Patents by Inventor Mitoshi Umeki
Mitoshi Umeki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8729775Abstract: An exemplary piezoelectric vibrating device includes a piezoelectric vibrating piece that vibrates when electrically energized. A first package plate has a main recess in which the piezoelectric vibrating piece is placed, and a peripheral surface surrounding the recess. A second package plate is bonded to the peripheral surface of the first package plate in airtight manner. A band of adhesive bonds the first package plate to the second package plate. The adhesive band surrounds the peripheral surface. Between the adhesive and the main recess is a band of metal film. The band of metal film prevents gas, generated from the adhesive, from flowing into the recess. The band of metal film surrounds the peripheral surface and is disposed inboard of the band of adhesive.Type: GrantFiled: June 20, 2011Date of Patent: May 20, 2014Assignee: Nihon Dempa Kogyo Co., Ltd.Inventors: Mitoshi Umeki, Ryoichi Ichikawa, Yoshiaki Amano, Kenji Kamezawa, Kenichi Kikuchi, Noritsugu Matsukura
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Patent number: 8604675Abstract: To provide a piezoelectric resonator that suppresses spread of a conductive adhesive and is low in cost and a method of manufacturing a piezoelectric resonator. At positions, of a base 3, corresponding to electrode terminals on a crystal resonating piece 10, projection portions 41, 42 are formed by etching the base 3, and a metal film is formed on front surfaces of the above projection portions 41, 42, and the above metal films and the electrode terminals on the above-described crystal resonating piece 10 are electrically connected with a conductive adhesive 34. The conductive adhesives 34 rise on side surfaces of the above-described projection portions 41, 42 due to surface tension to bring the conductive adhesives 34 into a state where they do not easily flow outward, so that it is possible to suppress spread of the conductive adhesives 34.Type: GrantFiled: March 8, 2011Date of Patent: December 10, 2013Assignee: Nihon Dempa Kogyo Co., Ltd.Inventor: Mitoshi Umeki
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Patent number: 8415858Abstract: Piezoelectric vibrating pieces are disclosed having selectively roughened surfaces. An exemplary piece is made of a piezoelectric material configured as a piezoelectric substrate. The piece also includes at least one excitation electrode and at least one extraction electrode. The substrate has opposing main surfaces initially having low surface roughness. At least one main surface is formed in a mesa or reverse mesa manner, wherein the central region has a different thickness than the peripheral region. The central region has relatively low surface roughness (irregular unevenness), while the peripheral region has relatively high surface roughness. The excitation electrode is formed on the central region (mesa or reverse mesa) while the extraction electrode (connected to the excitation electrode) is formed on the peripheral region.Type: GrantFiled: February 18, 2011Date of Patent: April 9, 2013Assignee: Nihon Dempa Kogyo Co., Ltd.Inventors: Manabu Ishikawa, Kenji Shimao, Hiroyuki Sasaki, Mitoshi Umeki, Kenichi Kikuchi
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Patent number: 8405282Abstract: An exemplary piezoelectric vibrating device includes a piezoelectric vibrating piece that vibrates when electrically energized, a first package plate, and a second package plate. The first package plate has a respective inner main surface defining a recess. The recess has volume and dimensions sufficient to contain at least a portion of the piezoelectric vibrating piece. The inner main surface includes a peripheral main surface that peripherally extends around the recess. The second package plate has respective inner and outer main surfaces. The inner main surface is bonded to the peripheral main surface of the first package plate using a sealing material that thus seals the piezoelectric vibrating piece inside a package formed of the first and second package plates. The sealing material includes multiple concentric bands of sealing glass and multiple concentric bands of adhesive.Type: GrantFiled: May 27, 2011Date of Patent: March 26, 2013Assignee: Nihon Dempa Kogyo Co., Ltd.Inventor: Mitoshi Umeki
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Patent number: 8382995Abstract: Methods are disclosed for manufacturing piezoelectric devices. In an exemplary method a base substrate is prepared that defines multiple device bases. Multiple cutting grooves are defined on a surface of the base substrate in a grid pattern to define therebetween the size of the devices. A frame substrate is also prepared from a piezoelectric material. The frame substrate defines multiple frames surrounding respective vibrating pieces and being alignable with respective bases in the base substrate. Also prepared is a lid substrate defining multiple lids being alignable with respective frames and bases. The three substrates are aligned and bonded together such that the frame substrate is between the lid and base substrates and the surface defining the cutting grooves faces outward. The base substrate is mounted on a dicing sheet such that cutting grooves face the dicing sheet. Cutting is performed, using a dicing blade, through the sandwich from the lid substrate to the cutting grooves.Type: GrantFiled: July 6, 2010Date of Patent: February 26, 2013Assignee: Nihon Dempa Kogyo Co., Ltd.Inventors: Ryoichi Ichikawa, Mitoshi Umeki
