Abstract: A wire harness is arranged between a vehicle body and a sliding door in a vehicle, in which: a protector is mounted on a bent region of the wire harness having a shape in which a middle of the wire harness in a longitudinal direction is bent in a crank shape; the protector includes a groove having a shape corresponding to the bent shape of the wire harness and has a larger width than a radial size of the wire harness; a bottom surface of the groove has a hole into which a pin is detachably inserted, the pin constraining the wire harness in a state where the wire harness has looseness so as not to contact an inner angle portion at a bent site of the groove; and one side of the bent region of the wire harness is fixed to the protector using a fastening member.

Abstract: A display device driving circuit comprising a thin film transistor array in combination with a charge capacitor and its manufacturing method in which the charge capacitor is formed over an address line for addressing the thin film transistor by depositing first an insulating layer over the address line and then a semiconductor layer. The semiconductor layer is etched to form a protective island. The protective island protects the insulating layer integrity during subsequent etching processes. An upper electrode is formed over the semiconductor layer to complete the charge capacitor. The protection of the insulating layer during subsequent manufacturing steps results in substantially uniform charge capacitors for each TFT in the driving circuit.

Abstract: A display device driving circuit comprising a thin film transistor array in combination with a charge capacitor and its manufacturing method in which the charge capacitor is formed over an address line for addressing the thin film transistor by depositing first an insulating layer over the address line and then a semiconductor layer. The semiconductor layer is etched to form a protective island. The protective island protects the insulating layer integrity during subsequent etching processes. An upper electrode is formed over the semiconductor layer to complete the charge capacitor. The protection of the insulating layer during subsequent manufacturing steps results in substantially uniform charge capacitors for each TFT in the driving circuit.

Abstract: A liquid crystal display unit including a plurality of subpixels in each pixel provides superior gradation over a wide viewing angle, and is produced with no increase in manufacturing cost and no deterioration of desired properties (such as reduction in brightness, contrast and response). No additional manufacturing step is required since a control capacitor electrode is formed at the same time as source and drain electrodes constituting a thin-film transistor. By controlling the ratio of display area and the difference in applied voltage of the subpixels, preferable viewing angle properties are obtained. The display properties at the boundary of subpixels are improved by controlling the gap width and the direction of boundary of the subpixels, thus providing a bright display.

Abstract: In an active matrix liquid crystal display, common electrodes and pixel electrodes are respectively formed parallel to each other and have substantially herringbone shapes. Areas of first display regions formed between the common electrodes and the pixel electrodes and disposed at one side of the inflection points of the herringbone shapes are substantially the same as those of second display regions disposed at the other side. When electric fields substantially parallel to surface of an array substrate are applied between the pixel electrodes and the common electrodes, orientations of liquid crystal molecules in the first and second display regions move in opposite directions. Coloring of image corresponding to angle of view due to the movement of the orientation of the liquid crystal molecules is compensated.

Abstract: A liquid crystal display (LCD) panel includes a short-circuit ring formed of aluminum or an aluminum alloy during manufacture. The short-circuit ring is formed along a gate wiring line or a source wiring line. After the panel is inspected for defects, the short-circuit ring is removed. In the LCD manufacturing process, a glass substrate is cut outside the short-circuit ring made of aluminum, and thereafter the short-circuit ring is removed by grinding the short-circuit ring while spraying water having a low resistance on the substrate. The water may include carbon dioxide gas. Low resistance aluminum may be used as the gate wiring line and the short-circuit ring. This aluminum material, which is used as a current supply wiring line, can be subjected to an anodic oxidation process. Thus, it is not necessary to form a film of any metal other than aluminum. This can simplify or reduce the number of fabrication processes.

Abstract: A liquid crystal display unit including a plurality of subpixels in each pixel provides superior gradation over a wide viewing angle, and is produced with no increase in manufacturing cost and no deterioration of desired properties (such as reduction in brightness, contrast and response). No additional manufacturing step is required since a control capacitor electrode is formed at the same time as source and drain electrodes constituting a thin-film transistor. By controlling the ratio of display area and the difference in applied voltage of the subpixels, preferable viewing angle properties are obtained. The display properties at the boundary of subpixels are improved by controlling the gap width and the direction of boundary of the subpixels, thus providing a bright display.

Abstract: An active matrix substrate in which signals are inputted by a drive IC to a plurality of gate wirings made of aluminum or the like so as to drive a plurality of pixel electrodes such that an image is formed, said active matrix substrate comprising: a drive IC mounting portion which is formed together with the pixel electrodes on a principal face of a substrate by an indium-tin-oxide (ITO) film identical with that forming the pixel electrodes; wherein the gate wirings are disposed on the ITO film of the drive IC mounting portion so as to be directly connected to the ITO film.