Patents by Inventor Mitsuo Maeno

Mitsuo Maeno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonding head and component mounting apparatus
    Patent number: 6561408
    Abstract: There is provided an inclination prevention member for preventing a pressing part from inclining to a supporting part. Therefore a pressing face and a stage face can be arranged to be nearly parallel. The pressing face can be thus disposed with the higher parallelism to the bonding stage as compared with the conventional art, so that components and a circuit form object can be bonded with a high bonding quality.
    Type: Grant
    Filed: January 14, 2002
    Date of Patent: May 13, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Naoto Hosotani, Shuji Ono, Hidenobu Nishikawa, Mitsuo Maeno, Hiroshi Nasu
  • Bonding head and component mounting apparatus
    Publication number: 20020092887
    Abstract: There is provided an inclination prevention member for preventing a pressing part from inclining to a supporting part. Therefore a pressing face and a stage face can be arranged to be nearly parallel. The pressing face can be thus disposed with the higher parallelism to the bonding stage as compared with the conventional art, so that components and a circuit form object can be bonded with a high bonding quality.
    Type: Application
    Filed: January 14, 2002
    Publication date: July 18, 2002
    Inventors: Naoto Hosotani, Shuji Ono, Hidenobu Nishikawa, Mitsuo Maeno, Hiroshi Nasu