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Publication number: 20130002096Abstract: A piezoelectric device includes a piezoelectric vibrating plate, a first plate, a first glass sealing material disposed in a ring shape, and an electrically conductive adhesive. The piezoelectric vibrating plate includes a piezoelectric vibrating piece, a frame body, and a pair of extraction electrodes. The piezoelectric vibrating piece includes a pair of excitation electrodes. The frame body surrounds the piezoelectric vibrating piece. The frame body is formed integrally with the piezoelectric vibrating piece. The first glass sealing material encloses a periphery of the first main surface of the frame body so as to bond the first plate and the first main surface of the frame body together.Type: ApplicationFiled: June 27, 2012Publication date: January 3, 2013Applicant: NIHON DEMPA KOGYO CO., LTD.Inventors: MITOSHI UMEKI, RYOICHI ICHIKAWA
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Patent number: 8303755Abstract: Methods are disclosed for manufacturing piezoelectric devices. An exemplary method comprises the step of bonding a lid wafer, a piezoelectric frame wafer (having a vibrating piece and a outer frame surrounding the vibrating piece), and a base wafer (having at least one wiring through-hole) together. A surface of a unit (typically ball-shaped) of eutectic metal is cleaned and then arranged on the through-hole. The unit of eutectic metal is then melted in a vacuum or inert gas environment to allow the eutectic metal to enter the through-hole.Type: GrantFiled: October 6, 2009Date of Patent: November 6, 2012Assignee: Nihon Dempa Kogyo Co., Ltd.Inventors: Ryoichi Ichikawa, Mitoshi Umeki
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Patent number: 8227958Abstract: An exemplary piezoelectric vibrating device includes a piezoelectric frame that supports and surrounds a tuning-fork type piezoelectric vibrating piece having a pair of vibrating arms. The device also includes a lid and a package base that are siloxane-bonded to the frame. The lid defines at least one frequency-adjustment hole extending through the thickness dimension of the lid from an inner major surface thereof (facing the frame) to an outer major surface of the lid. The package base defines at least one through-hole electrode passing via a respective electrode through-hole through the thickness of the base from an inner major surface thereof (facing the frame) to the outer major surface thereof. The electrode is connected to the piezoelectric vibrating piece. The lid and base include external electrodes, made of an electrically conductive material, that cover the through-holes and frequency-adjustment hole(s).Type: GrantFiled: February 10, 2010Date of Patent: July 24, 2012Assignee: Nihon Dempa Kogyo Co., Ltd.Inventors: Takahiro Inoue, Takefumi Saito, Mitoshi Umeki, Ryoichi Ichikawa
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Patent number: 8154178Abstract: In the disclosed piezoelectric devices a piezoelectric frame includes a vibrating piece. An excitation electrode is formed on the vibrating piece. An outer frame portion surrounds the vibrating piece and includes an extraction electrode connected to the excitation electrode. A package base is bonded to one surface of the outer frame portion and includes a connection electrode connected to the extraction electrode. The package base includes an external terminal formed on a surface thereof opposite the surface on which the connection electrodes are formed. Through-hole conductors connected the connection electrodes with respective external terminals. A lid is bonded to an opposing surface of the piezoelectric frame. An exhaust channel is in communication with the extraction electrode adjacent the through-hole conductors.Type: GrantFiled: July 27, 2009Date of Patent: April 10, 2012Assignee: Nihon Dempa Kogyo Co., Ltd.Inventors: Ryoichi Ichikawa, Mitoshi Umeki
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Patent number: 8120233Abstract: Methods are disclosed for manufacturing piezoelectric vibrating pieces and devices including such pieces. According to an embodiment of the method, a piezoelectric vibrating piece is produced from a piezoelectric wafer. To form the piece, a profile of the piezoelectric vibrating piece is formed in a piezoelectric wafer. A first metal film (chromium; Cr) is formed on the surface of the piezoelectric piece. The chromium film is surface-oxidized to form a film having Cr foundation layer and an oxidized surface. A second metal film (gold; Au) is formed on the oxidized surface. Then, in selected regions not destined to become electrodes, the second metal film is removed, leaving electrode patterns at designated regions of the piezoelectric vibrating piece.Type: GrantFiled: December 3, 2009Date of Patent: February 21, 2012Assignee: Nihon Dempa Kogyo Co., Ltd.Inventors: Mitoshi Umeki, Takahiro Inoue, Yoshiaki Amano, Takefumi Saito
