Patents by Inventor Minoru Yanagibashi

Minoru Yanagibashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonded type piezoelectric apparatus, method for manufacturing the same and bonded type piezoelectric element
    Patent number: 5325012
    Abstract: The features of the present invention are 1) to apply metallization on the bonding surface of a piezoelectric ceramic with a metal likely to react with the piezoelectric ceramic material, 2) when the piezoelectric ceramic material is soldered on the bonding surface, to apply metallization with a metal likely to react with the solder material, 3) to provide between the metallizing layers formed in 1) and 2) a metallizing layer including metal which prevents reaction between the metals and their diffusion, 4) to use a mounting member for the piezoelectric ceramic which has substantially the same thermal expansion coefficient as the piezoelectric ceramic in non-polarization condition and 5) to solder in the non-polarization condition and thereafter to polarize.
    Type: Grant
    Filed: February 20, 1992
    Date of Patent: June 28, 1994
    Assignees: Hitachi, Ltd, Hitachi Material Engineering, Ltd., Hitachi Engineering Service Co., Ltd.
    Inventors: Ichiya Sato, Takao Yoneyama, Hisanori Okamura, Satoshi Kokura, Minoru Yanagibashi