Abstract: A semiconductor device according to an embodiment is attached to a radiator and includes a heat-generating electronic component, a sealing part sealing the electronic component, a lead member that includes an inner lead part sealed with the sealing part and an outer lead part exposed from the sealing part, and a lead member that includes an inner lead part sealed with the sealing part and an outer lead part exposed from the sealing part. The inner lead part has a heat-dissipating end part that releases heat propagating from the outer lead part to the radiator and an electrical connecting part that is positioned between the heat-dissipating end part and the outer lead part and is electrically connected to the main electrode of the electronic component.

Abstract: A semiconductor device according to an embodiment is attached to a radiator and includes a heat-generating electronic component, a sealing part sealing the electronic component, a lead member that includes an inner lead part sealed with the sealing part and an outer lead part exposed from the sealing part, and a lead member that includes an inner lead part sealed with the sealing part and an outer lead part exposed from the sealing part. The inner lead part has a heat-dissipating end part that releases heat propagating from the outer lead part to the radiator and an electrical connecting part that is positioned between the heat-dissipating end part and the outer lead part and is electrically connected to the main electrode of the electronic component.

Abstract: A semiconductor device includes a device main body that is semi-annular, the device main body having an inner circumferential surface formed arcuate in plan view and an outer circumferential surface formed arcuate in plan view. Cutout portions are formed on a first end surface, on one end side, in a circumferential direction, of the device main body and a second end surface, on an other end side, in the circumferential direction, of the device main body. The cutout portions are used for inserting screws for fixing the device main body to a base portion.

Abstract: A semiconductor device of the present invention includes: a substrate (12) that is annular or partially annular, the substrate (12) having an inner circumferential portion (20) formed arcuate in plan view and an outer circumferential portion (21) formed arcuate in plan view; a circuit unit (13) provided on the substrate (12), the circuit unit (13) being configured to individually control a plurality of phases of a motor; and a sealing resin (18) that is circular annular or partially circular annular and is concentric to the substrate (12), the sealing resin (18) surrounding the substrate (12).

Abstract: A semiconductor device includes: an annular or partially annular substrate; a first control circuit provided on the substrate and configured to control a first phase of a motor; a second control circuit provided on the substrate so as to be adjacent to the first control circuit in a circumferential direction of the substrate and configured to control a second phase of the motor; a power supply wiring disposed on one of outer and inner circumferential sides of the first and second control circuits in a radial direction of the substrate, the power supply wiring being connected to the first and second control circuits, and extending in the circumferential direction; and a ground winding disposed on another one of the outer and inner circumferential sides of the first and second control circuits in the radial direction, being connected to the first and second control circuits, and extending in the circumferential direction.

Abstract: A semiconductor device includes: a device main body that is annular or partially annular, the device main body having an inner circumferential surface formed arcuate in plan view and an outer circumferential surface formed arcuate in plan view; a plurality of first leads that are strip-shaped, the plurality of first leads protruding from the inner circumferential surface and being arranged at intervals in a circumferential direction of the inner circumferential surface; and a plurality of second leads that are strip-shaped, the plurality of second leads protruding from the outer circumferential surface and being arranged at intervals in a circumferential direction of the outer circumferential surface. A dimension, in a width direction, of the second lead along the circumferential direction is larger than a dimension, in a width direction, of the first lead along the circumferential direction.

Abstract: A semiconductor device of the present invention includes: a substrate (12) that is annular or partially annular; a first phase control circuit (14) provided on the substrate (12), the first phase control circuit being configured to control a first phase of a plurality of phases of a motor; a second phase control circuit (15) provided on the substrate (12) so as to be adjacent to the first phase control circuit (14) in a circumferential direction of the substrate (12), the second phase control circuit (15) being configured to control a second phase of the plurality of phases of the motor, the second phase being different from the first phase; a power supply wiring (18) disposed on one of an outer circumferential side and an inner circumferential side of the first phase control circuit (14) and the second phase control circuit (15) in a radial direction of the substrate (12), the power supply wiring (18) being connected to the first phase control circuit (14) and the second phase control circuit (15), and the p

Abstract: A semiconductor device of the present invention includes: a substrate (12) that is annular or partially annular, the substrate (12) having an inner circumferential portion (20) formed arcuate in plan view and an outer circumferential portion (21) formed arcuate in plan view; a control unit (13) provided on the substrate (12), the control unit (13) being configured to individually control a plurality of phases of a motor; and a sealing resin (18) that is circular annular or partially circular annular and is concentric to the substrate (12), the sealing resin (18) surrounding the substrate (12).