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Publication number: 20110316390Abstract: An exemplary piezoelectric vibrating device includes a piezoelectric vibrating piece that vibrates when electrically energized. A first package plate has a main recess in which the piezoelectric vibrating piece is placed, and a peripheral surface surrounding the recess. A second package plate is bonded to the peripheral surface of the first package plate in airtight manner. A band of adhesive bonds the first package plate to the second package plate. The adhesive band surrounds the peripheral surface. Between the adhesive and the main recess is a band of metal film. The band of metal film prevents gas, generated from the adhesive, from flowing into the recess. The band of metal film surrounds the peripheral surface and is disposed inboard of the band of adhesive.Type: ApplicationFiled: June 20, 2011Publication date: December 29, 2011Inventors: Mitoshi Umeki, Ryoichi Ichikawa, Yoshiaki Amano, Kenji Kamezawa, Kenichi Kikuchi, Noritsugu Matsukura
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Publication number: 20110291528Abstract: An exemplary piezoelectric vibrating device includes a piezoelectric vibrating piece that vibrates when electrically energized, a first package plate, and a second package plate. The first package plate has a respective inner main surface defining a recess. The recess has volume and dimensions sufficient to contain at least a portion of the piezoelectric vibrating piece. The inner main surface includes a peripheral main surface that peripherally extends around the recess. The second package plate has respective inner and outer main surfaces. The inner main surface is bonded to the peripheral main surface of the first package plate using a sealing material that thus seals the piezoelectric vibrating piece inside a package formed of the first and second package plates. The sealing material includes multiple concentric bands of sealing glass and multiple concentric bands of adhesive.Type: ApplicationFiled: May 27, 2011Publication date: December 1, 2011Inventor: Mitoshi Umeki
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Publication number: 20110227457Abstract: Piezoelectric vibrating pieces are disclosed having selectively roughened surfaces. An exemplary piece is made of a piezoelectric material configured as a piezoelectric substrate. The piece also includes at least one excitation electrode and at least one extraction electrode. The substrate has opposing main surfaces initially having low surface roughness. At least one main surface is formed in a mesa or reverse mesa manner, wherein the central region has a different thickness than the peripheral region. The central region has relatively low surface roughness (irregular unevenness), while the peripheral region has relatively high surface roughness. The excitation electrode is formed on the central region (mesa or reverse mesa) while the extraction electrode (connected to the excitation electrode) is formed on the peripheral region.Type: ApplicationFiled: February 18, 2011Publication date: September 22, 2011Inventors: Manabu Ishikawa, Kenji Shimao, Hiroyuki Sasaki, Mitoshi Umeki, Kenichi Kikuchi
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Publication number: 20110221309Abstract: To provide a piezoelectric resonator that suppresses spread of a conductive adhesive and is low in cost and a method of manufacturing a piezoelectric resonator. At positions, of a base 3, corresponding to electrode terminals on a crystal resonating piece 10, projection portions 41, 42 are formed by etching the base 3, and a metal film is formed on front surfaces of the above projection portions 41, 42, and the above metal films and the electrode terminals on the above-described crystal resonating piece 10 are electrically connected with a conductive adhesive 34. The conductive adhesives 34 rise on side surfaces of the above-described projection portions 41, 42 due to surface tension to bring the conductive adhesives 34 into a state where they do not easily flow outward, so that it is possible to suppress spread of the conductive adhesives 34.Type: ApplicationFiled: March 8, 2011Publication date: September 15, 2011Inventor: Mitoshi Umeki
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Patent number: 8018126Abstract: Surface-mounted piezoelectric devices are disclosed that include a package having a base and a lid made of a piezoelectric material or of glass. The package defines an internal cavity containing a tuning-fork type crystal vibrating piece having a pair of vibrating arms. The volume of the cavity is at least twelve times the volume of the pair of vibrating arms. Piezoelectric devices having these characteristics exhibit reduced CI degradation.Type: GrantFiled: August 18, 2010Date of Patent: September 13, 2011Assignee: Nihon Dempa Kogyo Co., Ltd.Inventors: Mitoshi Umeki, Takefumi Saito, Ryoichi Ichikawa
