Patents by Inventor Mitsuhiro Chida

Mitsuhiro Chida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Optical sheet manufacturing apparatus and optical sheet manufacturing method
    Patent number: 8628700
    Abstract: An optical sheet manufacturing apparatus includes a first master including a first three-dimensional structure, a second master including a second three-dimensional structure, a first processing unit to heat a first surface of a resin sheet to a first temperature and transfer the first three-dimensional structure onto the first surface heated, a second processing unit to cool the first surface to a second temperature lower than the first temperature, heat a second surface of the resin sheet to a third temperature higher than the second temperature, and transfer the second three-dimensional structure onto the second surface heated, a third processing unit to cool the second surface to a fourth temperature lower than the third temperature, a first conveyance mechanism to perform conveyance from the first processing unit to the second processing unit, and a second conveyance mechanism to perform conveyance from the second processing unit to the third processing unit.
    Type: Grant
    Filed: September 16, 2010
    Date of Patent: January 14, 2014
    Assignee: Dexerials Corporation
    Inventors: Daisuke Ito, Akihiro Horii, Hiroshi Mizuno, Noriyuki Hirai, Shunichi Kajiya, Yuu Miura, Mitsuhiro Chida, Masashi Ogawa
  • OPTICAL SHEET MANUFACTURING APPARATUS AND OPTICAL SHEET MANUFACTURING METHOD
    Publication number: 20110076394
    Abstract: An optical sheet manufacturing apparatus includes a first master including a first three-dimensional structure, a second master including a second three-dimensional structure, a first processing unit to heat a first surface of a resin sheet to a first temperature and transfer the first three-dimensional structure onto the first surface heated, a second processing unit to cool the first surface to a second temperature lower than the first temperature, heat a second surface of the resin sheet to a third temperature higher than the second temperature, and transfer the second three-dimensional structure onto the second surface heated, a third processing unit to cool the second surface to a fourth temperature lower than the third temperature, a first conveyance mechanism to perform conveyance from the first processing unit to the second processing unit, and a second conveyance mechanism to perform conveyance from the second processing unit to the third processing unit.
    Type: Application
    Filed: September 16, 2010
    Publication date: March 31, 2011
    Applicant: SONY CORPORATION
    Inventors: Daisuke Ito, Akihiro Horii, Hiroshi Mizuno, Noriyuki Hirai, Shunichi Kajiya, Yuu Miura, Mitsuhiro Chida, Masashi Ogawa