Patents by Inventor Min-woo Rhee

Min-woo Rhee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Probe card, test apparatus including the probe card, and related methods of manufacturing
    Patent number: 10514392
    Abstract: Provided are improved manufacturing methods of semiconductor devices, probe cards, test apparatuses including the probe card, and methods for manufacturing probe cards. The probe card includes a circuit board, a support located under the circuit board, and a plurality of probe needles located on a bottom surface of the support. Each of the probe needles has a tip configured to contact a side surface of a bump included in a test target. The support may include a stress absorption layer located on a bottom surface to which the probe needles are connected. Manufacturing of semiconductor devices may comprise forming elongated conductive bumps on a body of a semiconductor device, testing the semiconductor device by contacting tips of the probe needles to sides surfaces of the bumps and packaging of the semiconductor device.
    Type: Grant
    Filed: January 15, 2018
    Date of Patent: December 24, 2019
    Assignees: SAMSUNG ELECTRONICS CO., LTD., KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Min-woo Rhee, Duke Kimm, Jae-hong Kim, Ji-nyeong Yun, In-kyu Park, Jun-bo Yoon, Dong-uk Kwon, Seung-hwan Kim, Chang-keun Kim, Yong-hoon Yoon
  • PROBE CARD, TEST APPARATUS INCLUDING THE PROBE CARD, AND RELATED METHODS OF MANUFACTURING
    Publication number: 20190064219
    Abstract: Provided are improved manufacturing methods of semiconductor devices, probe cards, test apparatuses including the probe card, and methods for manufacturing probe cards. The probe card includes a circuit board, a support located under the circuit board, and a plurality of probe needles located on a bottom surface of the support. Each of the probe needles has a tip configured to contact a side surface of a bump included in a test target. The support may include a stress absorption layer located on a bottom surface to which the probe needles are connected. Manufacturing of semiconductor devices may comprise forming elongated conductive bumps on a body of a semiconductor device, testing the semiconductor device by contacting tips of the probe needles to sides surfaces of the bumps and packaging of the semiconductor device.
    Type: Application
    Filed: January 15, 2018
    Publication date: February 28, 2019
    Inventors: Min-woo Rhee, Duke Kimm, Jae-hong Kim, Ji-nyeong Yun, In-kyu Park, Jun-bo Yoon, Dong-uk Kwon, Seung-hwan Kim, Chang-keun Kim, Yong-hoon Yoon