Patents by Inventor Mitsuo Ebisawa

Mitsuo Ebisawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11691210
    Abstract: By a method of determining the state of an iron tip according to the present invention, in a soldering device including: an iron tip that includes a solder hole into which a solder piece is supplied and that heats and melts the solder piece in the solder hole; a gas supply source that supplies a gas; and a gas supply portion that makes the gas supply source communicate with the solder hole and that supplies the gas from the gas supply source into the solder hole, the total flow rate of the gas flowing through the gas supply portion or a supply pressure is constant, a physical quantity of the gas flowing within the gas supply portion is measured and the measured physical quantity is compared with a previously provided reference value or table such that the state of the iron tip is determined. In this way, it is possible to constantly accurately determine the state of the iron tip.
    Type: Grant
    Filed: October 24, 2017
    Date of Patent: July 4, 2023
    Assignee: AND CO., LTD.
    Inventor: Mitsuo Ebisawa
  • Patent number: 11400534
    Abstract: A solder processing method according to one or more embodiments may include: sequentially supplying at least two solder pieces into a substantially tubular iron tip that is extended vertically, such that the at least two solder pieces are erected within the iron tip in such a manner that on the solder piece which is first supplied, the solder piece which is subsequently supplied rides; and heating the substantially tubular iron tip in a state where the at least two solder pieces are erected within the iron tip in such a manner that on the solder piece which is first supplied, the solder piece which is subsequently supplied rides, to melt the flux to be flown out from at least one of the at least two solder pieces to a space between an inner wall of the iron tip and the at least two solder pieces.
    Type: Grant
    Filed: June 12, 2020
    Date of Patent: August 2, 2022
    Assignee: AND Co., Ltd.
    Inventor: Mitsuo Ebisawa
  • Patent number: 11207743
    Abstract: In a solder processing device (A) which includes: a substantially tubular iron tip (5) that can be heated and that is extended vertically; and a solder piece supply portion (2, 6) that supplies a solder piece (Wh) from above into the iron tip (5), and in which the heat of the iron tip (5) is used to melt the solder piece (Wh) such that the molten solder is supplied downward, the supplied solder piece (Wh) is forcefully brought into contact with the inner wall of the iron tip (5). In this way, it is possible to more reliably heat and melt the solder piece (Wh) by use of the heat of the iron tip (5).
    Type: Grant
    Filed: March 25, 2016
    Date of Patent: December 28, 2021
    Assignee: AND Co., Ltd.
    Inventor: Mitsuo Ebisawa
  • Publication number: 20200343036
    Abstract: An example inductor comprises multiple coil parts and each formed by flatwise-winding layers of turns of a flat wire arranged in a radial direction with gaps between each of the layers, and the multiple coil parts are arranged in an axial direction with a clearance. There is provided a clearance between the multiple coil parts, through which air flows, achieving improvement in heat dissipation.
    Type: Application
    Filed: January 17, 2019
    Publication date: October 29, 2020
    Inventors: Masayuki Nakahama, Kosuke Maeda, Mitsuo Ebisawa, Manabu Ishitobi
  • Patent number: 10792747
    Abstract: A substantially tubular iron tip (5) that can be heated and that is extended vertically and a solder piece supply portion that supplies a first solder piece (Wh1) and a second solder piece (Wh2) in which a layer of a flux (72) is provided within a tubular solder layer in this order from above into the iron tip are provided, within the iron tip, the solder pieces are erected such that on the first solder piece, the second solder piece rides and the heat of the iron tip is used to melt the first solder piece and the second solder piece such that the molten solder is supplied downward. In this way, it is possible to more reliably heat and melt the solder pieces in a posture in which they are erected within the iron tip.
    Type: Grant
    Filed: March 15, 2016
    Date of Patent: October 6, 2020
    Assignee: AND Co., Ltd.
    Inventor: Mitsuo Ebisawa
  • Publication number: 20200306855
    Abstract: A solder processing method according to one or more embodiments may include: sequentially supplying at least two solder pieces into a substantially tubular iron tip that is extended vertically, such that the at least two solder pieces are erected within the iron tip in such a manner that on the solder piece which is first supplied, the solder piece which is subsequently supplied rides; and heating the substantially tubular iron tip in a state where the at least two solder pieces are erected within the iron tip in such a manner that on the solder piece which is first supplied, the solder piece which is subsequently supplied rides, to melt the flux to be flown out from at least one of the at least two solder pieces to a space between an inner wall of the iron tip and the at least two solder pieces.
    Type: Application
    Filed: June 12, 2020
    Publication date: October 1, 2020
    Applicant: AND Co., Ltd.
