Patents by Inventor Mitsuhiko Miyazaki

Mitsuhiko Miyazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6786386
    Abstract: A soldering iron comprises a tip end; a heater portion for electrically heating the tip end of the soldering iron; a holding portion provided at the rear end of the heater portion: a heat pipe structure provided in the holding portion; a first heat pipe holder for holding a frontal portion of the heat pipe structure to which heat generated at the heater portion is transferred; a second heat pipe holder for holding a rear part of the heat pipe structure; and a grip portion placed externally around the first heat pipe holder.
    Type: Grant
    Filed: February 1, 2002
    Date of Patent: September 7, 2004
    Assignee: Hakko Corporation
    Inventor: Mitsuhiko Miyazaki
  • Patent number: 6750431
    Abstract: A tweezer-type hand-held device for removing an electric or electronic component from a substrate is provided with a pair of contact pieces to be brought into contact with the component to grasp and heat the component and melt solder which fixes the component on the substrate. The contacts are respectively held by a pair of legs which, in turn, are interconnected with each other such that one of the legs moves toward the other with the legs and contact pieces being kept in parallel with each other.
    Type: Grant
    Filed: August 19, 2002
    Date of Patent: June 15, 2004
    Assignee: Hakko Corporation
    Inventor: Mitsuhiko Miyazaki
  • Publication number: 20040065653
    Abstract: In an iron tip for a soldering iron, composed of Fe plated copper or copper alloy, an outer surface excluding a solder coating portion in a leading end portion of the iron tip is plated with Cu in a film thickness range of approximately 10 to 50 &mgr;m, the surface is coated with a mixture of Al particles and flux, only the Al particles are melted in an inert gas atmosphere, and the surface is modified into a surface with a Cu—Al alloy coated layer having a high Al concentration. As a result, without using Cr plating, it is possible to provide an electric soldering iron having an excellent resistance to oxidation under high temperature environment and a high heat conductivity.
    Type: Application
    Filed: October 4, 2002
    Publication date: April 8, 2004
    Inventors: Takashi Uetani, Mitsuhiko Miyazaki
  • Publication number: 20040016742
    Abstract: A tweezer-type hand-held device for removing an electric or electronic component from a substrate. The device is provided with a pair of contact pieces to be brought into contact with the component to grasp and heat the component and melt solder which fixes the component on the substrate. The contacts are respectively held by a pair of legs which, in turn, are interconnected with each other such that one of the legs moves toward the other with the legs and contact pieces being kept in parallel with each other.
    Type: Application
    Filed: August 19, 2002
    Publication date: January 29, 2004
    Inventor: Mitsuhiko Miyazaki
  • Publication number: 20030146264
    Abstract: A soldering iron comprises a tip end; a heater portion for electrically heating the tip end of the soldering iron; a holding portion provided at the rear end of the heater portion: a heat pipe structure provided in the holding portion; a first heat pipe holder for holding a frontal portion of the heat pipe structure to which heat generated at the heater portion is transferred; a second heat pipe holder for holding a rear part of the heat pipe structure; and a grip portion placed externally around the first heat pipe holder.
    Type: Application
    Filed: February 1, 2002
    Publication date: August 7, 2003
    Inventor: Mitsuhiko Miyazaki
  • Publication number: 20030089696
    Abstract: An automated soldering system with an intelligent power supply that can automatically configure the power output to interchangeable soldering cartridges, where the soldering cartridges include readable information to allow the power supply to properly power the cartridge to achieve a desired, entered operating temperature. The system includes a cartridge with an identifier that contains information particular to that cartridge, a reader able to read that information, and an indicator positioned on a connector into which the cartridge is inserted.
    Type: Application
    Filed: November 14, 2001
    Publication date: May 15, 2003
    Inventors: Tetsuo Yokoyama, Mitsuhiko Miyazaki, Yoshihiro Hagihara
  • Patent number: 6563087
    Abstract: An automated soldering system with an intelligent power supply that can automatically configure the power output to interchangeable soldering cartridges, where the soldering cartridges include readable information to allow the power supply to properly power the cartridge to achieve a desired, entered operating temperature. The system includes a cartridge with an identifier that contains information particular to that cartridge, a reader able to read that information, and an indicator positioned on a connector into which the cartridge is inserted.
    Type: Grant
    Filed: November 14, 2001
    Date of Patent: May 13, 2003
    Assignee: Hakko Corporation
    Inventors: Tetsuo Yokoyama, Mitsuhiko Miyazaki, Yoshihiro Hagihara
  • Patent number: 6329641
    Abstract: A device for controlling the temperature of a soldering iron is provided with a power source circuit 1 which generates pulses having a zero volt period &tgr;; a zero cross detecting portion 2 which generates zero cross pulses on the basis of pulses; a microcomputer unit 3 which receives the zero cross pulses at an interrupt terminal INT and at the same time controls actions of the respective portions; a heater/sensor complex body 4 which heats a soldering iron tip and at the same time detects the temperature; a switching portion 5 which carries out ON and OFF actions on the basis of control signals from the microcomputer unit 3; and an amplifying portion 6 which amplifies a sensor voltage from the heater/sensor complex body 4.
    Type: Grant
    Filed: February 9, 2000
    Date of Patent: December 11, 2001
    Assignee: Hakko Corporation
    Inventors: Mitsuhiko Miyazaki, Takashi Nagase
  • Patent number: 6087631
    Abstract: A method of controlling the tip temperature of a soldering iron of the kind to which rectified commercial AC power is supplied. The tip temperature is controlled by setting a control cycle at N times the cycle of AC power and adjusting the number of supply pulses of rectified voltage during each control cycle.
    Type: Grant
    Filed: February 25, 1999
    Date of Patent: July 11, 2000
    Assignee: Hakko Corporation
    Inventor: Mitsuhiko Miyazaki
  • Patent number: 6054678
    Abstract: A heater/sensor with an electric heating coil has an insulating pipe with a bore therein has nonheating wire threaded therethrough. The nonheating wire is attached to a first end of a heating wire which is wound about the periphery of the insulating pipe. A second end of the heating wire is attached to a second nonheating wire. A first ceramic coating of a binder and a coarse grade alumina is formed on the pipe and wires through a dip process. A second ceramic coating of a binder and a fine alumina coating is formed on the first ceramic coating though a second dip process. The twice coated heater/sensor complex is secured in a soldering iron tip.
    Type: Grant
    Filed: March 12, 1998
    Date of Patent: April 25, 2000
    Assignee: Hakko Corporation
    Inventor: Mitsuhiko Miyazaki