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Publication number: 20110062826Abstract: Surface-mounted piezoelectric devices are disclosed that include a package having a base and a lid made of a piezoelectric material or of glass. The package defines an internal cavity containing a tuning-fork type crystal vibrating piece having a pair of vibrating arms. The volume of the cavity is at least twelve times the volume of the pair of vibrating arms. Piezoelectric devices having these characteristics exhibit reduced CI degradation.Type: ApplicationFiled: August 18, 2010Publication date: March 17, 2011Inventors: Mitoshi Umeki, Takefumi Saito, Ryoichi Ichikawa
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Publication number: 20110062827Abstract: Methods are disclosed for manufacturing piezoelectric devices. In an exemplary method a base substrate is prepared that defines multiple device bases. Multiple cutting grooves are defined on a surface of the base substrate in a grid pattern to define therebetween the size of the devices. A frame substrate is also prepared from a piezoelectric material. The frame substrate defines multiple frames surrounding respective vibrating pieces and being alignable with respective bases in the base substrate. Also prepared is a lid substrate defining multiple lids being alignable with respective frames and bases. The three substrates are aligned and bonded together such that the frame substrate is between the lid and base substrates and the surface defining the cutting grooves faces outward. The base substrate is mounted on a dicing sheet such that cutting grooves face the dicing sheet. Cutting is performed, using a dicing blade, through the sandwich from the lid substrate to the cutting grooves.Type: ApplicationFiled: July 6, 2010Publication date: March 17, 2011Inventors: Ryoichi Ichikawa, Mitoshi Umeki
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Publication number: 20100201221Abstract: An exemplary piezoelectric vibrating device includes a piezoelectric frame that supports and surrounds a tuning-fork type piezoelectric vibrating piece having a pair of vibrating arms. The device also includes a lid and a package base that are siloxane-bonded to the frame. The lid defines at least one frequency-adjustment hole extending through the thickness dimension of the lid from an inner major surface thereof (facing the frame) to an outer major surface of the lid. The package base defines at least one through-hole electrode passing via a respective electrode through-hole through the thickness of the base from an inner major surface thereof (facing the frame) to the outer major surface thereof. The electrode is connected to the piezoelectric vibrating piece. The lid and base include external electrodes, made of an electrically conductive material, that cover the through-holes and frequency-adjustment hole(s).Type: ApplicationFiled: February 10, 2010Publication date: August 12, 2010Inventors: Takahiro Inoue, Takefumi Saito, Mitoshi Umeki, Ryoichi Ichikawa
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Publication number: 20100133958Abstract: Methods are disclosed for manufacturing piezoelectric vibrating pieces and devices including such pieces. According to an embodiment of the method, a piezoelectric vibrating piece is produced from a piezoelectric wafer. To form the piece, a profile of the piezoelectric vibrating piece is formed in a piezoelectric wafer. A first metal film (chromium; Cr) is formed on the surface of the piezoelectric piece. The chromium film is surface-oxidized to form a film having Cr foundation layer and an oxidized surface. A second metal film (gold; Au) is formed on the oxidized surface. Then, in selected regions not destined to become electrodes, the second metal film is removed, leaving electrode patterns at designated regions of the piezoelectric vibrating piece.Type: ApplicationFiled: December 3, 2009Publication date: June 3, 2010Inventors: Mitoshi Umeki, Takahiro Inoue, Yoshiaki Amano, Takefumi Saito
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Publication number: 20100084086Abstract: Methods are disclosed for manufacturing piezoelectric devices. An exemplary method comprises the step of bonding a lid wafer, a piezoelectric frame wafer (having a vibrating piece and a outer frame surrounding the vibrating piece), and a base wafer (having at least one wiring through-hole) together. A surface of a unit (typically ball-shaped) of eutectic metal is cleaned and then arranged on the through-hole. The unit of eutectic metal is then melted in a vacuum or inert gas environment to allow the eutectic metal to enter the through-hole.Type: ApplicationFiled: October 6, 2009Publication date: April 8, 2010Inventors: Ryoichi Ichikawa, Mitoshi Umeki