Abstract: A resin kneaded material has not more than 30 pores having a pore diameter of not less than 20 ?m in a surface area of 4.00 mm2.

Abstract: A method for producing a semiconductor-molding tablet, which can reduce formation of voids in the package due to increased density of the tablet. The method comprises a step of kneading an epoxy resin composition comprising components (A) an epoxy resin, (B) a phenol resin, and (C) an inorganic filler as essential components, a step of roll-molding the resulting kneaded composition into a sheet shape having a sheet density ratio of 98% or more, a step of pulverizing the resulting sheet-shaped compact, and a step of forming the pulverized material into a tablet shape having a tablet density ratio of 94% or more and less than 98%.

Abstract: An epoxy resin composition for semiconductor encapsulation comprising an epoxy resin, a phenolic resin, a hardening accelerator and an inorganic filler. The epoxy resin composition having the following properties (X) to (Z) does not cause the chip tilting attributable to resin flow during resin encapsulation, such as semiconductor element shifting or gold wire deformation, and can obtain highly reliable semiconductor devices: (X) the viscosity thereof as measured with a flow tester at 175° C. is from 50 to 500 P; (Y) the minimum melt viscosity thereof as determined from the temperature dependence of viscosity thereof as measured with a dynamic viscoelastic meter at a shear rate of 5 (1/s) is 1×105 poise or lower; and (Z) the ratio of the viscosity thereof as measured at 90° C. (Z1) to that as measured at 110° C. (Z2) both with a dynamic viscoelastic meter at a shear rate of 5 (1/s), (Z1/Z2), is 2.0 or higher.

Abstract: A plate material for laser plate making contains a thermoplastic resin, a light absorbing agent and a water repellent or an oil repellent.

Abstract: A double swing power unit for use in a plasma nuclear fusion experimental system comprising a bias bank, a bias switch provided by a semiconductor switch element having a rectifying function, a decoupling inductor, and a load coil connected in series, a series connection of a reverse switch and a reverse bank and a series connection of a hold switch and a hold bank, both thereof being connected in parallel with the load coil, and a control switch connected in parallel with the bias switch.