Abstract: An electronic device package comprises an electrical device disposed on a base substrate, a conductive column in electrical communication with the electrical device and having a first end bonded to the base substrate, a cap substrate disposed over the electrical device and bonded to a second end of the conductive column, a layer of organic dielectric buffer coat material on the lower surface of the base substrate, a through substrate via in electrical communication with the conductive column and passing through the base substrate and the layer of organic dielectric buffer coat material, a redistribution layer disposed on the layer of organic dielectric buffer coat material, and a contact pad formed on the redistribution layer and in electrical communication with the through substrate via through the redistribution layer, the contact pad being horizontally displaced from a position directly below the through substrate via.

Abstract: Aspects of this disclosure relate to methods of manufacturing bulk acoustic wave components. Such methods include plasma dicing to singulate individual bulk acoustic wave components. A buffer layer can be formed over a substrate of bulk acoustic wave components such that streets are exposed.

Abstract: A controller is able to, in a case where the controller receives a correction instruction for image density, execute a phase detection mode for detecting a phase of an image bearing member and detecting a phase of a developer bearing member and change an image forming condition for an image forming unit during an image formation mode based on respective phases of the image bearing member and the developer bearing member detected in the phase detection mode and an image density of a toner pattern, and a ratio of a circumferential velocity of the developer bearing member to a circumferential velocity of the image bearing member during the phase detection mode is different from a ratio of a circumferential velocity of the developer bearing member to a circumferential velocity of the image bearing member during the image formation mode.

Abstract: Aspects of this disclosure relate to methods of manufacturing bulk acoustic wave components. Such methods include plasma dicing to singulate individual bulk acoustic wave components. A buffer layer can be formed over a substrate of bulk acoustic wave components such that streets are exposed. The bulk acoustic wave components can be plasma diced along the exposed streets to thereby singulate the bulk acoustic wave components.

Abstract: An image forming apparatus to execute an image forming operation for forming an image includes an image bearing member, a development unit, a drive unit, a controller, and a humidity detection unit to detect humidity near the development unit. The development unit contains developer and includes a conveyance member to convey the developer and a developer carrying member to carry the developer to a position where an electrostatic latent image formed on the image bearing member is developed. The controller controls the conveyance and the developer carrying member through the drive unit not to execute a mode for driving the conveyance and the developer carrying member without executing the image forming operation when the humidity detected when power of the image forming apparatus is shifted from off to on is higher than a predetermined value, and to execute the mode when the detected humidity falls below the predetermined value afterward.

Abstract: A developing apparatus for developing a latent image formed on an image bearing member includes a developer carrying member configured to carry a developer including toner and magnetic carrier and including a developer carrying surface having a plurality of grooves, a magnet, provided inside the developer carrying member, configured to attract the developer on the developing carrying surface, and a regulating member, provided spaced from the developer carrying member and configured to regulate an amount of the developer carried on the developer carrying surface.

Abstract: A stacked filter package is disclosed. The stacked filter package can include a first acoustic wave device having a first device type. The first acoustic wave device includes a first substrate having a first coefficient of thermal expansion. The stacked filter package can include a second acoustic wave device having a second device type different from the first device type. The second acoustic wave device includes a second substrate having a second coefficient of thermal expansion. The second coefficient of thermal expansion is at least double the first coefficient of thermal expansion. The stacked filter package can include a bonding structure between the first and second substrates. The bonding structure couples the first and second substrate.

Abstract: A combined acoustic wave device package is provided comprising: a first substrate having a bulk acoustic wave (BAW) resonator formed thereon; a second substrate having a surface acoustic wave (SAW) resonator formed thereon; and at least one bonding element connecting the first substrate and second substrate. A method for forming such a combined acoustic wave device package is also provided. A radio frequency (RF) device comprising such a combined acoustic wave device package, and a wireless device comprising an antenna and a such a combined acoustic wave device package are also provided.

Abstract: An electronic device package comprises an electrical device disposed on a base substrate, a conductive column in electrical communication with the electrical device and having a first end bonded to the base substrate, a cap substrate disposed over the electrical device and bonded to a second end of the conductive column, a layer of dielectric material disposed on the lower surface of the base substrate, a through substrate via in electrical communication with the conductive column and passing through the base substrate and the layer of dielectric material, a redistribution layer disposed on the layer of dielectric material, and a contact pad formed on the redistribution layer and in electrical communication with the through substrate via through the redistribution layer, the contact pad being horizontally displaced from a position directly below the through substrate via.

Abstract: A method of marking information on a substrate for use in a semiconductor component is provided. The method comprises providing a substrate for use in a semiconductor component, providing a metal layer on a surface of the substrate, and providing a marking within the metal layer. A method of making a die, a radio-frequency module and a wireless mobile device; as well as a substrate, a die, a radio-frequency module and a wireless mobile device is also provided.