    Inventor: Mitsuo EBISAWA
  • Publication number: 20190262925
    Abstract: By a method of determining the state of an iron tip according to the present invention, in a soldering device including: an iron tip that includes a solder hole into which a solder piece is supplied and that heats and melts the solder piece in the solder hole; a gas supply source that supplies a gas; and a gas supply portion that makes the gas supply source communicate with the solder hole and that supplies the gas from the gas supply source into the solder hole, the total flow rate of the gas flowing through the gas supply portion or a supply pressure is constant, a physical quantity of the gas flowing within the gas supply portion is measured and the measured physical quantity is compared with a previously provided reference value or table such that the state of the iron tip is determined. In this way, it is possible to constantly accurately determine the state of the iron tip.
    Type: Application
    Filed: October 24, 2017
    Publication date: August 29, 2019
    Inventor: Mitsuo EBISAWA
  • Publication number: 20180065201
    Abstract: In a solder processing device (A) which includes: a substantially tubular iron tip (5) that can be heated and that is extended vertically; and a solder piece supply portion (2, 6) that supplies a solder piece (Wh) from above into the iron tip (5), and in which the heat of the iron tip (5) is used to melt the solder piece (Wh) such that the molten solder is supplied downward, the supplied solder piece (Wh) is forcefully brought into contact with the inner wall of the iron tip (5). In this way, it is possible to more reliably heat and melt the solder piece (Wh) by use of the heat of the iron tip (5).
    Type: Application
    Filed: March 25, 2016
    Publication date: March 8, 2018
    Applicant: AND Co., Ltd.
    Inventor: Mitsuo EBISAWA
  • Publication number: 20180056423
    Abstract: A substantially tubular iron tip (5) that can be heated and that is extended vertically and a solder piece supply portion that supplies a first solder piece (Wh1) and a second solder piece (Wh2) in which a layer of a flux (72) is provided within a tubular solder layer in this order from above into the iron tip are provided, within the iron tip, the solder pieces are erected such that on the first solder piece, the second solder piece rides and the heat of the iron tip is used to melt the first solder piece and the second solder piece such that the molten solder is supplied downward. In this way, it is possible to more reliably heat and melt the solder pieces in a posture in which they are erected within the iron tip.
    Type: Application
    Filed: March 15, 2016
    Publication date: March 1, 2018
    Applicant: AND Co., Ltd.
    Inventor: Mitsuo EBISAWA
  • Patent number: 7323055
    Abstract: There is provided an extrusion head that is capable of largely increasing a production speed rather than a conventional head that extrudes supplies a high viscous melt-coating composition.
    Type: Grant
    Filed: January 28, 2003
    Date of Patent: January 29, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroyuki Ogino, Shigeki Ueda, Hiroshi Fukuda, Tooru Sugimori, Mitsuo Ebisawa
  • Patent number: 7199508
    Abstract: The invention provides a defect inspecting apparatus and a defect detecting method for specifying a position of a defect before polarization when the defect is included in a coaxial flexible piezoelectric member. Further, when a piezoelectric tube is moved in polarization, a friction force is produced between the coaxial flexible piezoelectric member and a block-like conductor and therefore, a large force is needed in moving the piezoelectric tube. The invention provides a polarizing apparatus and a polarizing method capable of moving the piezoelectric tube even by a small force. There are provided a defect detecting apparatus of a coaxial flexible piezoelectric member having a constitution of applying a direct current to a coaxial flexible piezoelectric member while moving a piezoelectric tube arranged at a hole of inspecting electrode means and a marking apparatus for marking a defect portion.
    Type: Grant
    Filed: August 1, 2002
    Date of Patent: April 3, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Mitsuo Ebisawa, Takeshi Nagai, Tooru Sugimori
  • Publication number: 20040251772
    Abstract: The invention provides a defect inspecting apparatus and a defect detecting method for specifying a position of a defect before polarization when the defect is included in a coaxial flexible piezoelectric member. Further, when a piezoelectric tube is moved in polarization, a friction force is produced between the coaxial flexible piezoelectric member and a block-like conductor and therefore, a large force is needed in moving the piezoelectric tube. The invention provides a polarizing apparatus and a polarizing method capable of moving the piezoelectric tube even by a small force.
    Type: Application
    Filed: January 30, 2004
    Publication date: December 16, 2004
    Inventors: Mitsuo Ebisawa, Takeshi Nagai, Tooru Sugimori
  • Publication number: 20030152658
    Abstract: There is provided an extrusion head that is capable of largely increasing a production speed rather than a conventional head that extrudes supplies a high viscous melt-coating composition.
    Type: Application
    Filed: January 28, 2003
    Publication date: August 14, 2003
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroyuki Ogino, Shigeki Ueda, Hirosi Fukuda, Tooru Sugimori, Mitsuo Ebisawa
  • Patent number: 6593681
    Abstract: A polarization apparatus is provided wherein a piezoelectric body tube 3 is wound around a first rotation drum 5 and a second rotation drum 6 and a coaxial flexible piezoelectric body 2 is polarized while the piezoelectric body tube 3 is wound. According to the polarization apparatus, polarization can be conducted except for the coaxial flexible piezoelectric body 2 of the portion containing a defect and a defect existing in the piezoelectric body tube 3 of a given length can also be detected before an outer electrode 4 is formed.
