Abstract: A module for use with a monitoring system is provided. The module includes a circuit board that includes a plurality of ground planes. At least two of the plurality of ground planes are coupled using a plurality of vias. The module further includes a copper pour coupled to the circuit board adjacent to the plurality of vias. The module further includes a housing that includes a dam wall that is coupled to the copper pour.

Abstract: A conversion system for use with a first monitoring system includes an interface module for receiving a plurality of hardware configuration settings associated with the first monitoring system and a conversion module coupled to the interface module for converting the plurality of hardware configuration settings into a plurality of software configuration settings for use in a second monitoring system. The plurality of hardware configuration settings are established to enable the first monitoring system to monitor the operation of a first machine, and the plurality of software configuration settings are established to enable the second monitoring system to monitor the operation of at least one of the first machine and a second machine.

Abstract: A housing for use in a monitoring system having at least one monitoring module includes a shell defining an interior cavity. At least one opening is defined in the shell, and the at least one opening is in flow communication with the interior cavity. The housing includes at least one gasket coupled to the shell about an outer perimeter of the at least one opening. The at least one gasket facilitates insulating the interior cavity from electromagnetic radiation when the at least one monitoring module is positioned within the housing.

Abstract: A module for use with a monitoring system is provided. The module includes a circuit board that includes a plurality of ground planes. At least two of the plurality of ground planes are coupled using a plurality of vias. The module further includes a copper pour coupled to the circuit board adjacent to the plurality of vias. The module further includes a housing that includes a dam wall that is coupled to the copper pour.

Abstract: A system and method that permits a monitoring unit to communicate with any one of several Serial Peripheral Interface (SPI) devices on an input/output (IO) module using a single device select line. The monitoring unit sends a data message with an identifier code to the IO module, which includes a router to selectively activate a corresponding circuit to the selected SPI device based on the identifier code.

Abstract: A system and method for detecting improper wiring or configuration in a monitoring system. The improper wiring or configuration is detected by measuring the value of an electrical property (e.g., voltage or current) of an electrical signal received from a first set of wiring terminals to which a transducer is connected and comparing that value to a predetermined value or range of values of the electrical property based on values that would be expected for the electrical signal if the transducer was the type configured to be monitored by the monitoring unit.

Abstract: A first backplane for being electrically coupled to a second backplane, a system monitoring module, and at least one transducer monitoring module includes a system interface bus configured to be coupled to the system monitoring module and the second backplane. The intermediate backplane also includes at least one monitor interface bus configured to be coupled to the at least one transducer monitoring module and the second backplane and an intermediate backplane bus configured to be coupled to the at least one transducer monitoring module and the system monitoring module.

Abstract: Embodiments of the invention described herein a device, method and system of connecting a first circuit board and a second circuit board using an interface connector. In one aspect, an interface connector is described that is comprised of a casing and a plurality of electrically conductive connectors insulated from one another within the casing. Each connector has a first end and a second end, wherein the first end connects to a first circuit board and the second end connects to a second circuit board. The plurality of connectors form a first row and a second row of the interface connector. The first row is comprised of evenly-numbered connectors and the second row is comprised of odd-numbered connectors.

Abstract: Embodiments of the invention described herein a device, method and system of connecting a first circuit board and a second circuit board using an interface connector. In one aspect, an interface connector is described that is comprised of a casing and a plurality of electrically conductive connectors insulated from one another within the casing. Each connector has a first end and a second end, wherein the first end connects to a first circuit board and the second end connects to a second circuit board. The plurality of connectors form a first row and a second row of the interface connector. The first row is comprised of evenly-numbered connectors and the second row is comprised of odd-numbered connectors.

Abstract: A conversion system for use with a first monitoring system includes an interface module for receiving a plurality of hardware configuration settings associated with the first monitoring system and a conversion module coupled to the interface module for converting the plurality of hardware configuration settings into a plurality of software configuration settings for use in a second monitoring system. The plurality of hardware configuration settings are established to enable the first monitoring system to monitor the operation of a first machine, and the plurality of software configuration settings are established to enable the second monitoring system to monitor the operation of at least one of the first machine and a second machine.

Abstract: A housing for use in a monitoring system having at least one monitoring module includes a shell defining an interior cavity. At least one opening is defined in the shell, and the at least one opening is in flow communication with the interior cavity. The housing includes at least one gasket coupled to the shell about an outer perimeter of the at least one opening. The at least one gasket facilitates insulating the interior cavity from electromagnetic radiation when the at least one monitoring module is positioned within the housing.

Abstract: A first backplane for being electrically coupled to a second backplane, a system monitoring module, and at least one transducer monitoring module includes a system interface bus configured to be coupled to the system monitoring module and the second backplane. The intermediate backplane also includes at least one monitor interface bus configured to be coupled to the at least one transducer monitoring module and the second backplane and an intermediate backplane bus configured to be coupled to the at least one transducer monitoring module and the system monitoring module.