Abstract: Aspects of this disclosure relate to methods of manufacturing bulk acoustic wave components. Such methods include plasma dicing to singulate individual bulk acoustic wave components. A buffer layer can be formed over a substrate of bulk acoustic wave components such that streets are exposed.

Abstract: A controller is able to, in a case where the controller receives a correction instruction for image density, execute a phase detection mode for detecting a phase of an image bearing member and detecting a phase of a developer bearing member and change an image forming condition for an image forming unit during an image formation mode based on respective phases of the image bearing member and the developer bearing member detected in the phase detection mode and an image density of a toner pattern, and a ratio of a circumferential velocity of the developer bearing member to a circumferential velocity of the image bearing member during the phase detection mode is different from a ratio of a circumferential velocity of the developer bearing member to a circumferential velocity of the image bearing member during the image formation mode.

Abstract: A packaged acoustic wave component is disclosed. The packaged acoustic wave component can include a first acoustic wave resonator that includes a first interdigital transducer electrode that is positioned over a first piezoelectric layer. The packaged acoustic wave component can also include a second acoustic wave resonator including a second interdigital transducer electrode positioned over a second piezoelectric layer. The second piezoelectric layer is bonded to the first piezoelectric layer. The packaged acoustic wave component can further include a stopper structure that is positioned over the first piezoelectric layer. The first stopper structure is positioned above a via and extends through the first piezoelectric layer. The stopper structure is in electrical communication with the first interdigital transducer electrode and includes a material which reflects at least fifty percent of light having a wavelength of 355 nanometers.

Abstract: A developer carrying member of a developer apparatus includes a developer carrying surface having a plurality of grooves, wherein a depth D (mm) of the grooves, a width W (mm) of the grooves, and a volume average particle diameter of the magnetic carrier D50 (mm) satisfy, D (mm)>D50 (mm)×½, and W (mm)>D50 (mm), a magnet, provided inside the developer carrying member, attracts the developer on the developing carrying surface, and a regulating member, provided spaced from the developer carrying member, regulates an amount of the developer carried on the developer carrying surface. An amount M/S (mg/mm2) of the developer carried on a unit area of the developer carrying surface after passing by the regulating member, a gap SB (mm) between a free end of the regulating member and the developer carrying member, a density G (mg/mm3) of the developer, and a groove ratio ? which is a ratio of the grooves in the developer carrying surface satisfy, 0.1?M/S (mg/mm2)?0.45, 0.

Abstract: An electronic component comprises a substrate including a main surface on which a functional unit is formed and a cap layer defining a cavity enclosing and covering the functional unit. The cap layer is provided with holes communicating an inside of the cavity with an outside of the cavity. A resin layer covers the cap layer and the main surface and includes one or more bores and a solder layer having a thickness less than a thickness of the resin layer disposed within the one or more bores.

Abstract: Aspects of this disclosure relate to methods of manufacturing bulk acoustic wave components. Such methods include plasma dicing to singulate individual bulk acoustic wave components. A buffer layer can be formed over a substrate of bulk acoustic wave components such that streets are exposed.

Abstract: A packaged acoustic wave component includes a device substrate and an acoustic wave device mounted on the device substrate. A peripheral wall is attached to the device substrate and surrounds the acoustic wave device. A cap substrate is attached to the peripheral wall and spaced above the device substrate. The cap substrate has a marking layer disposed on a bottom surface of the cap substrate that is disposed above and faces the acoustic wave device. The marking layer is configured to receive one or more markings thereon.

Abstract: A method for manufacturing a packaged acoustic wave component includes forming or providing a cap substrate, forming a metal layer on a surface of the cap substrate, marking the metal layer with one or more indicia and bonding the cap substrate to a device substrate that has an acoustic wave device on a surface thereof. The metal layer is paced from and faces the acoustic wave device.

Abstract: A packaged acoustic wave component has an acoustic wave device mounted on a device substrate and a cap substrate spaced above the device substrate. The packaged acoustic wave component also has a shield structure including a metal plate disposed on a bottom surface of the cap substrate that faces the device substrate, the metal plate being spaced above the acoustic wave device, and a peripheral metal wall attached to the metal plate that extends to the device substrate. The shield structure encloses and electrically shields the acoustic wave device.

Abstract: A method of manufacturing a packaged acoustic wave component includes forming or providing a cap substrate. The method also includes forming a metal shield plate on a surface of the cap substrate. The cap substrate is attached to a device substrate that has an acoustic wave device on a surface thereof such that the metal shield plate is spaced from and faces the acoustic wave device and so that a peripheral metal wall extends between the device substrate and the metal plate. The metal shield plate and peripheral metal wall enclose and electrically shield the acoustic wave device.