Patents by Inventor Misa Shimada

Misa Shimada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTRONIC APPARATUS HAVING A THERMAL MODULE
    Publication number: 20210015007
    Abstract: A thermal module for suppressing surface temperature of a chassis is disclosed. The thermal module includes a flexible heat conductive sheet, a frame having openings covered by the heat conductive sheet, and a heat pipe that contacts the heat conductive sheet through various openings of the frame.
    Type: Application
    Filed: July 8, 2020
    Publication date: January 14, 2021
    Inventors: Ryota Watanabe, Hiroshi Yamazaki, Misa Shimada