Patents by Inventor Mitsuhiko Nakata

Mitsuhiko Nakata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cooling system for an electronic circuit device
    Patent number: 5126919
    Abstract: A cooling system includes a cooling module which has a heat transfer plate elastically biased and exposed to the flow of a coolant for transferring heat dissipated from a circuit component on a printed circuit board to the coolant, and a solder or low-melting-point metal for establishing thermal contact between the transfer plate and the circuit component.
    Type: Grant
    Filed: October 25, 1988
    Date of Patent: June 30, 1992
    Assignee: Fujitsu Limited
    Inventors: Haruhiko Yamamoto, Masahiro Suzuki, Yoshiaki Udagawa, Mitsuhiko Nakata, Koji Katsuyama, Izumi Ono, Shunichi Kikuchi
  • Liquid-cooling module system for electronic circuit components
    Patent number: 5050037
    Abstract: A printed circuit board assembly having a printed circuit board mounted, on both faces, heat generative electronic circuit components, such as integrated circuit chips, and a pair of liquid-cooling modules arranged on both sides of the printed circuit board. Each of the liquid-cooling modules is provided with a liquid cooling plate having liquid coolant supply heads and a plurality of resilient heat transfer units held by the liquid-cooling plate and arranged in compressive contact with the electronic circuit components on both faces of the printed circuit board.
    Type: Grant
    Filed: September 29, 1988
    Date of Patent: September 17, 1991
    Assignee: Fujitsu Limited
    Inventors: Haruhiko Yamamoto, Kouji Katsuyama, Mitsuhiko Nakata, Shunichi Kikuchi
  • Cooling system for an electronic circuit device
    Patent number: 4879632
    Abstract: A cooling system includes a cooling module which has a heat transfer plate elastically biased and exposed to the flow of a coolant for transferring heat dissipated from a circuit component on a printed circuit board to the coolant, and a solder or low-melting-point metal for establishing thermal contact between the transfer plate and the circuit component.
    Type: Grant
    Filed: October 3, 1986
    Date of Patent: November 7, 1989
    Assignee: Fujitsu Limited
    Inventors: Haruhiko Yamamoto, Masahiro Suzuki, Yoshiaki Udagawa, Mitsuhiko Nakata, Koji Katsuyama, Izumi Ono, Shunichi Kikuchi
  • Cooling system for an electronic circuit device
    Patent number: 4783721
    Abstract: A cooling system including a cooling module which has a heat transfer plate that is exposed to a flow of coolant and is elastically biased toward a circuit component on a printed circuit board for transferring heat dissipated by the component to the coolant, and means for guiding and preventing improper alignment of the transfer plate as the same is resiliently biased toward the circuit component. The coolant module may include a solder or low-melting-point metal for establishing thermal contact between the transfer plate and the circuit component.
    Type: Grant
    Filed: July 30, 1987
    Date of Patent: November 8, 1988
    Assignee: Fujitsu Limited
    Inventors: Haruhiko Yamamoto, Masahiro Suzuki, Yoshiaki Udagawa, Mitsuhiko Nakata, Koji Katsuyama, Izumi Ono, Shunichi Kikuchi
  • Cooling system for electronic circuit device
    Patent number: 4729060
    Abstract: A cooling module for an electronic circuit component on a printed circuit board includes a passage in which a coolant flows, a first heat transfer plate exposed to the flow of the coolant, a second heat transfer plate secured to the circuit component, a compliant member between the first and second heat transfer plates for establishing a compliant contact therebetween, and a bellows connected to the first heat transfer plate to elastically press the first heat transfer plate against the circuit component through the compliant member and the second heat transfer plate.
    Type: Grant
    Filed: January 25, 1985
    Date of Patent: March 1, 1988
    Assignee: Fujitsu Limited
    Inventors: Haruhiko Yamamoto, Masaaki Sakai, Yoshiaki Udagawa, Kouji Katsuyama, Mitsuhiko Nakata