Abstract: A method for manufacturing a wrinkled plate which can control a shape of wrinkles formed on a surface of the wrinkled plate and a wrinkled plate which is manufactured by the method are provided. The method for manufacturing a wrinkled plate la includes the steps of: placing an unhardened clay 5 having irregularities embossed on a surface thereof on an upper surface of a rubber sheet 4 in a stretched state in an overlapping manner; forming wrinkles 2 at least on a surface of the clay 5 by shrinking the rubber sheet 4; and hardening the clay 5 by baking.

Abstract: A method of stably producing a ceramic sheet with good quality, where the tip portions of convex parts constituting numerous wrinkles on the surface of the ceramic sheet are not in contact with each other, and concave parts are open. To produce the ceramic sheet, clay is placed on the upper surface of a stretched rubber sheet, and the upper surface of the clay is covered by a surface layer made from a material that burns when the clay is baked. The rubber sheet is contracted to form wrinkles on the upper surface of the clay and the surface layer. The clay is baked and the surface layer is made to disappear by burning to obtain the ceramic sheet. Thus, the surface layer prevents the tips of the convex parts constituting the wrinkles from being in direct contact with each other.

Abstract: The invention relates to a wiring board comprising a board having an electrode and being coated with an insulation layer with a hole for exposing the electrode; a wiring comprising a Cr or Ti layer, which is connected to the electrode and closely contacts with the insulation layer, and of a Cu layer which is closely contacts with the Cr or Ti layer; a protective film which covers the wiring and is provided with another hole for soldering; and a solder for the outer connection which is mounted in the both holes and brought to diffuse into the Cu layer to produce an alloy, and brought to reach the Cr or Ti layer thereby connecting the solder to the Cr or Ti layer.

Abstract: The invention relates to a wiring board comprising a board having an electrode and being coated with an insulation layer with a hole for exposing the electrode; a wiring comprising a Cr or Ti layer, which is connected to the electrode and closely contacts with the insulation layer, and of a Cu layer which is closely contacts with the Cr or Ti layer; a protective film which covers the wiring and is provided with another hole for soldering; and a solder for the outer connection which is mounted in the both holes and brought to diffuse into the Cu layer to produce an alloy, and brought to reach the Cr or Ti layer thereby connecting the solder to the Cr or Ti layer.

Abstract: A method of stably producing a ceramic sheet with good quality, where the tip portions of convex parts constituting numerous wrinkles on the surface of the ceramic sheet are not in contact with each other, and concave parts are open. To produce the ceramic sheet, clay is placed on the upper surface of a stretched rubber sheet, and the upper surface of the clay is covered by a surface layer made from a material that burns when the clay is baked. The rubber sheet is contracted to form wrinkles on the upper surface of the clay and the surface layer. The clay is baked and the surface layer is made to disappear by burning to obtain the ceramic sheet. Thus, the surface layer prevents the tips of the convex parts constituting the wrinkles from being in direct contact with each other.

Abstract: The invention relates to a wiring board comprising a board having an electrode and being coated with an insulation layer with a hole for exposing the electrode; a wiring comprising a Cr or Ti layer, which is connected to the electrode and closely contacts with the insulation layer, and of a Cu layer which is closely contacts with the Cr or Ti layer; a protective film which covers the wiring and is provided with another hole for soldering; and a solder for the outer connection which is mounted in the both holes and brought to diffuse into the Cu layer to produce an alloy, and brought to reach the Cr or Ti layer thereby connecting the solder to the Cr or Ti layer.

Abstract: There are provided a high density and low manufacturing cost wiring board with high reliability in connection, a semiconductor device and a producing method therefor. The invention relates to a wiring board comprising a board having an electrode and being coated with an insulation layer with a hole for exposing the electrode; a wiring consisting of a Cr or Ti layer, which is connected to the electrode and closely contacts with the insulation layer, and of a Cu layer which is closely contacts with the Cr or Ti layer; a protective film which covers the wiring and is provided with another hole for soldering; and a solder for the outer connection which is mounted in the both holes and brought to diffuse into the Cu layer to produce an alloy, and brought to reach the Cr or Ti layer thereby connecting the solder to the Cr or Ti layer.

Abstract: There are provided a high density and low manufacturing cost wiring board with high reliability in connection, a semiconductor device and a producing method therefor. The invention relates to a wiring board comprising a board having an electrode and being coated with an insulation layer with a hole for exposing the electrode; a wiring consisting of a Cr or Ti layer, which is connected to the electrode and closely contacts with the insulation layer, and of a Cu layer which is closely contacts with the Cr or Ti layer; a protective film which covers the wiring and is provided with another hole for soldering; and a solder for the outer connection which is mounted in the both holes and brought to diffuse into the Cu layer to produce an alloy, and brought to reach the Cr or Ti layer thereby connecting the solder to the Cr or Ti layer.

Abstract: There are provided a high density and low manufacturing cost wiring board with high reliability in connection, a semiconductor device and a producing method therefor.The invention relates to a wiring board comprising a board having an electrode and being coated with an insulation layer with a hole for exposing the electrode; a wiring consisting of a Cr or Ti layer, which is connected to the electrode and closely contacts with the insulation layer, and of a Cu layer which is closely contacts with the Cr or Ti layer; a protective film which covers the wiring and is provided with another hole for soldering; and a solder for the outer connection which is mounted in the both holes and brought to diffuse into the Cu layer to produce an alloy, and brought to reach the Cr or Ti layer thereby connecting the solder to the Cr or Ti layer.