. The inspection device 1 comprises a base 11, a clamp mechanism 12 that fixes the bracket 52 to the base 11, a load applying mechanism 13 that applies a load to the engagement piece 51 so as to displace it from the normal position to the fixed position, a displacement sensor 14 that measures the fixed position when the engagement piece 51 is displaced from the normal position to the fixed position, and a computer 15 that determines whether the engagement piece 51 has been displaced to a predetermined fixed position or not based on the fixed position measured by the displacement sensor 14.Type: ApplicationFiled: September 21, 2006Publication date: June 18, 2009Inventor: Minoru Uda
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Publication number: 20050135960Abstract: A material for a nuclear fusion reactor of the present invention contains intermetallic compounds of beryllium with Ti, V, Zr, Nb, Ta, Mo, W or Y. The beryllium intermetallic compounds are mixed with another metal or intermetallic compound. The material is preferably applied to blankets and facing members which are exposed to neutrons and heat generated by plasma of the nuclear fusion reactor.Type: ApplicationFiled: September 30, 2004Publication date: June 23, 2005Applicant: NGK Insulators, Ltd.Inventors: Hiroshi Kawamura, Munenori Uchida, Minoru Uda, Yoshio Ito
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Patent number: 6824888Abstract: The present invention provides a method of producing a bonded body of a beryllium member and a copper or copper alloy member, in which the bonding strength and thermal cycle resistance property are further increased. When the beryllium member and the copper or copper alloy member are bonded to each other, a thin layer of titanium, chromium, molybdenum, or silicon is formed as a diffusion inhibition layer on the surface of the beryllium; a copper layer is formed as a bonding layer on the surface of the diffusion inhibition layer; a thin layer of aluminum or zinc is formed as a bonding promotion layer on the surface of the bonding layer; and the beryllium member and the copper or copper alloy member are diffusion bonded to each other with the intermediate layer formation side being the bonding surface.Type: GrantFiled: October 4, 2001Date of Patent: November 30, 2004Assignee: NGK Insulators, Ltd.Inventors: Toshihisa Hatano, Takaharu Iwadachi, Minoru Uda
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Publication number: 20030085260Abstract: The present invention provides a method of producing a bonded body of a beryllium member and a copper or copper alloy member, in which the bonding strength and thermal cycle resistance property are further increased. When the beryllium member and the copper or copper alloy member are bonded to each other, a thin layer of titanium, chromium, molybdenum, or silicon is formed as a diffusion inhibition layer on the surface of the beryllium; a copper layer is formed as a bonding layer on the surface of the diffusion inhibition layer; a thin layer of aluminum or zinc is formed as a bonding promotion layer on the surface of the bonding layer; and the beryllium member and the copper or copper alloy member are diffusion bonded to each other with the intermediate layer formation side being the bonding surface.Type: ApplicationFiled: October 4, 2001Publication date: May 8, 2003Inventors: Toshihisa Hatano, Takaharu Iwadachi, Minoru Uda
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Patent number: 5547544Abstract: A mold composed of bonded water-insoluble particles and having a molding layer and a support layer. The molding layer includes first water insoluble particles, having an average size of 0.2 -1.0 mm bonded to form a layer having a thickness 1-20 times the average size of the first particles. The support layer positioned on the inner surface of the molding layer, on which the fiber bodies are not formed, includes second water-insoluble particles, having an average size of 1.0-10.0 mm, bonded to form a layer having a thickness of at least the average size of the second particles. The pulp mold has advantages in that it hardly suffers from clogging, it produces fiber bodies each having a smooth surface, it is free from damage caused by repeated use, and it produces fiber bodies in a short period of time.Type: GrantFiled: February 6, 1995Date of Patent: August 20, 1996Assignee: NGK Insulators, Ltd.Inventors: Yasuhiro Miyamoto, Toshiaki Ishihara, Minoru Uda
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Patent number: 5531864Abstract: A pulp molding die for molding shaped articles from fiber pulp is disclosed. The die has a porous molding layer having a porosity of at least 5% and an average pore diameter in a range of 60 to 1000 .mu.m, the porous molding layer having a molding surface shaped to the configuration of the article to be molded; and a porous support layer disposed adjacent the porous molding layer on the opposite side thereof from the molding surface, the porous support layer having a porosity of at least 20% and an average pore diameter in a range of 0.6 to 10 mm, the average pore diameter being larger than that of the porous molding layer. The porous molding layer and/or the porous support layer have a pore structure for holding water.Type: GrantFiled: December 21, 1994Date of Patent: July 2, 1996Assignee: NGK Insulators, Ltd.Inventors: Yasuhiro Miyamoto, Toshiaki Ishihara, Minoru Uda
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Patent number: 5431784Abstract: A mold composed of bonded water-insoluble particles and having a molding layer and a support layer. The molding layer includes first water insoluble particles, having an average size of 0.2-1.0 mm bonded to form a layer having a thickness 1-20 times the average size of the first particles. The support layer positioned on the inner surface of the molding layer, on which the fiber bodies are not formed, includes of second water-insoluble particles, having an average size of 1.0-10.0 mm, bonded to form a layer having a thickness of at least the average size of the second particles. The pulp mold has advantages in that it hardly suffers from clogging, it produces fiber bodies each having a smooth surface, it is free from damage caused by repeated use, and it produces fiber bodies in a short period of time.Type: GrantFiled: March 2, 1993Date of Patent: July 11, 1995Assignee: NGK Insulators, Ltd.Inventors: Yasuhiro Miyamoto, Toshiaki Ishihara, Minoru Uda
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Patent number: 5399243Abstract: A pulp molding die for molding shaped articles from fiber pulp is disclosed. The die has a porous molding layer having a porosity of at least 5% and an average pore diameter in a range of 60 to 1000 .mu.m, the porous molding layer having a molding surface shaped to the configuration of the article to be molded; and a porous support layer disposed adjacent the porous molding layer on the opposite side thereof from the molding surface, the porous support layer having a porosity of at least 20% and an average pore diameter in a range of 0.6 to 10 mm, the average pore diameter being larger than that of the porous molding layer. The porous molding layer and/or the porous support layer have a pore structure for holding water.Type: GrantFiled: March 3, 1993Date of Patent: March 21, 1995Assignee: NGK Insulators, Ltd.Inventors: Yasuhiro Miyamoto, Toshiaki Ishihara, Minoru Uda