Patents by Inventor Mitova Radoslava

Mitova Radoslava has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus comprising a functional component likely to be thermally overloaded during the operation thereof and a system for cooling the component
    Patent number: 9754856
    Abstract: The invention relates to an apparatus comprising a functional component likely to be thermally overloaded during the operation thereof, and a system for cooling the component, comprising: a thermoelectric module comprising a cold surface and a hot surface, the cold surface being thermally coupled with the component; a heat sink thermally coupled with the hot surface of the module, the heat sink including an exchange surface with the surrounding environment and at least one cell containing a phase-change material (PCM), the PCM material contained in the cell or cells being suitable for melting when the heat released from the cold surface of the module is that of the thermally overloaded component, the exchange surface being suitable for bringing the PCM material from the molten phase to the solid phase thereof when the heat released from the cold surface of the module is that of the operational component which is not thermally overloaded.
    Type: Grant
    Filed: August 22, 2014
    Date of Patent: September 5, 2017
    Assignees: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES, SCHNEIDER ELECTRIC INDUSTRIES SAS
    Inventors: Tristan Caroff, Mitova Radoslava, Julia Simon
  • APPARATUS COMPRISING A FUNCTIONAL COMPONENT LIKELY TO BE THERMALLY OVERLOADED DURING THE OPERATION THEREOF AND A SYSTEM FOR COOLING THE COMPONENT
    Publication number: 20160233145
    Abstract: The invention relates to an apparatus comprising a functional component likely to be thermally overloaded during the operation thereof, and a system for cooling the component, comprising: a thermoelectric module comprising a cold surface and a hot surface, the cold surface being thermally coupled with the component; a heat sink thermally coupled with the hot surface of the module, the heat sink including an exchange surface with the surrounding environment and at least one cell containing a phase-change material (PCM), the PCM material contained in the cell or cells being suitable for melting when the heat released from the cold surface of the module is that of the thermally overloaded component, the exchange surface being suitable for bringing the PCM material from the molten phase to the solid phase thereof when the heat released from the cold surface of the module is that of the operational component which is not thermally overloaded.
    Type: Application
    Filed: August 22, 2014
    Publication date: August 11, 2016
    Inventors: Tristan Caroff, Mitova Radoslava, Julia Simon