Abstract: A semiconductor device includes a device main body that is semi-annular, the device main body having an inner circumferential surface formed arcuate in plan view and an outer circumferential surface formed arcuate in plan view. Cutout portions are formed on a first end surface, on one end side, in a circumferential direction, of the device main body and a second end surface, on an other end side, in the circumferential direction, of the device main body. The cutout portions are used for inserting screws for fixing the device main body to a base portion.

Abstract: The invention provides a compressor swash plate which is lead-free and is able to demonstrate a superior durability. A compressor swash plate in the invention includes a base member and a sliding layer being formed on the surface of the base member and constituting at least a sliding surface for allowing a shoe to slide thereon. The sliding layer is formed by thermal spraying Cu-based-MnS by HVOF thermal spraying method. A method of manufacturing the compressor swash plate according to the invention includes a step of thermal spraying powder formed of Cu-based-MnS onto the base member by the HVOF thermal spraying method to form the sliding layer which constitutes at least the sliding surface which allows the shoe to slide thereon on the base member. More specifically, the Cu-based-MnS is Cu-Ni-MnS.

Abstract: A management method for fiber-processing and a management apparatus thereof, which can detect the occurrences of the selected monitoring events by monitoring the occurrences, can investigate the causes of the occurrences of the events by treating the events so that the factors of the occurrences of the problems can be easily determined whether they are attributable to the problem of the fiber-processing machine itself or the problem of supplied yarn, and can promptly accurately present countermeasures against the problems.

Abstract: A yarn breakage position detecting device and method of detecting a yarn breakage position involves a running yarn tension detector arranged at a reference position and that outputs a tension signal by which occurrence of yarn breakage is detected, and passage of the end of a broken yarn through the reference position is then calculated based on the time period from occurrence of yarn breakage to passage of the broken yarn end through the reference position. The yarn breakage time is stored as a time at which the tension signal becomes a peak value and/or a time at which the tension signal begins to decrease below a steady state tension value. The time when the yarn passes through the reference position is stored as a time at which the tension signal becomes lower than a lower limit value and/or a time at which natural oscillation begins.

Abstract: Yarn breakage position detecting method and device. The device includes a tension detector arranged at a reference position, to monitor tension of a running yarn, so that from a tension signal output by the tension detector, occurrence of yarn breakage is first detected and passage of the end of a broken yarn through the reference position is then detected. The yarn breakage position is calculated based on the time period from occurrence of yarn breakage to passage of the broken yarn end through the reference position. The time when the yarn is broken is stored as a time at which the tension signal becomes a peak value and/or a time at which the tension signal begins to decrease below a steady state tension value. The time when the yarn passes through the reference position is stored as a time at which the tension signal becomes lower than a lower limit value and/or a time at which natural oscillation begins.

Abstract: A management method for fiber-processing and a management apparatus thereof, which can detect the occurrences of the selected monitoring events by monitoring the occurrences, can investigate the causes of the occurrences of the events by treating the events so that the factors of the occurrences of the problems can be easily determined whether they are attributable to the problem of the fiber-processing machine itself or the problem of supplied yarn, and can promptly accurately present countermeasures against the problems.

Abstract: A thermal spray coating method comprising producing a high speed flame from a combustion gas and spraying a thermal spray coating material powder onto the surface of a base material by using the high speed flame to form a coating on the surface of the base material. The thermal spray coating material powder is a mixed powder comprising (A) 98-70% in volume of Cu based lead bronze alloy powder and (b) 2-30% in volume of Al powder or Al based alloy powder.