    Type: Grant
    Filed: December 12, 2001
    Date of Patent: July 15, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Mitsuo Ebisawa, Takeshi Nagai, Narutoshi Kanazawa, Masahiko Ito, Yuko Fujii, Tooru Sugimori
  • Publication number: 20030104129
    Abstract: A compound represented by a general formula (1) ABXn (where A is a carbon-containing group; B is at least one element selected from Si, Ge, Sn, Ti and Zr; X is a hydrolyzable group; and n is 1, 2 or 3), for example, a chlorosilane compound having a fluorocarbon group, is measured in an amount required for one time application, and dropped from a nozzle on a surface of a substrate having an active hydrogen on the surface, and simultaneously it is rubbed with a coater made of a sponge or a nonwoven fabric, etc. Furthermore, it is rubbed with a coater made of a sponge or a nonwoven fabric, etc. while blowing a dry warm air, and an elimination reaction is caused between the active hydrogen on the surface of the substrate and the hydrolyzable group of the compound. Thus, the compound is covalently bonded to the substrate. The molecules of the is silane compound also are polymerized with one another to be fixed.
    Type: Application
    Filed: September 24, 2002
    Publication date: June 5, 2003
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Norihisa Mino, Mitsuo Ebisawa, Yoshiaki Oono, Kazufumi Ogawa
  • Patent number: 6485785
    Abstract: A compound represented by a general formula (1) ABXn (where A is a carbon-containing group; B is at least one element selected from Si, Ge, Sn, Ti and Zr; X is a hydrolyzable group; and n is 1, 2 or 3), for example, a chlorosilane compound having a fluorocarbon group, is measured in an amount required for one time application, and dropped from a nozzle on a surface of a substrate having an active hydrogen on the surface, and simultaneously it is rubbed with a coater made of a sponge or a nonwoven fabric, etc. Furthermore, it is rubbed with a coater made of a sponge or a nonwoven fabric, etc. while blowing a dry warm air, and an elimination reaction is caused between the active hydrogen on the surface of the substrate and the hydrolyzable group of the compound. Thus, the compound is covalently bonded to the substrate. The molecules of the silane compound also are polymerized with one another to be fixed.
    Type: Grant
    Filed: August 10, 2000
    Date of Patent: November 26, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Norihisa Mino, Mitsuo Ebisawa, Yoshiaki Oono, Kazufumi Ogawa
  • Publication number: 20020140323
    Abstract: A polarization apparatus is provided wherein a piezoelectric body tube 3 is wound around a first rotation drum 5 and a second rotation drum 6 and a coaxial flexible piezoelectric body 2 is polarized while the piezoelectric body tube 3 is wound. According to the polarization apparatus, polarization can be conducted except for the coaxial flexible piezoelectric body 2 of the portion containing a defect and a defect existing in the piezoelectric body tube 3 of a given length can also be detected before an outer electrode 4 is formed.
    Type: Application
    Filed: December 12, 2001
    Publication date: October 3, 2002
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Mitsuo Ebisawa, Takeshi Nagai, Narutoshi Kanazawa, Masahiko Ito, Yuko Fujii, Tooru Sugimori
  • Patent number: 6018153
    Abstract: To present an operating apparatus having features including ease of operation, controllability for preventing misoperation, small size, long life, and ease of assembling. The constitution includes a base unit as skeleton of operation unit, a key operation unit (13) having plural switches disposed at the front side of the base unit, a first design sheet (12) disposed at the front side of the key operation unit (13), printing patterns at positions corresponding to each switch, a display device (11) disposed at the front side of the first design sheet (12), having light function elements (11g) for transmitting and shielding the positions corresponding to the patterns on the first design sheet (12), and a second design sheet (10) disposed at the front side of the display device (11), having windows (10b) at positions corresponding to the light function elements.
    Type: Grant
    Filed: January 20, 1998
    Date of Patent: January 25, 2000
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masato Matsuda, Yasuteru Fujii, Takamasa Okutsu, Mitsuo Ebisawa, Masashi Yano
  • Patent number: 4013469
    Abstract: Light-sensitive silver halide photographic materials containing, as an anti-foggant, a compound of the formula ##STR1## wherein R.sub.1, R.sub.2, R.sub.3 and R.sub.4 are individually an aryl or aralkyl group; Z is N, P, As or Sb; and X is an anion. The compositions are particularly suitable for use on polyester supports.
    Type: Grant
    Filed: February 6, 1976
    Date of Patent: March 22, 1977
    Inventors: Teruhide Haga, Koichi Horigome, Mitsuo Ebisawa