Patents by Inventor Mitsuhide WATANABE

Mitsuhide WATANABE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11106255
    Abstract: In order to enhance heat reception from a cooling target object by a heat sink to efficiently cool a device, the cooling target object, a cooling device including a heat sink and a fluid path is provided. Further, the heat sink includes a heat receiving face. The fluid path is formed so as to allow a predetermined fluid to pass therethrough. The heat exchange portion includes a first path arranged approximately in parallel to the heat receiving face of the heat sink.
    Type: Grant
    Filed: October 17, 2016
    Date of Patent: August 31, 2021
    Assignee: NEC Platforms, Ltd.
    Inventor: Mitsuhide Watanabe
  • Publication number: 20170185115
    Abstract: In order to enhance heat reception from a cooling target object by a heat sink to efficiently cool a device, the cooling target object, a cooling device including a heat sink and a fluid path is provided. Further, the heat sink includes a heat receiving face. The fluid path is formed so as to allow a predetermined fluid to pass therethrough. The heat exchange portion includes a first path arranged approximately in parallel to the heat receiving face of the heat sink.
    Type: Application
    Filed: October 17, 2016
    Publication date: June 29, 2017
    Applicant: NEC Platforms, Ltd,
    Inventor: Mitsuhide WATANABE