Abstract: A system for a direct-current (DC) to alternating current (AC) inverter includes: a memory configured to store instructions; a main microcontroller configured to execute the stored instructions to control the inverter during non-timing-critical operation; and a safety controller configured to control the inverter during timing-critical operation.

Abstract: An optical device including: a glass substrate; a crystalline silicon layer bonded to the glass substrate; and a thermally tunable thin-film optical filter fabricated on top of the crystalline silicon layer.

Abstract: Methods and arrangements for providing compact optical paths between an optical connector, such as an MTRJ connector, and optoelectronic chips contained in TO cans. The methods and arrangements employed for creating the optical paths include the use of fibers that are not prone to fail from bending stresses, or waveguides.

Abstract: A structure that includes a substrate, typically a semiconductor chip such as a VCSEL or photodetector chip, and a guide for aligning a signal conveying device, typically an optical fiber, to a transducer such as an optoelectronic device on the semiconductor chip. The guide is formed, in a preferred embodiment, by lithographically exposing and developing a thick layer of photoresist. The structure is assembled by placing and securing the signal conveying device into a cavity-like region of the guide.

Abstract: A process and structure for forming an optical subassembly in an integrated circuit, comprising: defining electrically conducting lines and bonding pads in a metallization layer on a substrate; depositing a passivation layer over the metallization layer; etching the passivation layer to remove the passivation layer from each of the bonding pads and a portion of the metallization layer associated with each of the bonding pads; diffusing Cr from the lines proximate said bonding pads to prevent solder wetting down lines; bonding an optical device to one of the bonding pads; and attaching the substrate to a carrier utilizing solder bond attachment.

Abstract: A package is described that couples a twelve channel wide fiber optic cable to a twelve channel Vertical Cavity Surface Emitting Laser (VCSEL) transmitter and a multiple channel Perpendicularly Aligned Integrated Die (PAID) receiver. The package allows for reduction in the height of the assembly package by vertically orienting certain dies parallel to the fiber optic cable and horizontally orienting certain other dies. The assembly allows the vertically oriented optoelectronic dies to be perpendicularly attached to the horizontally oriented laminate via a flexible circuit.

Abstract: A planar spectrograph for demultiplexing optical wavelength signals includes a monolithic substrate. The substrate has a diffraction grating etched therein. The diffraction grating is integrally formed in the substrate to be in operative relationship with input light to diffract and reflect the input light to a detector. A recess is formed in the substrate to accommodate a separate slab waveguide. A slab waveguide is dimensioned and configured to fit within the recess, and the waveguide guides input light to and from the diffraction grating. A silicon-on-insulator spectrographs is also described, as well as, fabrication processes for manufacturing these spectrographs.

Abstract: A planar spectrograph for demultiplexing optical wavelength signals includes a monolithic substrate. The substrate has a diffraction grating etched therein. The diffraction grating is integrally formed in the subtstrate to be in operative relationship with input light to diffract and reflect the input light to a detector. A recess is formed in the substrate to accommodate a separate slab waveguide. A slab waveguide is dimensioned and configured to fit within the recess, and the waveguide guides input light to and from the diffraction grating. A silicon-on insulator spectrographs is also described, as well as, fabrication processes for manufacturing these spectrographs.

Abstract: A process and structure for forming an optical subassembly in an integrated circuit, comprising: defining electrically conducting lines and bonding pads in a metallization layer on a substrate; depositing a passivation layer over the metallization layer; etching the passivation layer to remove the passivation layer from each of the bonding pads and a portion of the metallization layer associated with each of the bonding pads; diffusing Cr from the lines proximate said bonding pads to prevent solder wetting down lines; bonding an optical device to one of the bonding pads; and attaching the substrate to a carrier utilizing solder bond attachment.

Abstract: A novel optoelectronic packaging submount arrangement which incorporates a 90° C. electrical conductor turn, and more specifically methods of producing optoelectronic packaging submount arrangement incorporating 90° C. electrical conductor turns.

Abstract: An optical subassembly (OSA), in accordance with the present invention, includes a housing, which may be substantially rectangular, the OSA includes a first end portion and a second end portion oppositely disposed from the first end portion. The first end portion forms a bore configured and dimensioned to receive a ferrule having an optical fiber therein. The bore is adjacent to a ferrule stop which is integrally formed in the housing. A lens is integrally formed with the housing. The lens has a planar surface and a convex surface opposite the planar surface. The planar surface of the lens is substantially parallel to and set in from the ferrule stop to prevent contact between the ferrule and the planar surface. The optical device, the lens, and the bore which accepts the ferrule are all in optical alignment.

Abstract: A method for providing X,Y and Z alignment during fabrication of an optical subassembly (OSA) by active alignment and fixing with epoxy through the agency of radio frequency (RF) heating in order to provide acceptable feedback-induced noise level along with acceptable coupling efficiency.

Abstract: An optical subassembly for transferring light between an optoelectronic converter and an optical fiber where the housing and the lens are of plastic in which the housing is made to dimensions within the precision of molded plastic and the lens imparts focusing properties that compensate for the limitations of the plastic technology. Alignment in the X-Y plane only is employed. The lens has a first surface focused on the optoelectronic converter which substantially collimates the light through the lens and a second surface that introduces deliberate longitudinal spherical aberration that compensates for component position. Attachment or fixing of the optoelectronic converter to the housing is accomplished by RF heating a TO can to quickly cure an epoxylayer.

Abstract: An optical subassembly for transferring light between an optoelectronic converter and an optical fiber where the housing and the lens are of plastic in which the housing is made to dimensions within the precision of molded plastic and the lens imparts focusing properties that compensate for the limitations of the plastic technology. Alignment in the X-Y plane only is employed. The lens has a first surface focused on the optoelectronic converter which substantially collimates the light through the lens and a second surface that introduces deliberate longitudinal spherical aberration that compensates for component position. Attachment or fixing of the optoelectronic converter to the housing is accomplished by RF heating a TO can to quickly cure an epoxylayer.

Abstract: Methods, apparatus and manufacturing processes are set forth which reduce the affects of scattered light in electro-optical devices, fiber optic links, etc., through the use of radiation sensitive compounds which, for example, can be easily applied to a semiconductor wafer when fabricating a solid state integrated receiver. According to the invention, a given radiation sensitive compound is transformed into a light blocking material (i.e., a material that will not transmit light) as a result of a lithographic (and in some cases a photolithographic) process. The resultant blocking material may be easily removed from any regions which is designed to receive transmitted light (for example, detector regions); while any other light sensitive regions remain covered (i.e., are protected) by the blocking material at the conclusion of the process.

Abstract: A direct optical connector (DOC) comprised of first and second members, each including a plurality of light emitting and light detecting locations, operative in combination with energy transfer media to form direct optical connections between the light emitting locations and the light detecting locations, wherein said first and second members are adapted for reclosable connection to each other whereupon the light emitting locations on one member are aligned with the light detecting locations on the other member. The first and second members of the preferred DOC are modular. Alternative forms of energy transfer media are used in various embodiments of the invention including lenslet arrays, imaging fiber plates (IFPs), and energy transfer fiber plates (ETFPs). These media have differing alignment criteria, differing degrees of immunity from crosstalk, differing degrees of transfer efficiency, different manufacturing costs, etc.

Abstract: Methods and apparatus are set forth for passively and precisely aligning pairs of objects, in particular, microelectronic components such as semiconductor lasers and fibers, utilizing fiducial marks. Additionally, methods and apparatus are set forth for combining passive and active alignment techniques where high degrees of alignment precision are required. Still further, techniques are described for fixing prealigned objects, independent of how the objects are prealigned, to a mounting surface in a manner that maintains the relative (aligned) position of the objects. Further yet, in order to help minimize manufacturing costs with respect to production of, for example, microelectronic assemblies, batch processing techniques are described which utilize the novel alignment procedures contemplated by the invention.

Abstract: The present invention provides an improved electroerosin recording medium which comprises, in a preferred embodiment, a non-conductive support, a hard, abrasion resistant layer, preferably comprising an organic polymer matrix containing an inorganic particulate material, a thin conductive film, typically of a metal such as aluminum, and an abrasion resistant overlayer that most preferably comprises a solid conductive lubricant dispersed in an organotitanium regaent modified polymer system. The overlayer is highly adherent to the conductive surface, has a low organic binder content and provides effective protection against abrasion of the conductive layer and fouling of a print head during electroerosion printing.

Abstract: Electroerosion recording materials of superior scratch resistance are provided by incorporating a hard, crosslinked polymer film or layer between the support and the removable, thin conductive layer to reduce plastic deformation of the support under stylus writing pressure. The intermediate polymer layer may be unfilled or filled with solid particles, such as silica particles. The materials may be used in various printing processes including making directly readable images, direct negatives, and offset masters.

Abstract: Electroerosion recording materials are provided with a surface lubricant film of lubricating conductive material in a polymeric binder. The lubricating conductive agent reduces stylus scratching of the conductive layer during electroerosion printing, improves contrast, provides a beneficial coating on the writing electrode or stylus and improves the handling and writing characteristics of the recording material. The lubricating conductive agent/polymer films are especially useful where the substrate of the recording material is light transmissive and, after the electroerosion process, the resulting product is suitable for direct-negative applications.